JPS628643U - - Google Patents

Info

Publication number
JPS628643U
JPS628643U JP9839585U JP9839585U JPS628643U JP S628643 U JPS628643 U JP S628643U JP 9839585 U JP9839585 U JP 9839585U JP 9839585 U JP9839585 U JP 9839585U JP S628643 U JPS628643 U JP S628643U
Authority
JP
Japan
Prior art keywords
heat sink
wiring board
printed wiring
heat
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9839585U
Other languages
Japanese (ja)
Other versions
JPH0322920Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9839585U priority Critical patent/JPH0322920Y2/ja
Publication of JPS628643U publication Critical patent/JPS628643U/ja
Application granted granted Critical
Publication of JPH0322920Y2 publication Critical patent/JPH0322920Y2/ja
Expired legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の放熱板固定構造の実施例にお
けるプリント配線板の一部と放熱板との外観斜視
図、第2図は従来の放熱板取付構造の一例におけ
るプリント配線板に取りつけられた半導体素子と
放熱板との外観斜視図である。 なお図面に記載の記号は下記のものを示す。1
:プリント配線板、2:ピン端子、3:半導体素
子、4:放熱板、5:放熱フイン、6,6′:溝
、8,8′:固定ピン、9:取付孔。
Figure 1 is an external perspective view of a part of a printed wiring board and a heat sink in an embodiment of the heat sink fixing structure of the present invention, and Figure 2 is an example of a conventional heat sink mounting structure in which the heat sink is attached to a printed wiring board. FIG. 3 is an external perspective view of a semiconductor element and a heat sink. The symbols shown in the drawings indicate the following. 1
: Printed wiring board, 2: Pin terminal, 3: Semiconductor element, 4: Heat sink, 5: Heat sink, 6, 6': Groove, 8, 8': Fixing pin, 9: Mounting hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線板1上にピン端子2で固定された
半導体素子3に放熱板4を取りつける放熱板取付
構造において、前記放熱板4の放熱フイン5の相
互間で形成される溝6に嵌入する複数個の固定ピ
ン8を前記プリント配線板1上に植設してなる放
熱板固定構造。
In a heat sink mounting structure in which a heat sink 4 is attached to a semiconductor element 3 fixed on a printed wiring board 1 with pin terminals 2, a plurality of heat sinks are fitted into grooves 6 formed between heat sink fins 5 of the heat sink 4. A heat sink fixing structure in which fixing pins 8 are planted on the printed wiring board 1.
JP9839585U 1985-06-28 1985-06-28 Expired JPH0322920Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9839585U JPH0322920Y2 (en) 1985-06-28 1985-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9839585U JPH0322920Y2 (en) 1985-06-28 1985-06-28

Publications (2)

Publication Number Publication Date
JPS628643U true JPS628643U (en) 1987-01-19
JPH0322920Y2 JPH0322920Y2 (en) 1991-05-20

Family

ID=30966292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9839585U Expired JPH0322920Y2 (en) 1985-06-28 1985-06-28

Country Status (1)

Country Link
JP (1) JPH0322920Y2 (en)

Also Published As

Publication number Publication date
JPH0322920Y2 (en) 1991-05-20

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