JPS6287465U - - Google Patents

Info

Publication number
JPS6287465U
JPS6287465U JP1985178065U JP17806585U JPS6287465U JP S6287465 U JPS6287465 U JP S6287465U JP 1985178065 U JP1985178065 U JP 1985178065U JP 17806585 U JP17806585 U JP 17806585U JP S6287465 U JPS6287465 U JP S6287465U
Authority
JP
Japan
Prior art keywords
comb
conductive
mounting hole
mounting
protruding teeth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985178065U
Other languages
Japanese (ja)
Other versions
JPH0416457Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985178065U priority Critical patent/JPH0416457Y2/ja
Publication of JPS6287465U publication Critical patent/JPS6287465U/ja
Application granted granted Critical
Publication of JPH0416457Y2 publication Critical patent/JPH0416457Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の取付基板の要部を構成する絶
縁基板の裏面に形成された導電パターン図、第1
a図〜第1c図は2端子型発光体素子の例図、第
2図は櫛歯状導電パターン対の1ユニツト分の導
電パターン図、第3図は取付基板に通電するため
に使用されるピンプラグの例図、第4図、第5図
は1ユニツト分の櫛歯状導電パターンに2端子型
発光体素子を接続した場合の配線接続例図、第6
図は短絡ピンの例図、第7図、第8図は本考案の
取付基板にマスク板を使用する場合の縦断面構造
図、第9図は従来の発光体素子取付基板の裏面の
導電パターン図である。 符号の説明、1……取付基板、2……第1の櫛
歯状導電パターン、21……その突出歯部、21
a……その取付孔、3……第2の櫛歯状導電パタ
ーン、31……その突出歯部、31a……その取
付孔、4……導電ランド、41……その取付孔、
LED……2端子型発光体素子、B……取付部、
9……短絡ピン。
Figure 1 is a diagram of the conductive pattern formed on the back surface of the insulating substrate that constitutes the main part of the mounting board of the present invention.
Figures a to 1c are examples of a two-terminal light emitting element, Figure 2 is a diagram of a conductive pattern for one unit of a pair of comb-shaped conductive patterns, and Figure 3 is used to conduct electricity to a mounting board. Figures 4 and 5 are examples of pin plugs, and Figures 6 and 6 are examples of wiring connections when a two-terminal light emitting element is connected to a comb-like conductive pattern for one unit.
The figure shows an example of a shorting pin, Figures 7 and 8 are longitudinal cross-sectional structural diagrams when a mask plate is used as the mounting board of the present invention, and Figure 9 shows the conductive pattern on the back side of a conventional light emitter element mounting board. It is a diagram. Explanation of symbols, 1...Mounting board, 2...First comb-shaped conductive pattern, 21...Protruding tooth portion thereof, 21
a... its mounting hole, 3... its second comb-shaped conductive pattern, 31... its protruding teeth, 31a... its mounting hole, 4... its conductive land, 41... its mounting hole,
LED...Two-terminal light emitting element, B...Mounting part,
9...Short pin.

Claims (1)

【実用新案登録請求の範囲】 導電パターンを絶縁基板に形成した2端子型発
光体素子取付基板において、 絶縁基板の片面に、複数の突出歯部の各々の先
端に取付孔を有した第1、第2の櫛歯状導電パタ
ーンを、各々の突出歯部が対向するように配置さ
せて櫛歯状導電パターン対を構成するとともに、
上記2つの櫛歯状導通パターンの間に、両端に取
付孔を有した複数の導電ランドを列状に介在させ
て成り、上記第1、第2の櫛歯状導電パターンの
隣接した突出歯部に形成された取付孔と、上記導
電ランドの隣接するもの同士の対向する端部に形
成された取付孔とによつて、2端子型発光体素子
の取付部を構成していることを特徴とする発光体
素子取付基板。
[Claims for Utility Model Registration] A two-terminal light emitting device mounting board in which a conductive pattern is formed on an insulating substrate, comprising: a first mounting hole on one side of the insulating substrate, each having a mounting hole at the tip of each of a plurality of protruding teeth; The second comb-shaped conductive pattern is arranged such that the respective protruding teeth face each other to form a pair of comb-shaped conductive patterns,
A plurality of conductive lands having mounting holes at both ends are interposed in a row between the two comb-like conductive patterns, and the protruding teeth of the first and second comb-like conductive patterns are adjacent to each other. The mounting hole formed in the conductive land and the mounting hole formed in the opposing ends of the adjacent conductive lands constitute a mounting part for the two-terminal light emitting element. Luminous element mounting board.
JP1985178065U 1985-11-19 1985-11-19 Expired JPH0416457Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985178065U JPH0416457Y2 (en) 1985-11-19 1985-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985178065U JPH0416457Y2 (en) 1985-11-19 1985-11-19

Publications (2)

Publication Number Publication Date
JPS6287465U true JPS6287465U (en) 1987-06-04
JPH0416457Y2 JPH0416457Y2 (en) 1992-04-13

Family

ID=31119849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985178065U Expired JPH0416457Y2 (en) 1985-11-19 1985-11-19

Country Status (1)

Country Link
JP (1) JPH0416457Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059966A (en) * 2007-08-31 2009-03-19 Panasonic Corp Mounting board and light emitting module
JP2018503984A (en) * 2015-05-27 2018-02-08 深▲セン▼市華星光電技術有限公司 Light emitting device assembly structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059966A (en) * 2007-08-31 2009-03-19 Panasonic Corp Mounting board and light emitting module
JP2018503984A (en) * 2015-05-27 2018-02-08 深▲セン▼市華星光電技術有限公司 Light emitting device assembly structure

Also Published As

Publication number Publication date
JPH0416457Y2 (en) 1992-04-13

Similar Documents

Publication Publication Date Title
JPH0416457Y2 (en)
JPS62186189U (en)
JPS58188995U (en) Printed wiring board connector
JPS6279282U (en)
JPS6279284U (en)
JPH01163343U (en)
JPS61144667U (en)
JPH0440558U (en)
JPH0323970U (en)
JPS6221569U (en)
JPS63118263U (en)
JPS61111165U (en)
JPS61173145U (en)
JPH0455797U (en)
JPS6320472U (en)
JPS6346878U (en)
JPS6294678U (en)
JPH0316377U (en)
JPH0415869U (en)
JPS60129049U (en) Electrical equipment with operation display
JPH031465U (en)
JPS61157369U (en)
JPS6247169U (en)
JPH01177887U (en)
JPH02120858U (en)