JPS627264B2 - - Google Patents

Info

Publication number
JPS627264B2
JPS627264B2 JP53050544A JP5054478A JPS627264B2 JP S627264 B2 JPS627264 B2 JP S627264B2 JP 53050544 A JP53050544 A JP 53050544A JP 5054478 A JP5054478 A JP 5054478A JP S627264 B2 JPS627264 B2 JP S627264B2
Authority
JP
Japan
Prior art keywords
present
polymer film
film
evaporation source
vapor flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53050544A
Other languages
Japanese (ja)
Other versions
JPS54141391A (en
Inventor
Koichi Shinohara
Toshiaki Kunieda
Hisao Matsura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5054478A priority Critical patent/JPS54141391A/en
Publication of JPS54141391A publication Critical patent/JPS54141391A/en
Publication of JPS627264B2 publication Critical patent/JPS627264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Physical Vapour Deposition (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は、高分子フイルム表面の金属化に関す
る金属化フイルムの製造方法に係り、表面が滑ら
かな高分子フイルムの表面を金属化するのに、表
面の滑らかさを保持した状態で実施でき、かつ優
れた付着性を得ることができる方法でさらに詳し
くは、真空蒸着の改良に関するものである。 絶縁材料表面の金属化に対する要望はよくある
が絶縁材料表面を粗さずに強固に金属層を付着さ
せるには困難が伴う。しかし、磁性材料を付着さ
せて、磁気記録媒体を製造する場合、滑らかな表
面を維持することは重要である。よく用いられる
ポリエチレンテレフタレート二軸延伸フイルム上
に金属層を付着させることで磁気テープを製造す
る方法として、湿式メツキ法、真空蒸着法並びに
これらの併用法が知られているが、滑らかなフイ
ルムになると満足できる付着強度を得ることが難
かしい。この解決のため、付着強化層を塗布する
ことや、公知のグロー放電処理、コロナ処理等と
の組み合わせが提唱されているが、磁気ヘツドと
摺動して用い、記録、再生する現状の機器に適用
し、耐用性を発揮するに重要なのは、セロテープ
剥離強度よりむしろ、ひつかき強度でありこの改
善には前記した前処理では不充分である。 本発明は蒸着技術の改良により、かかる問題解
決をはかるもので、本発明を実施するための装置
の一例を第1図に、遮断用の重要性を示す一例を
第2図に示し、実施例に沿つて詳しく説明する。
金属化したい高分子フイルム1を真空槽4内に、
蒸発源2と対向配設する。この高分子フイルム1
は、円筒状回転キヤン3(直径50cm)の周側面に
沿つて移動するよう配設される。矢印の向きに移
動する場合、7は捲き出し軸、8は捲き取り軸を
模式的に示している。第1図は本発明に必要な要
素を説明するに最低限の構成図であり、本発明の
金属化フイルムの製造に続いて、例えば、Co、
Fe、Ni又はそれらの合金等の強磁性材料を連続
して蒸着することで、磁気記録媒体を得ることが
できるし、他の用途に供することもできるのは勿
論でありそれぞれ適応性の高い装置が設計される
べきであり、ここでは説明を省略する。 蒸発源2の種類、形状について制約はないが、
工業的に最も優れた蒸発源は電子ビーム加熱方式
であるといえるので、以下の実施例はほとんど電
子ビーム加熱方式を用いた(16Kw、270度偏向
型)。尚、蒸発源2は円筒状回転キヤン3の直下
30cmに配設した。但し第1図で示す蒸発源2は抵
抗加熱方式を模式的に示してあり、10が加熱用
電源であり、11は絶縁導入端子である。6は遮
断板で9は防着板である。真空槽4内は、真空排
気系5により、連続して排気される。 蒸発源2より放射される金属蒸気流の向う向き
と、高分子フイルム1の移動する向きとが対向す
る側での最大入射角(図でθで示される角度)に
許容限界があるという新実験事実に本発明は基ず
くものである。 この角度は、材料依存性は殆んどみられず、又
蒸着速度も数10μ/minの大きさまでも目立つた
依存性はない。本発明は最大入射角を60゜以上遮
断すればよいことを示しているが、蒸着条件、蒸
着仕様、基材となる高分子フイルム1の耐熱性な
どを勘案して、効率の許す限り60゜以下まで遮断
してもよいし、工業的にはその方がむしろ安定性
に優れ、蒸着装置のジオメトリーにもよるが40゜
くらいまで遮断するのが多くの場合適当である。 金属蒸気流の入射角の60゜以上の成分を遮断す
ればよいことについては、円筒状回転キヤン3の
大きさを直径30cm、1m、1.2mとしても確認
し、蒸発源位置を円筒状回転キヤンから15cm〜50
cmの範囲で変化させ、蒸発源中心軸を円筒状回転
キヤン中心軸からずらした場合においても確認さ
れた。 上記したように、通常生産規模で実施される範
囲では、円筒状回転キヤンに沿つて入射角が刻々
と変化して、柱状結晶がわん曲した成長を行う。
(90度から60度まで)は結晶が細くなるのと、90
度近くの場合は全反射する金属粒子もあるため、
不安定で、ひつかき応力がかかつた時に高分子フ
イルムからとれ易くなる。 この部分を遮断することで、高分子フイルムと
のウアンデアワールス力も増加するとともに、結
晶粒子間の隙間が小さくなり、隣り合う粒子間で
の移動が起こりにくくなり、ひつかきに対して強
くなると考えられる。 本発明は、前述した60゜以上の遮断以外の遮断
を妨げるものではなく、別目的での遮断は勿論可
能であり、本発明の効果に一次的影響はもたな
い。 尚、公知の前処理と併用することも当然考えら
れ、いくつかの実施例で確認したがやはり本発明
の効果に二次的影響を有すること、又本発明をイ
オンプレーテイングに適用することも同様な影響
を有することが判明し、本発明のひつかき強度改
善の効果程直接的ではなかつた。 次に具体的な実施例を下表に示す。
