JPS6286896A - Manufacture of printed circuit board with metal core - Google Patents
Manufacture of printed circuit board with metal coreInfo
- Publication number
- JPS6286896A JPS6286896A JP22684385A JP22684385A JPS6286896A JP S6286896 A JPS6286896 A JP S6286896A JP 22684385 A JP22684385 A JP 22684385A JP 22684385 A JP22684385 A JP 22684385A JP S6286896 A JPS6286896 A JP S6286896A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- oxide film
- alloy plate
- metal
- metal core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 20
- 239000002184 metal Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000007747 plating Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- 229910001362 Ta alloys Inorganic materials 0.000 claims 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 8
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- ZGDWHDKHJKZZIQ-UHFFFAOYSA-N cobalt nickel Chemical compound [Co].[Ni].[Ni].[Ni] ZGDWHDKHJKZZIQ-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
この発明は金属板の表面に耐絶縁性を持たせて、金属板
と、表面回路との耐絶縁性に優れ、且つ高密度回路に適
するようにした金属芯入り印刷配線板の製造法に関する
ものである。[Detailed Description of the Invention] Industrial Field of Application This invention provides insulation resistance to the surface of a metal plate so that it has excellent insulation resistance between the metal plate and the surface circuit, and is suitable for high-density circuits. The present invention relates to a method of manufacturing a printed wiring board with a metal core.
従来の技術
電子機器の高密度化に伴い、プリント配線板の機能とし
て熱の放散、電磁遮蔽等の要求が増えてきており、この
要求を満たすものとして金属芯入り配線板が開発されて
いる。BACKGROUND OF THE INVENTION With the increasing density of electronic devices, demands for heat dissipation, electromagnetic shielding, etc. as functions of printed wiring boards are increasing, and metal-core wiring boards have been developed to meet these demands.
金属芯入り配置板方式として、従来、鉄ないしアルミ板
上に穴を明けた後、表面粗化等の処理を施し、この上に
エポキシ樹脂等を塗布し絶縁体上に回路を形成する方式
がある。この表面処理法は、金属と有機絶縁体との密着
力をあげる処理のため、金属板上に直接回路の形成は出
来ない。Conventionally, the metal core placement board method involves drilling a hole in an iron or aluminum plate, then roughening the surface, and then applying epoxy resin or the like on top to form a circuit on the insulator. be. Since this surface treatment method increases the adhesion between the metal and the organic insulator, it is not possible to directly form a circuit on the metal plate.
２者は金属にピンホール無しで回路を形成することは非
常に困難であるため金属芯と表面回路との絶縁に問題が
ある。これの対応策として従来は流動浸漬法により絶縁
皮膜を厚く塗布し回路を形成するため、小穴径等は穴づ
まりを起こし、細線パターンには適用されていない。In the second type, it is very difficult to form a circuit in metal without pinholes, so there is a problem in insulation between the metal core and the surface circuit. Conventionally, as a countermeasure to this problem, a circuit is formed by applying a thick insulating film using a fluidized dipping method, which causes clogging of holes with small hole diameters, and has not been applied to fine wire patterns.
問題点を解決するための手段
これに対して、この出願の発明は、金属板自身に絶縁を
持たせることにより、上記欠点を補い、耐絶縁性の良い
金属芯入り配線板を製造することができたものである。Means for Solving the Problems In contrast, the invention of this application compensates for the above drawbacks by providing insulation to the metal plate itself, making it possible to manufacture a wiring board with a metal core that has good insulation resistance. It was made.
