JPS6287450U - - Google Patents

Info

Publication number
JPS6287450U
JPS6287450U JP17844885U JP17844885U JPS6287450U JP S6287450 U JPS6287450 U JP S6287450U JP 17844885 U JP17844885 U JP 17844885U JP 17844885 U JP17844885 U JP 17844885U JP S6287450 U JPS6287450 U JP S6287450U
Authority
JP
Japan
Prior art keywords
metal substrates
insulating film
circuit
conductive path
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17844885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17844885U priority Critical patent/JPS6287450U/ja
Publication of JPS6287450U publication Critical patent/JPS6287450U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す正面図、第2図
は従来例を示す断面図である。 1,2……金属基板、3……絶縁フイルム、4
……導電路、5……回路素子、6……外部リード
、7……クリツプ。
FIG. 1 is a front view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. 1, 2... Metal substrate, 3... Insulating film, 4
...Conducting path, 5...Circuit element, 6...External lead, 7...Clip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 2枚の金属基板と、該2枚の金属基板を離間し
て結合する絶縁フイルムと、該絶縁フイルム上に
設けた所望形状の導電路と、該導電路上に固着さ
れる複数の回路素子とを具備し、前記絶縁フイル
ムを曲折して前記金属基板の金属露出面を接する
様にした混成集積回路に於いて、前記2枚の金属
基板を挾込み固定するクリツプを有することを特
徴とする混成集積回路。
Two metal substrates, an insulating film that connects the two metal substrates at a distance, a conductive path of a desired shape provided on the insulating film, and a plurality of circuit elements fixed on the conductive path. A hybrid integrated circuit comprising: the insulating film bent so that the metal exposed surfaces of the metal substrates are brought into contact with each other, the hybrid integrated circuit having a clip for inserting and fixing the two metal substrates. circuit.
JP17844885U 1985-11-20 1985-11-20 Pending JPS6287450U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17844885U JPS6287450U (en) 1985-11-20 1985-11-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17844885U JPS6287450U (en) 1985-11-20 1985-11-20

Publications (1)

Publication Number Publication Date
JPS6287450U true JPS6287450U (en) 1987-06-04

Family

ID=31120587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17844885U Pending JPS6287450U (en) 1985-11-20 1985-11-20

Country Status (1)

Country Link
JP (1) JPS6287450U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792852A (en) * 1980-12-01 1982-06-09 Sanyo Electric Co Ltd Hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792852A (en) * 1980-12-01 1982-06-09 Sanyo Electric Co Ltd Hybrid integrated circuit

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