JPS6260042U - - Google Patents

Info

Publication number
JPS6260042U
JPS6260042U JP1985151036U JP15103685U JPS6260042U JP S6260042 U JPS6260042 U JP S6260042U JP 1985151036 U JP1985151036 U JP 1985151036U JP 15103685 U JP15103685 U JP 15103685U JP S6260042 U JPS6260042 U JP S6260042U
Authority
JP
Japan
Prior art keywords
heat
container
conductor
cooling module
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985151036U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985151036U priority Critical patent/JPS6260042U/ja
Publication of JPS6260042U publication Critical patent/JPS6260042U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Description

【図面の簡単な説明】
第1図は本考案の一実施例で、容器の基体部分
に冷却モジユールを取りつけた状況を示す断面図
である。 1……ケース、2……半導体素子、5……絶縁
体、6……吸装導体、7,8……N形・P形半導
体部材(冷却用)、9,10……放熱導体、11
,12……ピン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 熱電冷却作用を有する、少なくとも1対以上の
    N形・P形半導体部材の組に、吸熱導体・放熱導
    体を接続した冷却モジユールを容器に収容し、前
    記吸熱導体上に絶縁体を介して半導体素子を接触
    し、前記放熱導体を容器壁面に接して配置すると
    ともに、前記冷却モジユールの電流が容器のピン
    を介して印加されることを特徴とする冷却モジユ
    ール内蔵の半導体装置。
JP1985151036U 1985-10-01 1985-10-01 Pending JPS6260042U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985151036U JPS6260042U (ja) 1985-10-01 1985-10-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985151036U JPS6260042U (ja) 1985-10-01 1985-10-01

Publications (1)

Publication Number Publication Date
JPS6260042U true JPS6260042U (ja) 1987-04-14

Family

ID=31067730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985151036U Pending JPS6260042U (ja) 1985-10-01 1985-10-01

Country Status (1)

Country Link
JP (1) JPS6260042U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100714A (ja) * 2000-09-21 2002-04-05 Ibiden Co Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100714A (ja) * 2000-09-21 2002-04-05 Ibiden Co Ltd 半導体装置

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