The present invention relates to a method for producing a metallized film relating to metallization of the surface of a polymer film, and is capable of metallizing the surface of a polymer film having a smooth surface while maintaining the smoothness of the surface. More specifically, the method by which superior adhesion can be obtained relates to improvements in vacuum deposition. Although there is a common desire to metallize the surface of an insulating material, it is difficult to firmly attach a metal layer to the surface of the insulating material without roughening it. However, when depositing magnetic materials to produce magnetic recording media, it is important to maintain a smooth surface. The wet plating method, vacuum evaporation method, and a combination of these methods are known as methods for manufacturing magnetic tape by attaching a metal layer onto a commonly used biaxially stretched polyethylene terephthalate film, but it is difficult to obtain a smooth film. It is difficult to obtain satisfactory adhesion strength. To solve this problem, it has been proposed to apply an adhesion reinforcing layer or to combine it with known glow discharge treatment, corona treatment, etc., but current devices that record and play by sliding on a magnetic head have been proposed. What is important for application and durability is the scratch strength rather than the Sellotape peel strength, and the above-mentioned pretreatment is insufficient to improve this. The present invention aims to solve such problems by improving vapor deposition technology. An example of an apparatus for carrying out the present invention is shown in FIG. 1, and an example showing the importance of blocking is shown in FIG. This will be explained in detail.
A polymer film 1 to be metallized is placed in a vacuum chamber 4.
It is arranged opposite to the evaporation source 2. This polymer film 1
is arranged so as to move along the circumferential side of the cylindrical rotating can 3 (diameter 50 cm). When moving in the direction of the arrow, 7 schematically indicates a winding shaft and 8 schematically indicates a winding shaft. FIG. 1 is a minimum configuration diagram for explaining the elements necessary for the present invention, and following the production of the metallized film of the present invention, for example, Co,
By continuously depositing ferromagnetic materials such as Fe, Ni, or their alloys, it is possible to obtain magnetic recording media, and it goes without saying that it can also be used for other purposes, and each device is highly adaptable. should be designed, and the explanation is omitted here. There are no restrictions on the type or shape of the evaporation source 2, but
Since the industrially most excellent evaporation source is the electron beam heating method, most of the following examples used the electron beam heating method (16 Kw, 270 degree deflection type). In addition, the evaporation source 2 is located directly below the cylindrical rotating can 3.
