JPS628644U - - Google Patents

Info

Publication number
JPS628644U
JPS628644U JP9867785U JP9867785U JPS628644U JP S628644 U JPS628644 U JP S628644U JP 9867785 U JP9867785 U JP 9867785U JP 9867785 U JP9867785 U JP 9867785U JP S628644 U JPS628644 U JP S628644U
Authority
JP
Japan
Prior art keywords
connecting plate
package member
package
lead
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9867785U
Other languages
Japanese (ja)
Other versions
JPH0546281Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985098677U priority Critical patent/JPH0546281Y2/ja
Publication of JPS628644U publication Critical patent/JPS628644U/ja
Application granted granted Critical
Publication of JPH0546281Y2 publication Critical patent/JPH0546281Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２
図は従来のＩＣパツケージの断面図、第３図は従
来例の斜視図である。 １…連結型リードフレーム、２…リード端子、
３…リードフレーム、４…連結板、５…棚部、６
…爪部、７…スリツト、８…パツケージ部材、９
…メタライズ金属層。 Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view of a conventional IC package, and FIG. 3 is a perspective view of the conventional example. 1...Connected lead frame, 2...Lead terminal,
3...Lead frame, 4...Connecting plate, 5...Shelf, 6
...Claw portion, 7...Slit, 8...Package member, 9
...metalized metal layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数個のリード端子を有する一対のリードフレ
ームをパツケージ部材を載置するための棚部及び
パツケージ部材に当接し位置決めするための爪部
を両側に有する連結板で連結して成る半導体パツ
ケージ用連結型リードフレームにおいて、前記両
爪部間の連結板にスリツトを形成したことを特徴
とする半導体パツケージ用連結型リードフレーム
。 A connecting type for semiconductor packages, which is made by connecting a pair of lead frames each having a plurality of lead terminals with a connecting plate having a shelf section on which the package member is placed and a hook section on both sides for abutting and positioning the package member. 1. A connected lead frame for a semiconductor package, characterized in that a slit is formed in a connecting plate between both claw parts.
JP1985098677U 1985-06-27 1985-06-27 Expired - Lifetime JPH0546281Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985098677U JPH0546281Y2 (en) 1985-06-27 1985-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985098677U JPH0546281Y2 (en) 1985-06-27 1985-06-27

Publications (2)

Publication Number Publication Date
JPS628644U true JPS628644U (en) 1987-01-19
JPH0546281Y2 JPH0546281Y2 (en) 1993-12-03

Family

ID=30966843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985098677U Expired - Lifetime JPH0546281Y2 (en) 1985-06-27 1985-06-27

Country Status (1)

Country Link
JP (1) JPH0546281Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294074A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame
JPS5626457A (en) * 1979-08-11 1981-03-14 Daido Steel Co Ltd Connecting method for conductive terminal
JPS59117238A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Manufacture of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294074A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame
JPS5626457A (en) * 1979-08-11 1981-03-14 Daido Steel Co Ltd Connecting method for conductive terminal
JPS59117238A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPH0546281Y2 (en) 1993-12-03

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