JPS628669U - - Google Patents
Info
- Publication number
- JPS628669U JPS628669U JP10070985U JP10070985U JPS628669U JP S628669 U JPS628669 U JP S628669U JP 10070985 U JP10070985 U JP 10070985U JP 10070985 U JP10070985 U JP 10070985U JP S628669 U JPS628669 U JP S628669U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- solder resist
- unnecessary parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の実施例を示すもので文字、
番号、記号などをプリント基板素地露出によつて
表示した図、第２図はプリント基板の裏面側を示
す平面図、第３図はプリント基板の表面側を示す
斜視図である。
１：プリント基板、２１，２２：リード線、４
：銅箔印刷面、６：ソルダーレジスト、７：文字
、番号、記号。
Figure 1 shows an example of this invention.
FIG. 2 is a plan view showing the back side of the printed circuit board, and FIG. 3 is a perspective view showing the front side of the printed circuit board. 1: Printed circuit board, 2 1 , 2 2 : Lead wire, 4
: Copper foil printing surface, 6: Solder resist, 7: Letters, numbers, symbols.
Claims (1)
電子部品のリード線をプリント基板に貫通させ、
その先端をプリント基板裏面に銅箔印刷された電
子回路に半田付け接続するとともに余分の半田が
不必要な個所に付着しないように半田付け作業前
に前記不必要個所をソルダーレジストにてコーテ
イング処理するものにおいて；前記プリント基板
裏面のソルダーレジストのコーテイング処理を文
字、番号、記号部分を残して、プリント基板の表
面素地を露出させて処理したことを特徴とするプ
リント基板。 Mounting electronic components on the front side of the printed circuit board and passing the lead wires of the electronic components through the printed circuit board,
The tip is soldered and connected to the electronic circuit printed on copper foil on the back of the printed circuit board, and the unnecessary parts are coated with solder resist before soldering to prevent excess solder from adhering to unnecessary parts. A printed circuit board, characterized in that the solder resist coating treatment on the back surface of the printed circuit board is carried out to leave the characters, numbers, and symbols, and to expose the surface base of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10070985U JPS628669U (en) | 1985-07-02 | 1985-07-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10070985U JPS628669U (en) | 1985-07-02 | 1985-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS628669U true JPS628669U (en) | 1987-01-19 |
Family
ID=30970785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10070985U Pending JPS628669U (en) | 1985-07-02 | 1985-07-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS628669U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239485A (en) * | 1988-07-28 | 1990-02-08 | Ibiden Co Ltd | Manufacture of printed wiring board printed with eye mark |
-
1985
- 1985-07-02 JP JP10070985U patent/JPS628669U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239485A (en) * | 1988-07-28 | 1990-02-08 | Ibiden Co Ltd | Manufacture of printed wiring board printed with eye mark |
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