It was placed at 30cm. However, the evaporation source 2 shown in FIG. 1 is schematically shown as a resistance heating type, and 10 is a heating power source and 11 is an insulated introduction terminal. 6 is a shielding plate and 9 is an adhesion prevention plate. The inside of the vacuum chamber 4 is continuously evacuated by a vacuum exhaust system 5. A new experiment in which there is a permissible limit on the maximum incident angle (the angle shown by θ in the figure) on the opposite side of the metal vapor flow emitted from the evaporation source 2 and the direction in which the polymer film 1 moves. The invention is based on this fact. This angle shows almost no dependence on the material, and there is no noticeable dependence on the deposition rate even up to several tens of μ/min. Although the present invention shows that it is sufficient to block the maximum incident angle by 60° or more, it is necessary to cut off the maximum incident angle by 60° as much as efficiency allows, taking into consideration the vapor deposition conditions, vapor deposition specifications, heat resistance of the polymer film 1 that is the base material, etc. It may be possible to cut off the angle to less than 40°, but from an industrial perspective, this is actually more stable, and depending on the geometry of the vapor deposition equipment, it is appropriate to cut off to about 40° in many cases. Regarding the fact that it is sufficient to block the component with an incident angle of 60° or more of the metal vapor flow, the size of the cylindrical rotating can 3 was confirmed to be 30 cm, 1 m, and 1.2 m in diameter, and the evaporation source position was changed to the cylindrical rotating can. From 15cm to 50
This was also confirmed when the central axis of the evaporation source was shifted from the central axis of the cylindrical rotating can. As described above, within the range of normal production scale, the incident angle changes momentarily along the cylindrical rotation can, resulting in curved growth of columnar crystals.
(from 90 degrees to 60 degrees), the crystal becomes thinner and 90 degrees
If the temperature is close to 300 degrees, some metal particles will cause total reflection, so
It is unstable and easily detaches from the polymer film when stress is applied. It is thought that by blocking this part, the Wander Waals force with the polymer film will increase, and the gaps between crystal grains will become smaller, making it difficult for adjacent grains to move, making them more resistant to stress. It will be done. The present invention does not preclude interruptions other than the above-mentioned interruption of 60 degrees or more, and it is of course possible to perform interruptions for other purposes, and this does not have a primary effect on the effects of the present invention. Incidentally, it is naturally possible to use it in combination with a known pretreatment, and as confirmed in several examples, it also has a secondary effect on the effects of the present invention, and it is also possible to apply the present invention to ion plating. It was found to have a similar effect, and was not as direct as the impact strength improvement effect of the present invention. Next, specific examples are shown in the table below.

