JPS6284595A - 多層セラミック配線基板 - Google Patents

多層セラミック配線基板

Info

Publication number
JPS6284595A
JPS6284595A JP60225282A JP22528285A JPS6284595A JP S6284595 A JPS6284595 A JP S6284595A JP 60225282 A JP60225282 A JP 60225282A JP 22528285 A JP22528285 A JP 22528285A JP S6284595 A JPS6284595 A JP S6284595A
Authority
JP
Japan
Prior art keywords
multilayer ceramic
substrate
ceramic
ceramic wiring
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60225282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445997B2 (sr
Inventor
嶋田　勇三
秀男 高見沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60225282A priority Critical patent/JPS6284595A/ja
Publication of JPS6284595A publication Critical patent/JPS6284595A/ja
Publication of JPH0445997B2 publication Critical patent/JPH0445997B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP60225282A 1985-10-08 1985-10-08 多層セラミック配線基板 Granted JPS6284595A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60225282A JPS6284595A (ja) 1985-10-08 1985-10-08 多層セラミック配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60225282A JPS6284595A (ja) 1985-10-08 1985-10-08 多層セラミック配線基板

Publications (2)

Publication Number Publication Date
JPS6284595A true JPS6284595A (ja) 1987-04-18
JPH0445997B2 JPH0445997B2 (sr) 1992-07-28

Family

ID=16826890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60225282A Granted JPS6284595A (ja) 1985-10-08 1985-10-08 多層セラミック配線基板

Country Status (1)

Country Link
JP (1) JPS6284595A (sr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527841A (en) * 1978-08-16 1980-02-28 Ngk Spark Plug Co Metallization of highly aluminous ceramics
JPS57180006A (en) * 1981-04-30 1982-11-05 Hitachi Ltd High thermally conductive electric insulator
JPS6077186A (ja) * 1983-09-30 1985-05-01 株式会社東芝 金属化表面を有するセラミツクス焼結体
JPS60173900A (ja) * 1984-02-20 1985-09-07 株式会社東芝 セラミツクス回路基板
JPS60178688A (ja) * 1984-02-27 1985-09-12 株式会社東芝 高熱伝導性回路基板
JPS60178687A (ja) * 1984-02-27 1985-09-12 株式会社東芝 高熱伝導性回路基板
JPS60180954A (ja) * 1984-02-27 1985-09-14 株式会社東芝 窒化アルミニウムグリ−ンシ−トの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527841A (en) * 1978-08-16 1980-02-28 Ngk Spark Plug Co Metallization of highly aluminous ceramics
JPS57180006A (en) * 1981-04-30 1982-11-05 Hitachi Ltd High thermally conductive electric insulator
JPS6077186A (ja) * 1983-09-30 1985-05-01 株式会社東芝 金属化表面を有するセラミツクス焼結体
JPS60173900A (ja) * 1984-02-20 1985-09-07 株式会社東芝 セラミツクス回路基板
JPS60178688A (ja) * 1984-02-27 1985-09-12 株式会社東芝 高熱伝導性回路基板
JPS60178687A (ja) * 1984-02-27 1985-09-12 株式会社東芝 高熱伝導性回路基板
JPS60180954A (ja) * 1984-02-27 1985-09-14 株式会社東芝 窒化アルミニウムグリ−ンシ−トの製造方法

Also Published As

Publication number Publication date
JPH0445997B2 (sr) 1992-07-28

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