JPS6287904A - Optical waveguide device and its manufacturing method - Google Patents

Optical waveguide device and its manufacturing method

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Publication number
JPS6287904A
JPS6287904A JP60227701A JP22770185A JPS6287904A JP S6287904 A JPS6287904 A JP S6287904A JP 60227701 A JP60227701 A JP 60227701A JP 22770185 A JP22770185 A JP 22770185A JP S6287904 A JPS6287904 A JP S6287904A
Authority
JP
Japan
Prior art keywords
layer
optical waveguide
chalcogenide glass
glass layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60227701A
Other languages
Japanese (ja)
Inventor
Hidemi Sato
秀己 佐藤
Yasuo Hiyoshi
日良 康夫
Aizo Kaneda
金田 愛三
Shigeharu Tsunoda
重晴 角田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60227701A priority Critical patent/JPS6287904A/en
Publication of JPS6287904A publication Critical patent/JPS6287904A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To decrease loss and to improve stability by providing a metal diffused layer down to a desired depth from the boundary of a chalcogenide glass layer in contact with a thin metallic film layer. CONSTITUTION:The chalcogenide glass layer 2 provided on a substrate 1 and the thin metallic film layer 3 formed on the chalcogenide glass layer are provided. This optical waveguide element 6 is provided with the metal diffused layer down to the desired depth from the boundary of the chalcogenide glass layer 2 in contact with the thin metallic film layer 3. Such optical waveguide element is formed by forming the chalcogenide glass layer 2 on the substrate 1, forming the thin metallic film 3 on the chalcogenide glass layer and irradiating an electron beam 4 onto the thin metallic film thereby forming the metal diffused layer 5 down to the desired depth from the boundary of the chalcogenide glass layer 2 in contact with the thin metallic film layer. The optical waveguide 5 having a low loss and good stability is thus easily and inexpensively formed with high accuracy.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は光導波路素子とその製造方法に係シ、特に光の
閉じ込め効率が良好であり、安定性の優れた光導波路素
子とその製造方法に関する。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an optical waveguide device and a method for manufacturing the same, and particularly relates to an optical waveguide device with good light confinement efficiency and excellent stability and a method for manufacturing the same. .

〔発明の背景〕[Background of the invention]

従来、光導波路素子は、 (a)  LiNb01またはLiTaO3の単結晶薄
膜を、蒸着またはスパッタリングによってこれら材料の
屈折率よりも低い屈折率の基板表面に付着させたもの(
特開昭57−85008 )、 (b)  LiNbO3の基板にTiを拡散して光導波
路を形成したもの(特開昭57−88411 )等、が
知られている。そして、特に後者が一般に広く用いられ
ている。
Conventionally, optical waveguide devices are made by (a) depositing a single crystal thin film of LiNb01 or LiTaO3 on a substrate surface with a refractive index lower than that of these materials by vapor deposition or sputtering (
JP-A-57-85008) and (b) a LiNbO3 substrate in which Ti is diffused to form an optical waveguide (JP-A-57-88411) are known. In particular, the latter is generally widely used.

しかし、TIイオン拡散温度は1000℃前後であシ、
このような高温で熱処理すると大気中においてもLi、
Oが外部拡散してしまう。そして光導波路の屈折率分布
が広がり、導波路の閉じ込め効率が悪くなシ、伝搬損失
が増加してしまった。
However, the TI ion diffusion temperature is around 1000℃,
When heat treated at such high temperatures, Li,
O diffuses outside. Then, the refractive index distribution of the optical waveguide widened, the confinement efficiency of the waveguide deteriorated, and propagation loss increased.

塘た、上述の光導波路を形成するには、高温操作を必要
とし、しかもTiのパターンを形成するのにホトリソグ
ラフィ一工程が必要である。したがって多くの製造工程
が必要であシ、生産性に問題があった。
Furthermore, forming the optical waveguide described above requires high-temperature operation, and one photolithography step is required to form the Ti pattern. Therefore, many manufacturing steps are required, which poses a problem in productivity.

〔発明の目的〕[Purpose of the invention]

本発明の目的は上記した従来技術の欠点をなくし、低損
失で、安定性が良好で、しかも製造工程が簡単な光導波
路素子とその製造方法を提供するにある。
SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to provide an optical waveguide element that has low loss, good stability, and a simple manufacturing process, and a method for manufacturing the same.

