JPS6260257U - - Google Patents
Info
- Publication number
- JPS6260257U JPS6260257U JP15268685U JP15268685U JPS6260257U JP S6260257 U JPS6260257 U JP S6260257U JP 15268685 U JP15268685 U JP 15268685U JP 15268685 U JP15268685 U JP 15268685U JP S6260257 U JPS6260257 U JP S6260257U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating liquid
- plating tank
- overflow
- weir plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 6
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Control Of Non-Electrical Variables (AREA)
Description
第１図は本考案に係る液面制御装置の一例を示
す縦断面図、第２図は第１図の装置の中央部を縦
断した一部断面図、第３図はせき板を支持するた
めのフレームを除いた状態の一部平面図である。
図中主要符号の説明、１はメツキ槽、１１は側
壁、１３は材料通過部、１４は立上り部、３はせ
き板、３０はオーバーフロー部、３１は溝状のガ
イド、３２は吊ボルト、３３は支持フレーム、３
５はナツト、ａはフープ状材料、ｂはメツキ液面
レベルである。
Fig. 1 is a vertical sectional view showing an example of a liquid level control device according to the present invention, Fig. 2 is a partial sectional view taken longitudinally through the center of the device shown in Fig. 1, and Fig. 3 is a vertical sectional view showing an example of a liquid level control device according to the present invention. FIG. 3 is a partial plan view with the frame removed. Explanation of main symbols in the figure: 1 is the plating tank, 11 is the side wall, 13 is the material passage part, 14 is the rising part, 3 is the weir plate, 30 is the overflow part, 31 is the groove-shaped guide, 32 is the hanging bolt, 33 is the support frame, 3
5 is a nut, a is a hoop-shaped material, and b is a plating liquid level.
Claims (1)
メツキ槽内を通過させ、メツキ槽内にメツキ液を
供給しながら主として前記フープ状材料の通過方
向に沿う側壁より前記メツキ液をオーバーフロー
させることにより、フープ状材料の通過姿勢にお
ける所要の部分をメツキ液に浸すように構成され
たメツキ槽において、メツキ液をオーバーフロー
させる前記側壁へ接してスライド可能なせき板を
取りつけ、該せき板へ略水平方向にメツキ液のオ
ーバーフロー部を設け、前記せき板をスライドさ
せて前記オーバーフロー部のレベルを調整するご
とく構成したことを特徴とするメツキ槽における
メツキ液面制御装置。 (2) メツキ液をメツキ槽におけるフープ状材料
の通過方向に沿う両側壁よりオーバーフローさせ
る、実用新案登録請求の範囲第１項に記載のメツ
キ槽におけるメツキ液面制御装置。 (3) 側壁の両端部分の一方の面へ相対向した溝
状のガイドを垂直方向に設け、前記溝状のガイド
へせき板の両端を案内させ、該せき板に吊ボルト
を固定し、該吊ボルトを上方へ設けられた支持フ
レームに形成された孔に通して該支持フレームの
上方へ突出させ、この突出した部分にナツトをね
じ合せた、実用新案登録請求の範囲第１項に記載
のメツキ槽におけるメツキ液面制御装置。 (4) せき板のオーバーフロー部が水平方向へ形
成されたスリツトである、実用新案登録請求の範
囲第１項に記載のメツキ槽におけるメツキ液面制
御装置。[Claims for Utility Model Registration] (1) A hoop-shaped material to be plated is passed through a plating tank in a substantially horizontal state, and while a plating liquid is supplied into the plating tank, a side wall mainly extends along the passing direction of the hoop-shaped material. In a plating tank configured to immerse a required portion of the hoop-shaped material in the plating liquid in a passing posture by causing the plating liquid to overflow, a weir plate that is slidable in contact with the side wall where the plating liquid overflows is provided. A plating liquid level control device in a plating tank, characterized in that an overflow part of the plating liquid is provided in the weir plate in a substantially horizontal direction, and the level of the overflow part is adjusted by sliding the weir plate. (2) A plating liquid level control device in a plating tank according to claim 1, which causes the plating liquid to overflow from both side walls along the passage direction of the hoop-shaped material in the plating tank. (3) Provide groove-shaped guides facing each other in the vertical direction on one surface of both end portions of the side wall, guide both ends of the weir plate to the groove-shaped guide, fix hanging bolts to the shear plate, and A utility model according to claim 1, wherein a hanging bolt is passed through a hole formed in a support frame provided upward and projects upward from the support frame, and a nut is screwed into this projecting part. A plating liquid level control device in a plating tank. (4) The plating liquid level control device in a plating tank according to claim 1 of the utility model registration claim, wherein the overflow portion of the weir plate is a slit formed in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15268685U JPS6348689Y2 (en) | 1985-10-06 | 1985-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15268685U JPS6348689Y2 (en) | 1985-10-06 | 1985-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6260257U true JPS6260257U (en) | 1987-04-14 |
| JPS6348689Y2 JPS6348689Y2 (en) | 1988-12-14 |
Family
ID=31070887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15268685U Expired JPS6348689Y2 (en) | 1985-10-06 | 1985-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6348689Y2 (en) |
-
1985
- 1985-10-06 JP JP15268685U patent/JPS6348689Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6348689Y2 (en) | 1988-12-14 |
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