JPS6258043U - - Google Patents
Info
- Publication number
- JPS6258043U JPS6258043U JP15033585U JP15033585U JPS6258043U JP S6258043 U JPS6258043 U JP S6258043U JP 15033585 U JP15033585 U JP 15033585U JP 15033585 U JP15033585 U JP 15033585U JP S6258043 U JPS6258043 U JP S6258043U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- semiconductor wafer
- recording medium
- attaching
- peripheral edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 4
Description
第１図及び第２図は本考案に係る粘着シートの
一実施例を示す半導体ウエーハ貼着時での平面図
及び正面図、第３図及び第４図は第１図の粘着シ
ートを使つた半導体ペレツト特性検査装置及び半
導体ペレツトピツクアツプ装置の概略側面図であ
る。第５図及び第６図は従来の粘着シートを使つ
た半導体ペレツト特性検査装置及び半導体ペレツ
トピツクアツプ装置の概略側面図である。
２……半導体ウエーハ、９……粘着シート、１
０……情報記録媒体。
1 and 2 are a plan view and a front view showing an embodiment of the adhesive sheet according to the present invention when it is attached to a semiconductor wafer, and FIGS. 3 and 4 are views showing an example of the adhesive sheet of the present invention when the adhesive sheet of FIG. 1 is used. 1 is a schematic side view of a semiconductor pellet characteristic testing device and a semiconductor pellet pickup device; FIG. 5 and 6 are schematic side views of a semiconductor pellet characteristic testing device and a semiconductor pellet pickup device using a conventional adhesive sheet. 2...Semiconductor wafer, 9...Adhesive sheet, 1
0... Information recording medium.
Claims (1)
、周縁部に半導体ウエーハが含む複数の素子の個
々の情報を記録する情報記録媒体を一体に付設し
たことを特徴とする貼着シート。 1. An adhesive sheet for attaching a semiconductor wafer, characterized in that an information recording medium for recording individual information of a plurality of elements included in the semiconductor wafer is integrally attached to the peripheral edge of the adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15033585U JPS6258043U (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15033585U JPS6258043U (en) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258043U true JPS6258043U (en) | 1987-04-10 |
Family
ID=31066384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15033585U Pending JPS6258043U (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258043U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5966140A (en) * | 1982-10-08 | 1984-04-14 | Hitachi Ltd | Corresponding method of wafer to probe information |
-
1985
- 1985-09-30 JP JP15033585U patent/JPS6258043U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5966140A (en) * | 1982-10-08 | 1984-04-14 | Hitachi Ltd | Corresponding method of wafer to probe information |
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