【表】【table】

【表】 その他ポリエチレン2.6ナフタレート、ポリア
ミド、ポリカーボネイト等の高分子フイルム、蒸
着用の金属材料については、Ag、W、Ni、Co、
Fe、Pd、Si、Sn、In、Al等についても確かめ本
発明の効果を確認した。 尚本発明を用いて、磁気記録媒体を製造して優
れた効果を確認した例を第2図に示した。 ポリエチレンテレフタレートフイルム(厚さ10
μ)上に、Moを500Å入射角を変えて電子ビーム
蒸着し、それらにCoを5×10-5Torrの酸素中で
1500Å蒸着し、記録波長1μの正弦波を記録し、
くり返し走行させ、ヘツド出力が1dB低下する走
行回数を調べた結果を示したのが第2図であり、
この第2図より明らかなように、入射角により臨
界的変化を示し、ほぼ60゜にその臨界角の存在を
知ることができる。 以上のように本発明によれば、滑らかな高分子
フイルム上の金属層の付着力を非常に高め得たも
のであり、磁気記録媒体等の製造に利用してその
産業性は大なるものである。なお、本発明は必ず
しも滑らかな高分子フイルムへの適用に限るもの
ではなく、通常の高分子フイルムの金属化に適用
してもその効果は大きいものである。
[Table] Other polymer films such as polyethylene 2.6 naphthalate, polyamide, polycarbonate, and metal materials for vapor deposition include Ag, W, Ni, Co,
The effects of the present invention were also confirmed for Fe, Pd, Si, Sn, In, Al, etc. FIG. 2 shows an example in which a magnetic recording medium was manufactured using the present invention and excellent effects were confirmed. Polyethylene terephthalate film (thickness 10
μ), Mo was electron beam evaporated at different incident angles of 500 Å, and Co was deposited on them in oxygen at 5 × 10 -5 Torr.
Deposit 1500Å, record a sine wave with a recording wavelength of 1μ,
Figure 2 shows the results of repeated running and the number of runs at which the head output decreased by 1 dB.
As is clear from Fig. 2, there is a critical change depending on the angle of incidence, and the existence of the critical angle can be seen at approximately 60°. As described above, according to the present invention, the adhesion of a metal layer on a smooth polymer film can be greatly improved, and its industrial efficiency is great when it is used in the production of magnetic recording media, etc. be. It should be noted that the present invention is not necessarily limited to application to smooth polymer films, and the effect is great even when applied to metallization of ordinary polymer films.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の金属化フイルムの製造方法の
一実施例における蒸着装置の概略構成図、第2図
は同方法により得た金属化フイルムの蒸着入射角
と走行寿命を示す特性図である。 1……高分子フイルム、2……蒸発源、3……
円筒状回転キヤン、4……真空槽、6……遮断
板。
FIG. 1 is a schematic configuration diagram of a vapor deposition apparatus in an embodiment of the method for producing a metallized film of the present invention, and FIG. 2 is a characteristic diagram showing the incident angle of vapor deposition and running life of the metallized film obtained by the same method. . 1... Polymer film, 2... Evaporation source, 3...
Cylindrical rotating can, 4...vacuum chamber, 6...blocking plate.

Claims (1)

【特許請求の範囲】[Claims] 1 真空雰囲気内で円筒状キヤンの周側面に沿つ
て移動する高分子フイルムに金属蒸気流を差し向
けて金属化フイルムを製造するに際し、金属蒸気
流の向きと高分子フイルムの移動する向きとが対
向する側での金属蒸気流の入射角の60゜以上の成
分を遮断することを特徴とする金属化フイルムの
製造方法。
1. When manufacturing a metallized film by directing a metal vapor flow to a polymer film moving along the circumferential side of a cylindrical can in a vacuum atmosphere, the direction of the metal vapor flow and the direction of movement of the polymer film are A method for producing a metallized film characterized by blocking components of metal vapor flow at an incident angle of 60° or more on the opposing side.
JP5054478A 1978-04-26 1978-04-26 Manufacture of metallized film Granted JPS54141391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5054478A JPS54141391A (en) 1978-04-26 1978-04-26 Manufacture of metallized film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5054478A JPS54141391A (en) 1978-04-26 1978-04-26 Manufacture of metallized film

Publications (2)

Publication Number Publication Date
JPS54141391A JPS54141391A (en) 1979-11-02
JPS627264B2 true JPS627264B2 (en) 1987-02-16

Family

ID=12861943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5054478A Granted JPS54141391A (en) 1978-04-26 1978-04-26 Manufacture of metallized film

Country Status (1)

Country Link
JP (1) JPS54141391A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01195810A (en) * 1988-02-01 1989-08-07 Japan Tobacco Inc Sales showcase
JPH03113655U (en) * 1990-03-06 1991-11-20

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113758A (en) * 1984-11-09 1986-05-31 Kishimoto Akira Method for manufacturing thin film coated plastic film
JP2775647B2 (en) * 1989-11-17 1998-07-16 宇部興産株式会社 Manufacturing method of metallized polyimide film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52148565A (en) * 1976-06-07 1977-12-09 Matsushita Electric Industrial Co Ltd Method of manufacturing films for electricity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01195810A (en) * 1988-02-01 1989-08-07 Japan Tobacco Inc Sales showcase
JPH03113655U (en) * 1990-03-06 1991-11-20

Also Published As

Publication number Publication date
JPS54141391A (en) 1979-11-02

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