JPS6283875U - - Google Patents
Info
- Publication number
- JPS6283875U JPS6283875U JP17324185U JP17324185U JPS6283875U JP S6283875 U JPS6283875 U JP S6283875U JP 17324185 U JP17324185 U JP 17324185U JP 17324185 U JP17324185 U JP 17324185U JP S6283875 U JPS6283875 U JP S6283875U
- Authority
- JP
- Japan
- Prior art keywords
- area
- cushion material
- lead frame
- partial plating
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000007796 conventional method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の構造を有する下マスクを上か
ら見た概略図である。第2図は従来法による部分
めつきの概略断面図である。
1……硬度の高いクツシヨン材、2……硬度の
低いクツシヨン材、3……下マスク開口部、4…
…リードフレーム、4a……アイランド部、4b
……インナーリード先端部、5……上マスク、6
……下マスク、6a……下マスク基材、6b……
下マスククツシヨン材、7……ノズルまたはスリ
ツト、8……めつき液、9……めつき膜。
FIG. 1 is a schematic top view of a lower mask having the structure of the present invention. FIG. 2 is a schematic cross-sectional view of partial plating according to a conventional method. 1...Cushion material with high hardness, 2...Cushion material with low hardness, 3...Lower mask opening, 4...
...Lead frame, 4a...Island part, 4b
... Inner lead tip, 5 ... Upper mask, 6
...Lower mask, 6a...Lower mask base material, 6b...
Lower mask cushion material, 7... nozzle or slit, 8... plating liquid, 9... plating film.
Claims (1)
つきしない部分を覆う為の部分めつき用マスク板
において開口部の周辺部が硬度の高いクツシヨン
材であり、該周辺部以外の部分が硬度の低いクツ
シヨン材2よりなる事を特徴とするICリードフ
レームの部分めつき用マスク板。 In order to plate the parts of the IC lead frame, the mask plate for partial plating is used to cover the unplated parts, and the area around the opening is made of a cushion material with high hardness, and the area other than the area is of low hardness. A mask plate for partial plating of an IC lead frame, characterized by being made of cushion material 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17324185U JPS6283875U (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17324185U JPS6283875U (en) | 1985-11-11 | 1985-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6283875U true JPS6283875U (en) | 1987-05-28 |
Family
ID=31110518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17324185U Pending JPS6283875U (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6283875U (en) |
-
1985
- 1985-11-11 JP JP17324185U patent/JPS6283875U/ja active Pending
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