〔発明の概要〕[Summary of the invention]

上記目的は基板と、この基板上に形成したカルコゲナイ
ドがラス層と、このカルコゲナイドガラス層上に形成し
た金属薄膜とからなり、かつ上記カルコゲナイドガラス
層の上記金属薄膜層に接する界面から所望の深さにわた
って金属拡散層が設けられている光導波路素子と、この
光導波路素子を基板上にカルコゲナイドがラス層を形成
し、このカルコゲナイド127層上に金属薄膜を形成し
、この金属薄膜上に電子ビームを照射して上記カルコゲ
ナイドがラス層の上記金属薄膜層に接する界面から所望
の深さにわたって金属拡散層を形成することで達成され
る。
The above purpose is to provide a substrate, a lath layer of chalcogenide formed on this substrate, and a metal thin film formed on this chalcogenide glass layer, and to have a desired depth from the interface of the chalcogenide glass layer in contact with the metal thin film layer. An optical waveguide element is provided with a metal diffusion layer over the entire length, a lath layer of chalcogenide is formed on a substrate of this optical waveguide element, a metal thin film is formed on this chalcogenide 127 layer, and an electron beam is irradiated onto this metal thin film. This is achieved by irradiating the chalcogenide to form a metal diffusion layer over a desired depth from the interface of the lath layer where it contacts the metal thin film layer.

以下、本発明で使用する材料などについて説明する。基
板は、(a)単結晶シリコン、多結晶シリコンなどのシ
リコン、(b) GaAs、InP 、  InAs 
、などの半導体、(c) LiNb0. 、  LiT
aO3などの光学結晶材料、(d)石英がラス、パイレ
ックスガラスクラウンガラスなどのシリカ系ガラスを用
いる。
The materials used in the present invention will be explained below. The substrate is (a) silicon such as single crystal silicon or polycrystalline silicon, (b) GaAs, InP, or InAs.
, (c) LiNb0. , LiT
An optical crystal material such as aO3, (d) silica-based glass such as quartz lath or Pyrex glass crown glass is used.

カルコゲナイドがラスは、上記基板上に設ける。A chalcogenide lath is provided on the substrate.

カルコゲナイドガラスとは、硫黄、セレン、テルルの少
なくともいずれかを含むアモルファス材料全般の呼称で
ある。具体的にはAl1 S3 、 A128113 
rAs3Sey  、   G@s4   、   A
+lff1 Tag   、   GoTo  、  
 Go、6As35Te26SH,CdSe 、  G
e52 、  Nurseなどであシ、屈折率は2.1
〜3.1である。
Chalcogenide glass is a general term for amorphous materials containing at least one of sulfur, selenium, and tellurium. Specifically, Al1 S3, A128113
rAs3Sey, G@s4, A
+lff1 Tag, GoTo,
Go, 6As35Te26SH, CdSe, G
e52, Nurse, etc., the refractive index is 2.1
~3.1.

基板上に設けるカルコゲナイドがラス膜は真空蒸着やス
パッタリング法などで形成する。真空蒸着の条件は、基
板温度5〜100℃、真空度1×10″″4〜I X 
10−’ wsHg 、成膜速度10〜too X/冠
であり、好ましくは基板温度40〜60℃、真空度I 
X 10”〜I X 10−’ wa Hg、成膜速度
40〜60X/濃である。
The chalcogenide lath film provided on the substrate is formed by vacuum evaporation, sputtering, or the like. The conditions for vacuum evaporation are: substrate temperature 5 to 100°C, degree of vacuum 1 x 10''4 to I
10-'wsHg, film-forming rate 10-too X/crown, preferably substrate temperature 40-60°C, vacuum degree I
X 10'' to I X 10-' wa Hg, and the film formation rate was 40 to 60X/concentration.

スフ4フタリングの条件は、真空蒸着とほぼ同じであシ
、成膜速度が1〜20X/Igであシ、好ましくは2〜
IOX/8である。
The conditions for 4-filling are almost the same as those for vacuum evaporation, and the film formation rate is 1 to 20X/Ig, preferably 2 to 20X/Ig.
It is IOX/8.

