JPS6282737U - - Google Patents

Info

Publication number
JPS6282737U
JPS6282737U JP1985173927U JP17392785U JPS6282737U JP S6282737 U JPS6282737 U JP S6282737U JP 1985173927 U JP1985173927 U JP 1985173927U JP 17392785 U JP17392785 U JP 17392785U JP S6282737 U JPS6282737 U JP S6282737U
Authority
JP
Japan
Prior art keywords
bonding
horn
jig
ultrasonic
mounting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985173927U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173927U priority Critical patent/JPS6282737U/ja
Publication of JPS6282737U publication Critical patent/JPS6282737U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す外観図、第２
図ａは従来の前締め式によるツール取付状態を示
す外観図、第３図ａは同割り締め式によるツール
取付状態を示す外観図、第２図ｂ、第３図ｂはク
ランプ及びワイヤーとケース外壁との位置関係を
示す外観図である。 １……ボンデイングツール、２……カメラ、３
……ボンデイングホーン、３ａ……取付孔、３ｂ
……前端面、３ｃ……ねじ孔、４……ネジ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 軸方向に超音波振動が加えられるボンデイング
    ホーンにボンデイングツール垂直に装着してなる
    超音波ボンデイング用治具において、ボンデイン
    グホーンの前端面に近接して該ホーンの胴部を上
    下に貫通するボンデイングツールの取付孔を形成
    し、該ボンデイングホーンの胴部側面に前記取付
    孔に向けてねじ孔を開口し、該ねじ孔にねじ込ん
    だねじの先端を前記取付孔に挿入されたボンデイ
    ングツールの周面一部に圧接させたことを特徴と
    する超音波ワイヤボンデイング用治具。
JP1985173927U 1985-11-12 1985-11-12 Pending JPS6282737U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173927U JPS6282737U (ja) 1985-11-12 1985-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173927U JPS6282737U (ja) 1985-11-12 1985-11-12

Publications (1)

Publication Number Publication Date
JPS6282737U true JPS6282737U (ja) 1987-05-27

Family

ID=31111847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173927U Pending JPS6282737U (ja) 1985-11-12 1985-11-12

Country Status (1)

Country Link
JP (1) JPS6282737U (ja)

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