即ち、予め必要部分に小穴を明けたアルミ板またはアル
ミ板を主体とする合金、或いはタンタルまたはタンタル
を主体とした合金或いはチタンまたはチタンを主体とし
た合金の表面に化学的或いは電気化学的に酸化皮膜を構
成させ、その皮膜の強度は直流或いは交流１００Ｖ以上
の印加電圧に耐え得る絶縁性を全面或いは部分的に処理
したものを基材として用いることにより、その表面およ
び小穴にニッケルめっき或いは銅或いは金、或いは銀め
っき（化学めっき或いは電気めっき併用法）または銀、
カーボンペーストにより回路を形成することができて頗
る有用である。In other words, chemically or electrochemically oxidizing the surface of an aluminum plate or an aluminum plate-based alloy, tantalum or a tantalum-based alloy, titanium or a titanium-based alloy, with small holes pre-drilled in the necessary areas. The strength of the film is determined by using as a base material a material that has been completely or partially treated with insulation that can withstand an applied voltage of 100 V or more of direct current or alternating current, and the surface and small holes are plated with nickel or copper. Gold or silver plating (chemical plating or electroplating combined method) or silver,
It is extremely useful to be able to form circuits using carbon paste.
以下、実施例について、この出願の発明を説明する。The invention of this application will be described below with reference to Examples.
〔実施例１〕
厚さ０・８−のアルミ板（この場合９９・９＊＾１）を
５００Ｘ５００１．ｌに裁断し説脂−水洗−整面一表面
粗化一水洗一乾燥の前処理（これらの前処理工程は、必
レスにより或いは角穴、楕円穴等を明けたものを予め準
備する前処理されたアルミ板を電解液、硫酸或いは蓚酸
或いは硼酸または蓚酸と硼酸からなる混合液或いは無水
クロム酸液を用いて陽極電解法によりアルミ板の表面に
酸化皮膜を施し前述の電気的絶縁に必要とするまで電解
を行った。[Example 1] An aluminum plate of 0.8-thickness (99.9*^1 in this case) is 500×5001. Pretreatment of cutting into l pieces, degreasing, washing with water, surface smoothing, surface roughening, washing with water, and drying (these pretreatment steps are pretreatments in which the product is prepared in advance by cutting or with square holes, oval holes, etc.) An oxide film is applied to the surface of the aluminum plate by anodic electrolysis using an electrolytic solution, sulfuric acid, oxalic acid, boric acid, a mixed solution of oxalic acid and boric acid, or anhydrous chromic acid solution, which is necessary for the above-mentioned electrical insulation. Electrolysis was carried out until
酸化皮膜化した後、封入処理として蒸気圧２晋／平方Ｐ
以上で処理を行うか或いは酢酸ニッケル浴或いはコバル
トニッケル０・１〜５ｚ液温６０〜ｔｏｏｃで２〜３０
分するか或いは黒色染料で染色と同時に封入処理を行っ
た。黒色染料で染色する場合の電解液は、硫酸液が最も
望ましい（放熱処理を特に必要とする場合は染色が望ま
しい）。After forming an oxide film, the vapor pressure is 2 Jin/square P as an encapsulation treatment.
The above treatment can be carried out, or nickel acetate bath or cobalt nickel 0.1~5z solution temperature 60~2~30℃
The specimens were either separated or stained with black dye and encapsulated at the same time. When dyeing with a black dye, the most desirable electrolyte is a sulfuric acid solution (dying is preferable if heat dissipation treatment is particularly required).
また、前述の封入処理は行わないものを使用しても良い
。Further, it is also possible to use one that is not subjected to the above-mentioned encapsulation treatment.
次に、溶剤希釈エポキシ樹脂を、穴内表面に浸漬塗布し
、さらに表面に触媒入り接着剤ＨＡ−２１（日立化成社
製）を印刷塗布乾燥後、増感剤Ｈ８−２０１Ｂ（日立化
成社製塩化パラジューム、塩化スズ、食塩系）に浸漬し
穴内に触媒付与を行い、この上にさらにめっきレジスト
を施した後、化学めっき液Ｌ−５９（日立化成社製）に
浸漬して所定の回路の厚みを得た。Next, a solvent-diluted epoxy resin was dip-coated on the inner surface of the hole, and then a catalyst-containing adhesive HA-21 (manufactured by Hitachi Chemical Co., Ltd.) was printed on the surface and after drying, a sensitizer H8-201B (chlorinated Palladium, tin chloride, salt-based) were immersed in the hole to apply a catalyst, and a plating resist was further applied on top of this, followed by immersion in chemical plating solution L-59 (manufactured by Hitachi Chemical Co., Ltd.) to form a predetermined circuit thickness. I got it.