基板上に形成したカルコゲナイド127層上に形成され
る金属膜は、kt、  Au、  Ag、  Cu、 
 TI。
The metal film formed on the chalcogenide 127 layer formed on the substrate includes kt, Au, Ag, Cu,
T.I.

Nl、Crなどである。なかでも、At、  Au、 
 Ag。
These include Nl and Cr. Among them, At, Au,
Ag.

Cuは薄膜形成が容易なので特に重要である。具体的に
は、真空蒸着、スフ2ツタリング法などにより基板温度
25〜90℃、真空度I X 10−’ 〜I X 1
0−’mHg。
Cu is particularly important because it is easy to form a thin film. Specifically, the substrate temperature is 25 to 90°C and the degree of vacuum is I X 10-' to I
0-' mHg.

成膜速度2〜100λ/’r膜厚200〜5000Xで
あり、好1しくけ、基板温度40〜60’C1真空度5
 X 10−’〜I X 10−’ mxHg、成ML
速度5〜501/ g 、J[厚500〜3000にで
ある。
Film formation rate: 2-100λ/'r Film thickness: 200-5000X, preferably 1, substrate temperature: 40-60'C, degree of vacuum: 5
X 10-' ~ I X 10-' mxHg, adult ML
The speed is 5-501/g, and the thickness is 500-3000.

上記した金属薄膜に照射する電子ビームは加速電圧10
〜500 kV 、スポット径をO01〜1μrrLK
収束させ所望の導波路形状に走査させる。もしくは、C
r 、 Wなどに所望の導波路形状を・母ターンニング
したマスクを用いて、加速電圧lO〜500kVの電子
ビームを均一に走査させても良い。上記の結果、電子ビ
ームが照射された部分の金属はカルコゲナイドガラス層
に拡散し、金属の拡散したカルコゲナイドプラスの屈折
率が高くなり、所望の埋込み型三次元光導波路素子が形
成できる。なお、電子ビーム照射後の不要な金属はエツ
チングによシ除去する。
The electron beam irradiated onto the metal thin film mentioned above has an acceleration voltage of 10
~500 kV, spot diameter O01~1μrrLK
It is focused and scanned into the desired waveguide shape. Or C
It is also possible to uniformly scan an electron beam with an accelerating voltage of 10 to 500 kV using a mask in which r, W, etc. are patterned with a desired waveguide shape. As a result of the above, the metal in the portion irradiated with the electron beam is diffused into the chalcogenide glass layer, and the refractive index of the chalcogenide plus in which the metal is diffused increases, making it possible to form a desired buried three-dimensional optical waveguide element. Note that unnecessary metal after electron beam irradiation is removed by etching.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を実施例により詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to Examples.

実施例1 第1図に示すように、基板1に厚さ400μmのシリコ
ン単結晶を用い、これを40 ’Cに保ち、真空度5X
10″″’ tmHg、成膜速度5X/8にて厚さ2μ
mのAs!S1製カルコrナイドプラス層2をスパッタ
リング法で形成した。このカルコゲナイドガラスの屈折
率は2.41であった。
Example 1 As shown in Fig. 1, a silicon single crystal with a thickness of 400 μm was used as the substrate 1, and this was maintained at 40'C and the degree of vacuum was 5X.
10″″’ tmHg, thickness 2μ at film formation rate 5X/8
As of m! A chalconide plus layer 2 manufactured by S1 was formed by sputtering. The refractive index of this chalcogenide glass was 2.41.

なお、As2S3カルコrナイドガラスは、 AmとS
の粉末を真空中で800℃に加熱して溶融し、これを急
冷してガラス化したのちタービットとして成形したもの
を用いた。
In addition, As2S3 chalconide glass has Am and S
The powder was heated to 800° C. in a vacuum to melt it, rapidly cooled to vitrify it, and then molded into a turbid.

次に、上記力ルコダナイドがラス層2上に金属薄膜層3
として、Atを真空蒸着した。条件は、基板温度50℃
、X生変I X 10−’ mHg 、 成膜速度50
′L4゜膜厚1000 gである。
Next, the above-mentioned force lucodanide is applied to the metal thin film layer 3 on the lath layer 2.
As a result, At was vacuum-deposited. Conditions are substrate temperature 50℃
, X transformation I X 10-' mHg, film formation rate 50
'L4゜film thickness is 1000 g.

