JPS6258547B2 - - Google Patents

Info

Publication number
JPS6258547B2
JPS6258547B2 JP55178886A JP17888680A JPS6258547B2 JP S6258547 B2 JPS6258547 B2 JP S6258547B2 JP 55178886 A JP55178886 A JP 55178886A JP 17888680 A JP17888680 A JP 17888680A JP S6258547 B2 JPS6258547 B2 JP S6258547B2
Authority
JP
Japan
Prior art keywords
fins
cooling device
fin
cooling path
boiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55178886A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57103338A (en
Inventor
Takahiro Ooguro
Noryuki Ashiwake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55178886A priority Critical patent/JPS57103338A/ja
Publication of JPS57103338A publication Critical patent/JPS57103338A/ja
Publication of JPS6258547B2 publication Critical patent/JPS6258547B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55178886A 1980-12-19 1980-12-19 Boiling cooling device Granted JPS57103338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55178886A JPS57103338A (en) 1980-12-19 1980-12-19 Boiling cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55178886A JPS57103338A (en) 1980-12-19 1980-12-19 Boiling cooling device

Publications (2)

Publication Number Publication Date
JPS57103338A JPS57103338A (en) 1982-06-26
JPS6258547B2 true JPS6258547B2 (de) 1987-12-07

Family

ID=16056412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55178886A Granted JPS57103338A (en) 1980-12-19 1980-12-19 Boiling cooling device

Country Status (1)

Country Link
JP (1) JPS57103338A (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59232448A (ja) * 1983-06-16 1984-12-27 Fujitsu Ltd 液冷容器
JPS60761A (ja) * 1983-06-17 1985-01-05 Fujitsu Ltd 液冷モジユ−ル
JPS60254700A (ja) * 1984-05-31 1985-12-16 富士通株式会社 冷却液浸漬回路基板
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
JPH0727637Y2 (ja) * 1989-12-22 1995-06-21 富士通株式会社 浸漬冷却構造
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
KR100461721B1 (ko) * 2002-05-27 2004-12-14 삼성전기주식회사 리드 방열 세라믹 패키지
DE102014213108B3 (de) * 2014-07-07 2015-11-05 Robert Bosch Gmbh Leistungsmodul mit Fluidkühlung

Also Published As

Publication number Publication date
JPS57103338A (en) 1982-06-26

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