JPS6254880B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a holding device for holding an object to be plated, which is used when performing electroplating.

When performing electroplating, a holding device is used to hold a plurality of objects to be plated in order to immerse the objects to be plated into a plating tank and take them out from the plating tank. It is necessary to adapt the shape of the plated object from the viewpoint of workability of supporting the plated object and uniformity of plating thickness.

For example, as a holding device for holding a printed circuit board during electroplating of the printed circuit board, a device having the following structure has conventionally been used.

That is, as shown in FIG. 1, the conventional electroplating holding device holds any arbitrary portion of a horizontal columnar conductive member (so-called movable cathode bar) 1 that is raised, lowered, and horizontally moved by a conveying device (not shown). A rod-shaped conductive member (so-called rack) with a support member 2 at the position
3 is suspended downward by the engaging portion 3a at the upper end thereof, and a plurality of printed boards 4, 4, . . . are held along the longitudinal direction of the conductive member 3 by the support member 2. This is what I did. That is, a plurality of sets of wire-like members 2a and U-shaped members 2b are attached to the conductive member 3 alternately in the longitudinal direction, and the upper side portion 4a abuts the contact portion 5a of the wire-like member 2a, forming a U-shape. With the lower side portion 4b in contact with the two contact portions 5b, 5b of the member 2b, the elasticity of the wire-like member 2a of the printed circuit board 4 allows the wire-like member 2a to be clamped and supported between the two, and in this way, horizontal conduction is achieved. sex member 1
A plurality of conductive members 3, 3, ...... are hung on the
A printed circuit board 4, 4, . . . is supported on each conductive member 3, 3, . Place the printed circuit board 4, 4,...
are immersed in a plating solution, and printed circuit boards 4, 4,
A cathode voltage is applied to . . . through the conductive members 1 and 3 and the support member 2 to perform plating. In FIG. 2, 7 is a plating liquid, and 8 is a gripping portion for conveying the conductive member 1.

However, with this holding device, the dimensions of the printed circuit board 4 that can be clamped and supported are limited by (a) the distance between the wire-like member 2a and the U-shaped member 2b; Depending on the dimensions of the printed circuit board 4, it is necessary to provide a large number of types of conductive members 3 with different distances between the wire-like member 2a and the U-shaped member 2b. Dozens of types of holding devices were prepared.
Therefore, the manufacturing cost of the conductive member (rack) 3 is enormous, its storage is complicated, and furthermore, it is troublesome to select a conductive member 3 that matches the dimensions when attaching the printed circuit board 4.

(b) Since the conductive member (rack) 3 is simply suspended from the conductive member (movable cathode bar) 1 at the engaging portion 3a, it cannot be put into or taken out of the plating bath 6 by a conveyance device, or moved horizontally. When the conductive members 3 are held in place, there is a risk that the conductive members 3 may swing or be misaligned, causing the printed circuit boards 4 to fall off. Unable to process.

(c) In order to hold the printed circuit board 4 along the longitudinal direction of the conductive member 3, a U-shaped member 2b and a wire-shaped member are provided between the two vertically adjacent printed circuit boards 4 held. 2a, and therefore the interval between adjacent printed circuit boards cannot be made very small. Therefore, the number of printed circuit boards 4 to be attached is reduced, making it impossible to efficiently process a large amount of them, and since the spacing becomes large, current concentrates at the ends of each printed circuit board 4, resulting in non-uniform plating thickness.

There were drawbacks such as:

The present invention provides a holding device for electroplating that overcomes these drawbacks, and embodiments of the present invention will be described below with reference to the drawings.

3 to 8 show an embodiment of an electroplating holding device used for holding a printed circuit board according to the present invention.

In the figure, reference numeral 11 denotes a first conductive member (moving cathode bar), which has a horizontal columnar shape with a rectangular cross section, and is held in a horizontal state by gripping parts 12, 12 protruding from the upper surface of both ends. Conveying device (not shown)
A bifurcated conductive rod 13, 1 is conveyed vertically and horizontally and protrudes longitudinally from both ends.
3, it is removably placed on the upper part of the plating tank or unloading section.

A second conductive member (rack) 14 is removably and slidably suspended from the first conductive member 11 in an electrically connected manner.

The second conductive member 14 includes an engaging portion 15 bent in a U-shape to fit the first conductive member 11, and a rod-shaped portion 16 joined to the engaging portion 15. Consists of. The engaging portion 15 can be fixed at any position on the first conductive member 11 using a fastener 15a. In addition, the rod-shaped portion 16 includes two types of support members 17 that support the printed circuit board 4 protruding in a direction perpendicular to the longitudinal direction of the first conductive member 11 and supply current thereto, and an elastic support member 17 for supporting the printed circuit board 4 and supplying current. The members 18 are attached alternately at predetermined intervals. As shown in FIG. 5, the contacts 17a and 18a at the tips of the supporting members 17 and 18 are located on opposite sides, and the supporting member 18 is given elasticity to press the printed circuit board 4 in the direction toward the contact 18a. ing.

