JPS625632U - - Google Patents
Info
- Publication number
- JPS625632U JPS625632U JP1985096987U JP9698785U JPS625632U JP S625632 U JPS625632 U JP S625632U JP 1985096987 U JP1985096987 U JP 1985096987U JP 9698785 U JP9698785 U JP 9698785U JP S625632 U JPS625632 U JP S625632U
- Authority
- JP
- Japan
- Prior art keywords
- band plate
- lead wires
- fixed
- view
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図は第１図の―線に沿う拡大断面図、第３図
は第１図のチエーンリード構体を使つて製造した
電子部品連の正面図、第４図は本考案の他の実施
例を示す正面図、第５図は第４図の―線に沿
う拡大断面図である。第６図は従来のチエーンリ
ード構体の正面図、第７図は第６図の―線に
沿う拡大断面図、第８図乃至第１０図は第６図の
チエーンリード構体使用による電子部品製造工程
を説明するための各工程での正面図である。
Ａ，Ｂ……チエーンリード構体、１２……帯板
、１３……リード線、１４，１７……絶縁材。
Figure 1 is a front view showing one embodiment of the present invention;
The figure is an enlarged sectional view taken along the line - in Figure 1, Figure 3 is a front view of an electronic component series manufactured using the chain lead structure of Figure 1, and Figure 4 shows another embodiment of the present invention. The front view and FIG. 5 are enlarged sectional views taken along the line --- in FIG. 4. Fig. 6 is a front view of a conventional chain lead structure, Fig. 7 is an enlarged sectional view taken along the - line of Fig. 6, and Figs. 8 to 10 are electronic component manufacturing processes using the chain lead structure of Fig. 6. It is a front view in each process for demonstrating. A, B...Chain lead structure, 12... Band plate, 13... Lead wire, 14, 17... Insulating material.
Claims (1)
部を固定したものにおいて、前記帯板のリード線
との接触部分及び／又はリード線の帯板に固定さ
れる一端部の表面を絶縁材にて被覆したことを特
徴とするチエーンリード構体。 In a device in which one ends of a plurality of lead wires are fixed to an insulating band plate at predetermined intervals, the contact portion of the band plate with the lead wires and/or the surface of the one end portion of the lead wires fixed to the band plate is covered with an insulating material. A chain lead structure characterized by being coated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985096987U JPH0351968Y2 (en) | 1985-06-25 | 1985-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985096987U JPH0351968Y2 (en) | 1985-06-25 | 1985-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625632U true JPS625632U (en) | 1987-01-14 |
| JPH0351968Y2 JPH0351968Y2 (en) | 1991-11-08 |
Family
ID=30963416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985096987U Expired JPH0351968Y2 (en) | 1985-06-25 | 1985-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351968Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354765A (en) * | 1976-10-27 | 1978-05-18 | Nippon Electric Co | Method of manufacturing electronic parts |
| JPS6052618U (en) * | 1983-09-16 | 1985-04-13 | 関西日本電気株式会社 | Chain lead structure for electronic components |
-
1985
- 1985-06-25 JP JP1985096987U patent/JPH0351968Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354765A (en) * | 1976-10-27 | 1978-05-18 | Nippon Electric Co | Method of manufacturing electronic parts |
| JPS6052618U (en) * | 1983-09-16 | 1985-04-13 | 関西日本電気株式会社 | Chain lead structure for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351968Y2 (en) | 1991-11-08 |