JPS628643U - - Google Patents
Info
- Publication number
- JPS628643U JPS628643U JP9839585U JP9839585U JPS628643U JP S628643 U JPS628643 U JP S628643U JP 9839585 U JP9839585 U JP 9839585U JP 9839585 U JP9839585 U JP 9839585U JP S628643 U JPS628643 U JP S628643U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- heat
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案の放熱板固定構造の実施例にお
けるプリント配線板の一部と放熱板との外観斜視
図、第2図は従来の放熱板取付構造の一例におけ
るプリント配線板に取りつけられた半導体素子と
放熱板との外観斜視図である。
なお図面に記載の記号は下記のものを示す。1
:プリント配線板、2:ピン端子、3:半導体素
子、4:放熱板、5:放熱フイン、6,6′:溝
、8,8′:固定ピン、9:取付孔。
Figure 1 is an external perspective view of a part of a printed wiring board and a heat sink in an embodiment of the heat sink fixing structure of the present invention, and Figure 2 is an example of a conventional heat sink mounting structure in which the heat sink is attached to a printed wiring board. FIG. 3 is an external perspective view of a semiconductor element and a heat sink. The symbols shown in the drawings indicate the following. 1
: Printed wiring board, 2: Pin terminal, 3: Semiconductor element, 4: Heat sink, 5: Heat sink, 6, 6': Groove, 8, 8': Fixing pin, 9: Mounting hole.
Claims (1)
半導体素子3に放熱板4を取りつける放熱板取付
構造において、前記放熱板4の放熱フイン5の相
互間で形成される溝6に嵌入する複数個の固定ピ
ン8を前記プリント配線板1上に植設してなる放
熱板固定構造。 In a heat sink mounting structure in which a heat sink 4 is attached to a semiconductor element 3 fixed on a printed wiring board 1 with pin terminals 2, a plurality of heat sinks are fitted into grooves 6 formed between heat sink fins 5 of the heat sink 4. A heat sink fixing structure in which fixing pins 8 are planted on the printed wiring board 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9839585U JPH0322920Y2 (en) | 1985-06-28 | 1985-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9839585U JPH0322920Y2 (en) | 1985-06-28 | 1985-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS628643U true JPS628643U (en) | 1987-01-19 |
| JPH0322920Y2 JPH0322920Y2 (en) | 1991-05-20 |
Family
ID=30966292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9839585U Expired JPH0322920Y2 (en) | 1985-06-28 | 1985-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322920Y2 (en) |
-
1985
- 1985-06-28 JP JP9839585U patent/JPH0322920Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322920Y2 (en) | 1991-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS628643U (en) | ||
| JPS6022841U (en) | radiator | |
| JPS61205145U (en) | ||
| JPS6260046U (en) | ||
| JPS6249295U (en) | ||
| JPH0338653U (en) | ||
| JPS61186297U (en) | ||
| JPS6355443U (en) | ||
| JPS6255354U (en) | ||
| JPH0229533U (en) | ||
| JPS63132441U (en) | ||
| JPS6190251U (en) | ||
| JPS6115745U (en) | semiconductor equipment | |
| JPS6420740U (en) | ||
| JPS6228444U (en) | ||
| JPS62147355U (en) | ||
| JPS594646U (en) | Heat sink mounting device | |
| JPS59192850U (en) | semiconductor equipment | |
| JPH0158957U (en) | ||
| JPH0375594U (en) | ||
| JPH028148U (en) | ||
| JPH0220349U (en) | ||
| JPS60119752U (en) | integrated circuit package | |
| JPS62131449U (en) | ||
| JPS6244494U (en) |