次に、上記金属薄膜層3上に加速電圧25kV、スポッ
ト径0.5μmの電子ビーム4を照射した。その後、不
要な金属薄膜3をエツチングにより除去した結果、第2
,3図に示すように幅および深さともに約1μmの埋込
み形三次元光導波路5を形成した。三次元光導波路5の
屈折率は2.43であった。
Next, the metal thin film layer 3 was irradiated with an electron beam 4 having an acceleration voltage of 25 kV and a spot diameter of 0.5 μm. After that, as a result of removing unnecessary metal thin film 3 by etching, the second
, 3, a buried three-dimensional optical waveguide 5 having a width and depth of approximately 1 μm was formed. The refractive index of the three-dimensional optical waveguide 5 was 2.43.

なお、上記したエツチングは、リン酸に硝酸、酢酸およ
び水を少量加えた16:1:2:1の容積比の混合液中
に約1分浸漬して行なった。
The above-mentioned etching was performed by immersing the film for about 1 minute in a mixture of phosphoric acid, nitric acid, acetic acid, and water in a volume ratio of 16:1:2:1.

三次元光導波路5の導波特性を確認するため、波長1.
3μm1出力5mWの半導体レーデの出力光をレンズ系
で集光し、三次元光導波路5に結合させた。その結果、
伝搬損失0.1 dB/cmと良好な結果が得られた。
In order to confirm the waveguide characteristics of the three-dimensional optical waveguide 5, wavelength 1.
Output light from a semiconductor radar with a size of 3 μm and an output of 5 mW was focused by a lens system and coupled to a three-dimensional optical waveguide 5. the result,
Good results were obtained with a propagation loss of 0.1 dB/cm.

上記した光導波路素子6を150℃、500h高温放置
し、伝搬損失の変化を測定した結果、伝搬損失の増加は
0.05 dB/−Fll  と良好な結果を得た。
The optical waveguide device 6 described above was left at a high temperature of 150° C. for 500 hours and the change in propagation loss was measured. As a result, the increase in propagation loss was 0.05 dB/-Fll, which was a good result.

実施例2 第4図に示す縮小投影法で作成したY分岐光導波路のパ
ターンを形成したCr製マスク7を実施例1と同様に作
成したStの基板1とこの上に形成したAl1183製
力ルコrナイドIラス層2とその層2上に形成したAt
製金属薄膜層3よりなる積層物の金属薄膜層上に第5図
のように密着させる。次に、加速電圧100kVの電子
ビームをCr製マスク8上に均一に走査させる。その後
、Cr[マスク7を除去し、At製金属薄膜をエツチン
グした結果、第6図に示すように、屈折率2゜45のY
分岐光導波路8が形成できる。このようにして作成した
Y分岐光導波路素子9は、分岐比がほぼ1:1であり、
伝搬損失も0.15 dB/crRと良好な結果が得ら
れた。また、実施例1と同様に150℃、soo h高
温放置した結果、伝搬損失の増加は0.06 dB/m
と良好な結果を得た。
Example 2 A Cr mask 7 with a Y-branch optical waveguide pattern formed by the reduction projection method shown in FIG. r nide I lath layer 2 and At formed on the layer 2
The metal thin film layer 3 is brought into close contact with the metal thin film layer of the laminate as shown in FIG. Next, an electron beam with an acceleration voltage of 100 kV is uniformly scanned over the Cr mask 8. After that, the Cr[mask 7 was removed and the At metal thin film was etched. As a result, as shown in FIG.
A branched optical waveguide 8 can be formed. The Y-branch optical waveguide device 9 created in this way has a branching ratio of approximately 1:1,
Good results were obtained with a propagation loss of 0.15 dB/crR. Also, as in Example 1, as a result of being left at a high temperature of 150°C, the increase in propagation loss was 0.06 dB/m.
and obtained good results.

