JPS6280400U - - Google Patents
Info
- Publication number
- JPS6280400U JPS6280400U JP17124085U JP17124085U JPS6280400U JP S6280400 U JPS6280400 U JP S6280400U JP 17124085 U JP17124085 U JP 17124085U JP 17124085 U JP17124085 U JP 17124085U JP S6280400 U JPS6280400 U JP S6280400U
- Authority
- JP
- Japan
- Prior art keywords
- land
- connection pattern
- view
- printed board
- covering member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 238000007634 remodeling Methods 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Description
第１図は本考案の誤配線防止構造を示す斜視図
、第２図は被覆部材がダミーパツケージに係合し
た時の側断面図、第３図ａはＬＳＩを例示する斜
視図、第３図ｂは同図ａの側面図、第４図はプリ
ント板にＬＳＩとダミーパツケージを実装した平
面図、第５図ａはダミーパツケージの斜視図、第
５図ｂは同図ａの平面図、第６図は誤配線を例示
する回路図である。
図に於いて、１はＬＳＩ、２，７はリード、３
はプリント板、４ａは接続用パターン、４ｂは改
造用ランド、４ｃは配線ランド、５はヒートシン
ク、６はダミーパツケージ、８はワイヤ、９は被
覆部材、９ａは角孔、９ｂは外縁部、１０は爪で
ある。
Fig. 1 is a perspective view showing the miswiring prevention structure of the present invention, Fig. 2 is a side sectional view when the covering member engages with the dummy package, Fig. 3a is a perspective view illustrating an LSI, Fig. 3 b is a side view of the same figure a, FIG. 4 is a plan view of the LSI and dummy package mounted on a printed board, FIG. 5 a is a perspective view of the dummy package, FIG. 5 b is a plan view of the same figure a, FIG. 6 is a circuit diagram illustrating incorrect wiring. In the figure, 1 is LSI, 2 and 7 are leads, and 3
is a printed board, 4a is a connection pattern, 4b is a modification land, 4c is a wiring land, 5 is a heat sink, 6 is a dummy package, 8 is a wire, 9 is a covering member, 9a is a square hole, 9b is an outer edge, 10 are claws.
Claims (1)
ターン４ａと、 前記接続用パターン４ａに連続して設けられた
改造用ランド４ｂとを具備して成るプリント板３
に於いて、 ダミーパツケージ６を実装した際に前記改造用
ランド４ｂを被覆部材８で被覆するようにしたこ
とを特徴とする誤配線防止構造。[Claims for Utility Model Registration] A printed board 3 comprising a connection pattern 4a to which leads 2 of a circuit component 1 are soldered, and a modification land 4b provided continuously to the connection pattern 4a.
A miswiring prevention structure characterized in that the remodeling land 4b is covered with a covering member 8 when the dummy package 6 is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17124085U JPS6280400U (en) | 1985-11-07 | 1985-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17124085U JPS6280400U (en) | 1985-11-07 | 1985-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280400U true JPS6280400U (en) | 1987-05-22 |
Family
ID=31106689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17124085U Pending JPS6280400U (en) | 1985-11-07 | 1985-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280400U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12283565B2 (en) | 2019-09-30 | 2025-04-22 | Showa Denko Materials Co., Ltd. | Adhesive for semiconductor, production method therefor, and semiconductor device and production method therefor |
-
1985
- 1985-11-07 JP JP17124085U patent/JPS6280400U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12283565B2 (en) | 2019-09-30 | 2025-04-22 | Showa Denko Materials Co., Ltd. | Adhesive for semiconductor, production method therefor, and semiconductor device and production method therefor |