JPS6282572U - - Google Patents
Info
- Publication number
- JPS6282572U JPS6282572U JP1985175125U JP17512585U JPS6282572U JP S6282572 U JPS6282572 U JP S6282572U JP 1985175125 U JP1985175125 U JP 1985175125U JP 17512585 U JP17512585 U JP 17512585U JP S6282572 U JPS6282572 U JP S6282572U
- Authority
- JP
- Japan
- Prior art keywords
- eyelets
- lead wires
- view
- showing
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａは本考案の一実施例を示す斜視図、同
図ｂは同上の平面図、第２図は同上のリード線の
はんだ付け状態を示す断面図、第３図は本考案の
他の実施例を示す斜視図、第４図は本考案のさら
に他の実施例を示す斜視図、第５図は同上のリー
ド線のはんだ付け状態を示す断面図、第６図は本
考案の別の実施例を示す斜視図、第７図は同上の
リード線のはんだ付け状態を示す断面図、第８図
は従来例を示す斜視図、第９図は同上に複数本の
リード線をはんだ付けした状態を示す断面図、第
１０図は同上にリード線を挿着する際のリード線
処理を示す説明図、第１１図は同上を用いて複数
本のリード線をはんだ付けする他の方法を示す断
面図である。
１０〜１ははとめ、１１ははとめ本体、１１
ａは胴部、１１ｂは鍔部、１２は連結板、１３は
スリツトである。
Fig. 1a is a perspective view showing an embodiment of the present invention, Fig. 1b is a plan view of the same, Fig. 2 is a sectional view showing the soldering state of the lead wires of the above, and Fig. 3 is a perspective view showing an embodiment of the invention. FIG. 4 is a perspective view showing another embodiment of the present invention, FIG. 5 is a cross-sectional view showing the soldering state of the same lead wire, and FIG. 6 is another embodiment of the present invention. Fig. 7 is a cross-sectional view showing the soldering state of the same lead wires, Fig. 8 is a perspective view showing the conventional example, and Fig. 9 shows the soldering of multiple lead wires to the same as above. FIG. 10 is an explanatory diagram showing lead wire processing when inserting lead wires into the same as above, and FIG. 11 shows another method of soldering multiple lead wires using the same as above. FIG. 10-1 are the eyelets, 11 is the eyelet body, 11
11b is a flange, 12 is a connecting plate, and 13 is a slit.
Claims (1)
けするためのはとめであつて、筒型の胴部の一端
に鍔部を形成した複数個のはとめ本体の鍔部間を
はとめ本体に比べて熱抵抗の大きな連結板にて連
結して成るはとめ。 The eyelets are for soldering multiple lead wires onto a printed circuit board, and the flanges are formed at one end of the cylindrical body. Eyelets connected by connecting plates with high thermal resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175125U JPS6282572U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985175125U JPS6282572U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282572U true JPS6282572U (en) | 1987-05-26 |
Family
ID=31114152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985175125U Pending JPS6282572U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282572U (en) |
-
1985
- 1985-11-14 JP JP1985175125U patent/JPS6282572U/ja active Pending
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