JPS6257461B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for polishing the inner surface of a die used when forming a wire, bar, tube, etc. to a predetermined outer diameter.

Conventionally, to polish a die with a circular hole, the die is mounted on a chuck and rotated, a polishing rod with a conical tip is pressed against it, and the polishing rod is slid back and forth, left and right, up and down, etc. as appropriate. However, this method has drawbacks such as requiring the dies to be attached and removed from the chuck one by one and requiring skill in sliding the polishing rod.

This invention was made in view of the above, and its purpose is to provide a polishing device that can be automated by simplifying the mechanism for attaching and detaching dies, the mechanism for relative movement with the polishing rod, etc. be.

According to the present invention, such an object is to tilt the die receiving surface of the rotary head relative to the rotation axis of the rotary head that receives and rotates the die to be polished pushed by the polishing rod. This can be achieved by swinging the die to be polished relative to the polishing rod.

This will be explained with reference to the accompanying drawings. The apparatus consists of a rotating head 1 arranged horizontally and a polishing rod arranged so as to be movable back and forth along the extension of the axis of the rotating head.

The rotary head 1 has a disk 3 provided at the tip of a tubular shaft 2. The shaft 2 is partially supported by a bearing and connected to a motor via a belt, chain, gear, or the like.

The die receiving surface 4 side of the disk 3 is inclined with respect to the axis of rotation, and a rubber plate 5 of uniform thickness is stretched on the surface to increase the coefficient of friction.

Instead of providing an inclination to the disc 3, the rubber plate 5 may be provided with an incline. According to experiments conducted by the inventors, good results were obtained when the inclination θ of the die receiving surface with respect to the rotational axis was approximately 2 degrees for a die having a bearing portion diameter of 10 to 30 φ.

A polishing rod 7 facing the rotary head 1 has a conical tip, and its rear end is removably attached to a socket 8 connected to an air cylinder 10 via a spring 9.

Dice polishing using the apparatus configured as described above is performed as follows.

For example, the die 6 to be polished is carried in front of the rotary head 1 using a walking beam, and then the air cylinder 10 is operated to move the polishing rod 7 forward.

As a result, the die 6 is pressed against the surface of the rotary head 1 with a predetermined pressure.

Next, after lowering the walking beam, the rotating head 1 is rotated. When rotation is applied to the head 1, the die 6 rotates because the friction with the rotating head 1 overcomes that of the polishing rod 7, but the axis of the die 6 is relative to the axis of the rotating head 1 and the polishing rod 7. Since it is tilted, it oscillates and rotates, and the polishing rod 7
It will be polished automatically in the same way as when you operated it.

As the die 6 swings and rotates, the polishing rod 7
moves back and forth, but the impact can be absorbed by the spring 9.

It should be noted that, in addition to the felt 11, an abrasive such as diamond abrasive grains is applied or injected into the polishing portion, as in the prior art.

When the polishing of the die 6 is completed, the rotation of the head 1 is stopped and the cylinder 10 is activated to move the polishing rod 7 backward, so that the die 6 can be easily replaced with the next one.

This replacement involves raising the aforementioned walking beam when the head 1 is stopped, and after the polishing rod 7 has retreated, the walking beam is moved to carry out the polished die and carry in the next die. This can be done by

As is clear from the above description, according to the present invention, the die support is made into an inclined surface, and the die is supported and oscillated by this and the polishing rod, so that the structure of the device itself is simplified. This has the advantage that it can be easily automated by combining it with a walking beam, etc., and its practical value is extremely large.

[Brief explanation of the drawing]

The figure is an explanatory diagram showing an example of a device according to the present invention. 1: Rotating head, 4: Die receiving surface, 5: Rubber plate, 7: Polishing rod, 9: Spring, 10: Air cylinder, 11: Felt.

Claims (1)

[Scope of Claims] 1. A rotary head having a die receiving surface inclined with respect to a rotation axis, and a polishing rod capable of advancing toward the rotating head and pressing a die to be polished against the die receiving surface. A die polishing apparatus comprising: a die polishing apparatus, wherein the die is rotated by friction with the receiving surface by rotating the rotary head. 2. The device according to claim 1, wherein the die receiving surface is made of a material with a large coefficient of friction. 3. The apparatus according to claim 1 or 2, wherein the axis of the polishing rod is on the axis of the rotating head. 4. The apparatus according to claims 1 to 3, wherein the axes of the polishing rod and the rotary head are arranged in a horizontal direction. 5. The apparatus according to claims 1 to 4, wherein the polishing rod is connected to a back-and-forth drive means via a spring.