〔発明の効果〕〔Effect of the invention〕

以上述べた様に本発明によれば、従来品に比べて、簡便
かつ高精度で低損失、しかも安定性が良好な光導波路が
安価に形成できる。さらに本発明で明らかにした光導波
路の作成方法は、光通信用光合分波器をはじめ、今後光
集積回路の形成に役立つ。
As described above, according to the present invention, it is possible to form an optical waveguide that is simple, highly accurate, has low loss, and has good stability at a lower cost than conventional products. Furthermore, the method for producing an optical waveguide disclosed in the present invention will be useful in the formation of optical integrated circuits in the future, including optical multiplexers/demultiplexers for optical communications.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す光導波路素子の側面図
、第2図は本発明において電子ビームにより三次元光導
波路の形成状態を示す側面図、第3図は本発明の一実施
例を示す光導波路素子の斜視図、第4図乃至第6図は本
発明の他の実施例を示す図であり、第4図はCrマスク
を示す斜視図、第5図はY分岐光導波路の形成状態を示
す斜視図、第6図はY分岐光導波路素子の斜視図である
。 1・・・基板、2・・・カルコゲナイドガラス、3・・
・金属薄膜、4・・・電子ビーム、5・・・三次元光導
波路、6・・・光導波素子、7・・・マスク、8・・・
Y分岐光導波路、9・・・Y分岐光導波素子。 代理人 弁理士 秋 本 正 実 第 1 図 塔 5 図
FIG. 1 is a side view of an optical waveguide device showing an embodiment of the present invention, FIG. 2 is a side view showing how a three-dimensional optical waveguide is formed by an electron beam in the present invention, and FIG. 3 is an embodiment of the present invention. A perspective view of an optical waveguide element showing an example, FIGS. 4 to 6 are views showing other embodiments of the present invention, FIG. 4 is a perspective view showing a Cr mask, and FIG. 5 is a Y-branch optical waveguide. FIG. 6 is a perspective view of a Y-branch optical waveguide element. 1...Substrate, 2...Chalcogenide glass, 3...
- Metal thin film, 4... Electron beam, 5... Three-dimensional optical waveguide, 6... Optical waveguide element, 7... Mask, 8...
Y-branch optical waveguide, 9...Y-branch optical waveguide element. Agent Patent Attorney Tadashi Akimoto Jitsu 1 Figure 5

Claims (1)

【特許請求の範囲】 1、基板と、この基板上に形成したカルコゲナイドガラ
ス層と、このカルコゲナイドガラス層上に形成した金属
薄膜とからなり、かつ上記カルコゲナイドガラス層の上
記金属薄膜層に接する界面から所望の深さにわたって金
属拡散層が設けられていることを特徴とする光導波路素
子。 2、基板上にカルコゲナイドガラス層を形成し、このカ
ルコゲナイドガラス層上に金属薄膜を形成し、この金属
薄膜上に電子ビームを照射して上記カルコゲナイドガラ
ス層の上記金属薄膜層に接する界面から所望の深さにわ
たって金属拡散層を形成することを特徴とする光導波路
素子の製造方法。
[Claims] 1. Consists of a substrate, a chalcogenide glass layer formed on this substrate, and a metal thin film formed on this chalcogenide glass layer, and from the interface of the chalcogenide glass layer in contact with the metal thin film layer. An optical waveguide element characterized in that a metal diffusion layer is provided over a desired depth. 2. Form a chalcogenide glass layer on a substrate, form a metal thin film on this chalcogenide glass layer, and irradiate the metal thin film with an electron beam to form a desired shape from the interface of the chalcogenide glass layer in contact with the metal thin film layer. A method for manufacturing an optical waveguide device, comprising forming a metal diffusion layer over a depth.
JP60227701A 1985-10-15 1985-10-15 Optical waveguide device and its manufacturing method Pending JPS6287904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60227701A JPS6287904A (en) 1985-10-15 1985-10-15 Optical waveguide device and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60227701A JPS6287904A (en) 1985-10-15 1985-10-15 Optical waveguide device and its manufacturing method

Publications (1)

Publication Number Publication Date
JPS6287904A true JPS6287904A (en) 1987-04-22

Family

ID=16864990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60227701A Pending JPS6287904A (en) 1985-10-15 1985-10-15 Optical waveguide device and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS6287904A (en)

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