Note that the second conductive member 14 is a support member 17,1
8 except for the contacts 17a and 18a are covered with an insulator to prevent electroplating.

Below the first conductive member 11, the outermost printed circuit board 4 of a plurality of printed circuit boards 4, 4, . . . , 4, . . . A shield frame for preventing the plating thickness from becoming excessively thick due to concentration of current in the portions 4, 4, . 20 are provided. That is, as shown in FIGS. 6 and 8, the shield frame 20 has left and right vertical side walls 20a, 20a and a horizontal wall so as to surround the space in which the printed circuit boards 4, 4, . . . are arranged from the top, bottom, left and right. Upper wall portion 20b
, a horizontal lower wall portion 20c, and left and right side wall portions 20.
Attachment portions 20d, 20d bent at right angles from the upper extension portions of a, 20a, and side wall portions 20a, 20a.
It has edges 20e, 20e orthogonal to the upper wall 20b and the lower wall 20c, and has mounting parts 20d, 20.
d are attached to the lower surface of both ends of the first conductive member 11. The edges 20e, 20e are made wider at their corner portions 20e', 20e', . . . . This shield frame 20 is made of an insulating material, or if it is made of metal, its surface is covered with an insulating material. Note that each wall portion 20a~
20c is provided with a window 20f.

On the upper surface side of the lower wall portion 20c of the shield frame 20, a plurality of engagement holes 21, 21, .
A positioning member 22 in which ... is bored along the longitudinal direction is fixed. This positioning member 22 connects the lower ends of the second conductive members 14, 14, .
21, . . . to position the second conductive members 14, 14, .

Note that if the upper part of the engagement hole 21 is formed into a tapered shape, and a conical taper pin 19 that fits the tapered part of the upper part of the engagement hole 21 is attached to the lower end of the second conductive member 14, the second conductive member 1
The engagement with the lower end of 4 becomes easier and more reliable. This taper pin 19 is made of an insulating material to prevent adhesion of plating.

In such a configuration, in order to attach the printed circuit board 4, first a plurality of second conductive members 1 are attached.
4, 14, . are engaged with the engagement holes 21, 21 of the positioning member 22 attached to the lower wall portion 20c of the shield frame 20, and then the upper end fastener 15a
The positions of the second conductive members 14, 14 are fixed by. Since the engagement hole 21 is formed with a conical countersink, the taper pin 19 slides into the center of the engagement hole 21 and engages accurately. Then, one of the right and left sides of the printed circuit board 14 is brought into contact with the contact 18a of the support contact part 18 of the second conductive member 14, and pressed against the elasticity of the support contact part 18, and the other side is pressed against the contact point 18a of the support contact part 18 of the second conductive member 14. Contact point 17a of support member 17 of conductive member 14
two adjacent second conductive members 1 in contact with
A printed circuit board 4 is clamped and supported on both left and right sides between 4 and 14. In this way, the first conductive member 11 is connected to a large number of printed circuit boards 4, 4, .
After the first conductive member 11 is attached by the pressing force of the support contact 18a in the longitudinal direction, the first conductive member 11 is conveyed by a conveying device, and the printed circuit board 4 is placed in the plating solution 7 of the plating bath 6 as shown in FIG. 4. Soak the... The printed circuit boards 4, 4, . . . have a rod 13, a first conductive member 11, a second conductive member 14, and a support member 1.
A negative voltage is applied via 7 and 18 to perform electroplating. At this time, the shield frame 20 prevents the concentration of current on the outer printed circuit boards 4, 4, . . . among the plurality of printed circuit boards 4, 4, . FIG. 10 shows the experimental results of the plating thickness distribution at each position of the arranged printed circuit boards 4, 4, . . . when the shield frame 20 is used and when the shield frame 20 is not used. There is. In the same figure, A on the horizontal axis
indicates the outermost point, G indicates the center point, and the vertical axis indicates the plating thickness. From this experimental result, shield frame 2
It is confirmed that the non-uniformity of plating thickness is significantly corrected by using 0.

Note that when the first conductive member 11 is moved up and down in the plating tank 6 by the transport device, the window 20 of the shield frame 20
f, Plating liquid 7 is applied to the engagement hole 21 of the positioning member 22.
penetrates.

In the above embodiment, only the case of holding a printed circuit board was described, but it goes without saying that the plated member for holding can be used to hold other things besides the printed circuit board.

Further, as shown in FIG. 11, the first conductive member 1
1 is also provided with positioning recesses 24, 24, . It is also possible to provide positioning even at the upper end.