本方式で作成したものは、回路を基材の耐圧１００ｖを
満足した。The circuit produced using this method satisfied the withstand voltage of 100V for the circuit base material.
〔実施例２〕
厚さ０・８〜のアルミ板に予め小穴或いは角穴、楕円穴
を必要とする周辺を除き実施例１の前処理工程を完了し
たアルミ板にフェノール変性ニトリルゴムを印刷しくエ
ポキシ樹脂或いはそれを主体とする樹脂でも可能）、電
気的絶縁皮膜を予め構成させたのちに小穴或いは角穴、
楕円穴周辺の非皮ｙｔｍ分にドリル或いはプレスにより
小穴、角穴等を明け、加工後実施例１と同様酸化皮膜を
形成させる（酸化皮膜は樹脂層を除くランド周辺部）。[Example 2] Phenol-modified nitrile rubber was printed on an aluminum plate with a thickness of 0.8~ after completing the pretreatment process of Example 1, except for the areas where small holes, square holes, and oval holes were required. (Possible to use epoxy resin or a resin mainly composed of epoxy resin), after forming an electrically insulating film in advance, make a small hole or a square hole.
Small holes, square holes, etc. are drilled or pressed in the non-skinned YTM portion around the oval hole, and after processing, an oxide film is formed in the same manner as in Example 1 (the oxide film is around the land except for the resin layer).
しかる後、この基板をＨｚ Ｓ ０．５００ｇｒ／ｊ、
ｃ ｒｏａ２０＊ｒ／ｊを含有するエツチング液に４５
°Ｃで１ｏ分間浸漬した０次いで、これを水洗いし増感
剤Ｈ９２０１Ｂに浸漬しさらに化学めっきＬ−５９（日
立化成社製）に２Ｈｒ浸漬し４μｍの化学めっきの厚み
の基板を得た。After that, this board was heated to Hz S 0.500gr/j,
45 in an etching solution containing cr roa20*r/j
The substrate was immersed at .degree. C. for 10 minutes, then washed with water, immersed in sensitizer H9201B, and further immersed in chemical plating L-59 (manufactured by Hitachi Chemical Co., Ltd.) for 2 hours to obtain a chemically plated substrate with a thickness of 4 .mu.m.
さらに、この基板に電気めっきに耐え得るインクを印刷
し次いで電気めっきを４０μｍ施した。Furthermore, an ink capable of withstanding electroplating was printed on this substrate, and then electroplating was applied to a thickness of 40 μm.
次いでインクを剥離した後全面を６μμツチングするこ
とにより必要な回路を得た。Next, after peeling off the ink, the entire surface was etched by 6 μμ to obtain the necessary circuit.
〔実施例３〕
実施例１．２で回路を作成した後、さらにその上にカー
ボン印刷（原書社製Ｒ−１２１）を印刷し多層構造とし
た。[Example 3] After creating the circuit in Example 1.2, carbon printing (R-121 manufactured by Genshosha Co., Ltd.) was further printed on the circuit to obtain a multilayer structure.
発明の効果
この出願の発明によれば、金属板の表面に耐絶縁性を持
たせて金属板と表面回路との耐絶縁性に優れ、且つ高密
度回路に適する金属芯入り印刷配線板を製造することが
できる効果を奏する。Effects of the Invention According to the invention of this application, a printed wiring board with a metal core is produced which has insulation resistance on the surface of the metal plate, has excellent insulation resistance between the metal plate and the surface circuit, and is suitable for high-density circuits. It produces the effect that can be achieved.
