JPS625424U - - Google Patents
Info
- Publication number
- JPS625424U JPS625424U JP9554785U JP9554785U JPS625424U JP S625424 U JPS625424 U JP S625424U JP 9554785 U JP9554785 U JP 9554785U JP 9554785 U JP9554785 U JP 9554785U JP S625424 U JPS625424 U JP S625424U
- Authority
- JP
- Japan
- Prior art keywords
- conductor portion
- metal conductor
- substrate
- resin layer
- around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Contacts (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は、本考案の好適な実施例を示す要部断
面図である。第２図は、本考案の好適な実施例に
よるスロツトルバルブセンサの説明図である。
１……基板、２……金属導体部、３……合成樹
脂層、４……カーボン層、５，６，７，８，９…
…摺動接点。
FIG. 1 is a sectional view of essential parts showing a preferred embodiment of the present invention. FIG. 2 is an explanatory diagram of a throttle valve sensor according to a preferred embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Metal conductor part, 3... Synthetic resin layer, 4... Carbon layer, 5, 6, 7, 8, 9...
...Sliding contact.
Claims (1)
配設する金属導体部と、該金属導体部の少くとも
周囲に塗着する合成樹脂層と、前記金属導体部の
パターン幅に対して若干広い幅で金属導体部及び
金属導体部周囲の樹脂層と共に被着するカーボン
層とでなることを特徴とするカーボン被着接点。 A substrate, a metal conductor portion disposed in a predetermined pattern on the surface of the substrate, a synthetic resin layer applied at least around the metal conductor portion, and a pattern width slightly wider than the pattern width of the metal conductor portion. A carbon-covered contact comprising a metal conductor portion and a carbon layer adhered together with a resin layer around the metal conductor portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9554785U JPS625424U (en) | 1985-06-24 | 1985-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9554785U JPS625424U (en) | 1985-06-24 | 1985-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625424U true JPS625424U (en) | 1987-01-13 |
Family
ID=30960205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9554785U Pending JPS625424U (en) | 1985-06-24 | 1985-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625424U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54103580A (en) * | 1978-01-31 | 1979-08-15 | Matsushita Electric Industrial Co Ltd | Printed circuit board with key wiring |
-
1985
- 1985-06-24 JP JP9554785U patent/JPS625424U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54103580A (en) * | 1978-01-31 | 1979-08-15 | Matsushita Electric Industrial Co Ltd | Printed circuit board with key wiring |