The holding device for electroplating of the present invention (a) can hold members to be plated with various dimensions by changing the distance between the adjacent second conductive members 14, 14, so that it is possible to hold members having different dimensions. In this way, it is no longer necessary to prepare a wide variety of second conductive members corresponding to the dimensions of the member to be fitted, and at least one type is required, and the second conductive member 14
The manufacturing cost can be reduced, and the storage becomes easy.

(b) Since the plated members are held on both sides of the second conductive member 14, and there is no support member etc. between two vertically adjacent plated members, it is possible to Since multiple parts to be plated can be closely arranged and maintained with narrow intervals, a large number of parts to be plated can be plated, improving work efficiency and reducing defects in plating thickness that occur when the spacing becomes large. Can prevent uniformity.

(c) The second conductive member 14 is the first conductive member 1
Since the upper and lower ends of the plating tank 1 are positioned and fixed, it is possible to prevent the members from swinging when they are taken in and out of the plating tank 6 or when transported in the horizontal direction. can be held.

(d) By using the shield member 20, a uniform plating thickness can be applied to the entire plated members arranged in large numbers.

(e) As shown in Fig. 3a and b, in order to hold the covered object 4 between the upper and lower parts of the two opposing sides, 1
Two overlays 4 on both sides of the rod-shaped portion 16 of the book,
4 can be attached, so a large amount of covered objects can be processed at once.

[Brief explanation of the drawing]

1 and 2 are diagrams explaining a conventional electroplating holding device, FIG. 3 is a diagram showing a state in which a second conductive member is fixed to a first conductive member, and FIG. 5 is a front view of the second conductive member, FIG. 6 is a front view of the second conductive member fixed at the upper and lower ends, and FIG. 7 is a positioning member. Fig. 8 is a partial perspective view showing the shield frame, Fig. 9 is a front view showing the printed circuit board attached, and Fig. 10 is a plan view with and without the shield frame. FIG. 11 is a graph showing the thickness distribution of the first conductive member, and is a diagram showing a case where a recess for positioning is provided in the first conductive member so that positioning can be performed at the upper end of the second conductive member. DESCRIPTION OF SYMBOLS 11...First conductive member, 14...Second conductive member, 15...Engaging part, 15a...Tightening part,
16... Rod-shaped portion, 17... Support member, 17a...
Contact, 18... Elastic support member, 18a... Contact,
19...Taper pin, 20...Shield frame, 2
1... Engagement hole, 22... Positioning member.

Claims (1)

[Scope of Claims] 1. A first conductive member 11 that is removably placed horizontally across the upper part of the plating bath, and a first conductive member that is electrically connected to the first conductive member 11 and that is removable. an engaging portion 15 that can be engaged;
An engaging portion 15 is provided vertically downward from the engaging portion 15.
a rod-shaped portion 16 electrically connected to the rod-shaped portion 1;
electrically connected support members 17 protruding horizontally and having clamping contacts 17a on one side and horizontally protruding and having clamping contacts 18a on the opposite side, provided alternately in the vertical direction on 6; a plurality of second conductive members 14 including an elastic support member 18 having an elastic return force toward the side; and the engaging portions 15 of each of the second conductive members 14.
a shield frame provided below the first conductive member so as to surround a movable area of the second conductive member; Adjusting the spacing between the plurality of second conductive members and fixing the engaging portion 15 and the first conductive member 11 by the positioning means, One of the supporting members 1 of the conductive member 14 of
The upper and lower parts of two opposing sides of a rectangular object to be mated are pressed and clamped between the clamping contacts 17a of No. 7 and the clamping contacts 18a of one of the elastic support members 18. Holding device for electroplating. 2. A first conductive member 11 that is removably placed across the upper part of the plating bath horizontally; and a first conductive member 11 that is electrically connected to and removably engaged with the first conductive member 11. An engaging portion 15;
An engaging portion 15 is provided vertically downward from the engaging portion 15.
a rod-shaped portion 16 electrically connected to the rod-shaped portion 1;
electrically connected support members 17 protruding horizontally and having clamping contacts 17a on one side and horizontally protruding and having clamping contacts 18a on the opposite side, provided alternately in the vertical direction on 6; a plurality of second conductive members 14 having an elastic support member 18 having an elastic return force toward the side; a positioning member 22 for positioning the lower end of each of the rod-shaped portions 16; a shield frame provided below so as to surround a movable area of the second conductive member, and adjusts the interval between the plurality of second conductive members so that the positioning member 22 The lower end of the rod-shaped part 16 of the conductive member 11 is fixed, and the clamping contact 17a of one of the support members 17 of the two adjacent second conductive members 14 and the contact point 17a of one of the elastic support members 18 are fixed. A holding device for electroplating characterized in that the upper and lower parts of two opposing sides of a rectangular object to be plated are pressed and held between the holding device and the holding contact 18a.