Claims (4)
合金板、タンタル板、タンタル合金板、チタン板、或い
はチタン合金板等の金属板或いは金属合金板の表面を、
化学的或いは電気的に処理して、酸化皮膜を構成し、そ
の酸化皮膜の強度を、直流或いは交流１００Ｖ以上の印
加電圧に耐え得る絶縁性にし、これを全面或いは部分的
に処理して基材を構成し、その基材の表面及び小穴に、
ニッケルめつき、銅めっき或いは銀めっき（化学めっき
、電気めっきとの併用或いは、カーボン、銅或いは銀等
の導電ペーストとの併用）によつて回路を形成すること
を特徴とする金属芯入り印刷配線板の製造法(1) - The surface of a metal plate or metal alloy plate, such as an aluminum plate, an aluminum alloy plate, a tantalum plate, a tantalum alloy plate, a titanium plate, or a titanium alloy plate, with small holes drilled in the necessary areas in advance,
Chemically or electrically treated to form an oxide film, the strength of the oxide film is made insulating enough to withstand an applied voltage of 100 V or more DC or AC, and this is completely or partially treated to form a base material. and on the surface and small holes of the base material,
Printed wiring with a metal core, characterized in that a circuit is formed by nickel plating, copper plating, or silver plating (combined with chemical plating, electroplating, or with conductive paste such as carbon, copper, or silver) Board manufacturing method
接着剤をコーテングする特許請求の範囲第１項記載の金
属芯入り印刷配線板の製造法(2) The method for manufacturing a printed wiring board with a metal core according to claim 1, which comprises coating the oxide film with a sensitizer or an adhesive after forming the oxide film.
合金板、タンタル板、タンタル合金板、チタン板或いは
チタン合金板等の金属板或いは金属合金板の表面を、化
学的或いは電気的に処理して、酸化皮膜を構成し、その
酸化皮膜の強度を、直流或いは交流１００Ｖ以上の印加
電圧に耐え得る絶縁性にし、これを全面或いは部分的に
処理して基材を構成し、その基材の表面に、エポキシ樹
脂等の有機絶縁物を、全面或いは部分的に塗布した後、
化学めっき或いは電気めっきの併用法又は導電ペースト
或いは導電ペースト併用法によって、回路を形成する金
属芯入り印刷配線板の製造法(3) - Chemically or electrically process the surface of a metal plate or metal alloy plate such as an aluminum plate, aluminum alloy plate, tantalum plate, tantalum alloy plate, titanium plate, or titanium alloy plate, with small holes drilled in the necessary areas in advance. The oxide film is treated to form an oxide film, the strength of the oxide film is made insulating enough to withstand an applied voltage of 100 V or more, direct current or alternating current, the whole or part of this is treated to form a base material, and the base material is After applying an organic insulating material such as epoxy resin to the entire surface or part of the material,
A method for manufacturing a printed wiring board with a metal core that forms a circuit by a combination of chemical plating or electroplating, a conductive paste, or a combination of conductive paste.
接着剤をコーテングする特許請求の範囲第３項記載の金
属芯入り印刷配線板の製造法(4) The method for manufacturing a printed wiring board with a metal core according to claim 3, wherein after forming the oxide film, a sensitizer is added or an adhesive is coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22684385A JPS6286896A (en) | 1985-10-14 | 1985-10-14 | Manufacture of printed circuit board with metal core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22684385A JPS6286896A (en) | 1985-10-14 | 1985-10-14 | Manufacture of printed circuit board with metal core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6286896A true JPS6286896A (en) | 1987-04-21 |
Family
ID=16851437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22684385A Pending JPS6286896A (en) | 1985-10-14 | 1985-10-14 | Manufacture of printed circuit board with metal core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286896A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519853A (en) * | 1978-07-29 | 1980-02-12 | Akai Electric | Method of manufacturing circuit board |
| JPS5874091A (en) * | 1981-10-28 | 1983-05-04 | 日本電気株式会社 | Metal core printed board |
-
1985
- 1985-10-14 JP JP22684385A patent/JPS6286896A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519853A (en) * | 1978-07-29 | 1980-02-12 | Akai Electric | Method of manufacturing circuit board |
| JPS5874091A (en) * | 1981-10-28 | 1983-05-04 | 日本電気株式会社 | Metal core printed board |
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