JPS6287832U - - Google Patents
Info
- Publication number
- JPS6287832U JPS6287832U JP18034685U JP18034685U JPS6287832U JP S6287832 U JPS6287832 U JP S6287832U JP 18034685 U JP18034685 U JP 18034685U JP 18034685 U JP18034685 U JP 18034685U JP S6287832 U JPS6287832 U JP S6287832U
- Authority
- JP
- Japan
- Prior art keywords
- deposited
- copper
- layer
- vacuum
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は、本考案に係る銅蒸着フイルムの１例
を示す横断面図であり、第２図は、本考案に係る
銅蒸着フイルムの別の１例を示す横断面図である
。
１……耐熱性プラスチツクフイルム、２……銅
の真空蒸着層、３……アルミニウムの真空蒸着層
、４……アルミニウムの真空蒸着層。
第３図は、実施例１と比較例のフイルムについ
て保持時間に対する表面抵抗値を示すグラフであ
る。
FIG. 1 is a cross-sectional view showing one example of the copper-deposited film according to the present invention, and FIG. 2 is a cross-sectional view showing another example of the copper-deposited film according to the present invention. 1... Heat-resistant plastic film, 2... Vacuum vapor deposited copper layer, 3... Vacuum vapor deposited aluminum layer, 4... Vacuum vapor deposited aluminum layer. FIG. 3 is a graph showing the surface resistance value versus retention time for the films of Example 1 and Comparative Example.
Claims (1)
真空蒸着層を有する銅蒸着フイルムにおいて、銅
の真空蒸着層の上に５０〜５００Åの厚さのアル
ミニウムの真空蒸着層が設けられていることを特
徴とする銅蒸着フイルム。 (2) 耐熱性プラスチツクフイルムがポリエチレ
ンテレフタレートフイルムである実用新案登録請
求の範囲第１項記載の銅蒸着フイルム。 (3) アルミニウムの真空蒸着層の厚さが５０〜
２００Åである実用新案登録請求の範囲第１項記
載の銅蒸着フイルム。 (4) 耐熱性プラスチツクフイルムと銅の真空蒸
着層との間に下地層として１５０Å以下のアルミ
ニウムの真空蒸着層が設けられている実用新案登
録請求の範囲第１項〜第３項のいずれかに記載の
銅蒸着フイルム。[Claims for Utility Model Registration] (1) In a copper-deposited film having a vacuum-deposited layer of copper on a heat-resistant plastic film base material, vacuum-deposited aluminum with a thickness of 50 to 500 Å on the vacuum-deposited layer of copper. A copper vapor-deposited film characterized by being provided with a layer. (2) The copper vapor-deposited film according to claim 1, wherein the heat-resistant plastic film is a polyethylene terephthalate film. (3) The thickness of the vacuum-deposited aluminum layer is 50~
The copper vapor-deposited film according to claim 1, which has a thickness of 200 Å. (4) Any one of claims 1 to 3 for registering a utility model in which a vacuum-deposited layer of aluminum with a thickness of 150 Å or less is provided as a base layer between the heat-resistant plastic film and the vacuum-deposited copper layer. Copper deposited film as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180346U JPH0333469Y2 (en) | 1985-11-22 | 1985-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180346U JPH0333469Y2 (en) | 1985-11-22 | 1985-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6287832U true JPS6287832U (en) | 1987-06-04 |
| JPH0333469Y2 JPH0333469Y2 (en) | 1991-07-16 |
Family
ID=31124218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985180346U Expired JPH0333469Y2 (en) | 1985-11-22 | 1985-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333469Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787359A (en) * | 1980-09-22 | 1982-05-31 | Gen Electric | Transfer laminating method for copper sheet and film and laminate |
| JPS57142355A (en) * | 1981-01-22 | 1982-09-03 | Gen Electric | Transfer laminating method for copper film and its product |
-
1985
- 1985-11-22 JP JP1985180346U patent/JPH0333469Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787359A (en) * | 1980-09-22 | 1982-05-31 | Gen Electric | Transfer laminating method for copper sheet and film and laminate |
| JPS57142355A (en) * | 1981-01-22 | 1982-09-03 | Gen Electric | Transfer laminating method for copper film and its product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0333469Y2 (en) | 1991-07-16 |
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