JPS6287452U - - Google Patents
Info
- Publication number
- JPS6287452U JPS6287452U JP17804385U JP17804385U JPS6287452U JP S6287452 U JPS6287452 U JP S6287452U JP 17804385 U JP17804385 U JP 17804385U JP 17804385 U JP17804385 U JP 17804385U JP S6287452 U JPS6287452 U JP S6287452U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- integrated circuit
- opening
- nozzle
- cooling element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例を示す概略断面図、第
２図はキヤツプ部の縦断面図、第３図及び第４図
は熱抵抗の特性図例、第５図は局所熱伝達率の一
般的な特性図、第６図は従来例を示す概略断面図
、第７図は第６図の装置の概略平面図である。
図面で１０は基板、１２は集積回路素子、２２
ａ，２２ｂ，……は冷却素子、２４ａ，２４ｂ，
……はベローズ、３０はキヤツプである。
Figure 1 is a schematic sectional view showing an embodiment of the present invention, Figure 2 is a longitudinal sectional view of the cap, Figures 3 and 4 are examples of thermal resistance characteristics, and Figure 5 is a diagram of local heat transfer coefficient. A general characteristic diagram, FIG. 6 is a schematic sectional view showing a conventional example, and FIG. 7 is a schematic plan view of the device shown in FIG. 6. In the drawing, 10 is a substrate, 12 is an integrated circuit element, and 22
a, 22b, ... are cooling elements, 24a, 24b,
... is a bellows, and 30 is a cap.
Claims (1)
面を当接する複数の冷却素子を備え、該冷却素子
内にノズルを有し、該ノズルを直列に連結して各
々同じ流量の冷却を供給して冷却素子底面へ向け
て該冷媒を流出させ、集積回路素子を冷却する装
置において、 該ノズルの先端開口部に、該開口部の径とは異
なる径の開口を持つキヤツプを着脱可能に取付け
てなることを特徴とする集積回路素子の冷却装置
。[Claims for Utility Model Registration] A system comprising a plurality of cooling elements whose bottom surfaces are in contact with a plurality of integrated circuit elements disposed on a substrate, a nozzle inside the cooling element, and the nozzles connected in series. In a device for cooling an integrated circuit element by supplying the same flow rate of cooling to each cooling element and causing the refrigerant to flow out toward the bottom surface of the cooling element, the tip opening of the nozzle is provided with an opening having a diameter different from that of the opening. A cooling device for an integrated circuit device, characterized in that a cap is detachably attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17804385U JPS6287452U (en) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17804385U JPS6287452U (en) | 1985-11-19 | 1985-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6287452U true JPS6287452U (en) | 1987-06-04 |
Family
ID=31119802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17804385U Pending JPS6287452U (en) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6287452U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02100351A (en) * | 1988-10-06 | 1990-04-12 | Nec Corp | Cooling structure of integrated circuit |
| JPH04221843A (en) * | 1990-03-21 | 1992-08-12 | Internatl Business Mach Corp <Ibm> | Heat-removing device |
-
1985
- 1985-11-19 JP JP17804385U patent/JPS6287452U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02100351A (en) * | 1988-10-06 | 1990-04-12 | Nec Corp | Cooling structure of integrated circuit |
| JPH04221843A (en) * | 1990-03-21 | 1992-08-12 | Internatl Business Mach Corp <Ibm> | Heat-removing device |