JPS6288568A - Abrasive - Google Patents

Abrasive

Info

Publication number
JPS6288568A
JPS6288568A JP22884285A JP22884285A JPS6288568A JP S6288568 A JPS6288568 A JP S6288568A JP 22884285 A JP22884285 A JP 22884285A JP 22884285 A JP22884285 A JP 22884285A JP S6288568 A JPS6288568 A JP S6288568A
Authority
JP
Japan
Prior art keywords
hollow ceramic
abrasive material
abrasive
beads
glass beads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22884285A
Other languages
Japanese (ja)
Inventor
Kazunori Tsujinaga
和徳 辻永
Masayuki Murai
村井 昌幸
Hiroshi Kagawa
香川 博司
Masami Ogura
小倉 正美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP22884285A priority Critical patent/JPS6288568A/en
Publication of JPS6288568A publication Critical patent/JPS6288568A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To stabilize the performance of abrasives for a long time of period by constituting the abrasive substantially from hollow ceramic beads consisting of silica and alumina and synthetic resin. CONSTITUTION:Hollow ceramic beads formed substantially of spherical substance (outer diameter: 0.5-20mu) consisting of silica and alumina and having in the interior respectively cavities having the outer diameter of 1/4-1/2 of the outer diameter are dispersed in synthetic resin. The amount of mixed spherical substances is preferably 10-30wt%. Then, said substances are crushed to provide a desired grain size distribution of abrasives by sorting. This hollow ceramic bead has about 7 Mohs' hardness and about same polishing force as glass bead, while the compressive strength is about 20 times that of glass bead so that an amount of beads broken in use is very few and the abrasives can be used with the stable performance for a long time.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は研磨材に関し、長期間にわたり安定した研磨性
能を有する研磨材に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an abrasive material, and more particularly, to an abrasive material having stable abrasive performance over a long period of time.

〈従来技術と問題点〉 従来、一般的に使用されている硬質研磨材としてはカー
ボランダム、エメリー、アランダム、ホワイトアランダ
ム、グリーンカーボランダム、砂石、硅砂、ツバキュラ
イト、七ランダム、鉄粉、ガラスピーズ等があった。し
かし、ガラスピーズ以外は不定形状をしているため、被
研磨体の研磨後の表面は凹凸が激しく、かつ尖鋭な凸部
を有しているという特徴があり、研磨後表面の光沢は大
きく低下してしまっていた。又、研磨後メッキ加工や半
田付けを行なう際には尖鋭な凸部の存在がメッキ光沢の
減少や半田濡れ性の悪化を引き起こし不都合な場合があ
った。一方ガラスビーズは球状のため上記の様な現象が
発生せず半光沢の研磨表面を得る事ができ、さらにメッ
キや半田付は作業車での不都合も引き起こさない。
<Prior Art and Problems> Conventionally, commonly used hard abrasives include carborundum, emery, alundum, white alundum, green carborundum, sand stone, silica sand, tubaculite, heptadium, iron powder, There were glass peas etc. However, since glass beads have an irregular shape, the surface of the polished object is highly uneven and has sharp convexities, and the gloss of the polished surface is significantly reduced. I had done it. Further, when plating or soldering is performed after polishing, the presence of sharp convex portions may cause problems such as a decrease in plating gloss and deterioration of solder wettability. On the other hand, since glass beads are spherical, the above-mentioned phenomenon does not occur and a semi-glossy polished surface can be obtained, and furthermore, plating and soldering do not cause any inconvenience on work vehicles.

半光沢の研磨表面と後工程のメッキや半田付は作業の容
易さのためガラスピーズは硬質研磨材の中でも独特の地
位を占め多くの用途で使用されている。しかしながら、
ガラスピーズにも以下の様な欠点がある。即ち、例えば
高圧でブラスト加工を行なったりして強い衝撃を加えた
場合、そのもろさのため容易に破壊されてしまうという
欠点がある。ガラスピーズは破壊された後はエツジを有
する形状になってしまうため、多量に破壊された場合に
はその球という形状に起因する独特の研磨性能自体も失
われてしまう。即ち使用中にガラスピーズの破壊が起こ
ると、それとともに研磨性能が変化してしまうのである
Glass beads occupy a unique position among hard abrasive materials because of their semi-gloss polished surface and ease of plating and soldering in the post-processing process, and are used in many applications. however,
Glass peas also have the following drawbacks. That is, if a strong impact is applied, for example by blasting under high pressure, it has the disadvantage that it is easily destroyed due to its brittleness. After glass beads are broken, they become shaped with edges, so if a large number of glass beads are broken, the unique polishing performance due to their spherical shape is also lost. That is, if the glass beads break during use, the polishing performance changes accordingly.

近年IC等のエポキシ系モールド材のパリ取り用研磨材
としてその適度な硬さと後工程のメッキ、半田付は作業
の容易さのためガラスピーズが使用されているが、この
場合にも同様の問題点がある。
In recent years, glass beads have been used as an abrasive for deburring epoxy molding materials such as ICs due to their moderate hardness and ease of plating and soldering in post-processes, but the same problem occurs in this case as well. There is a point.

IC等のモールド材のパリ取りを行なう際には皐−ルド
成型品の表面を損傷すると、美観を損なう上、損傷部か
ら水分が浸透し半導体素子の信頼性に悪影響を及ぼすと
いう重大な問題を引き起こすが、ガラスピーズを研磨材
として用いた場合、その破壊とともに、ガラスピーズが
不定形になってしまうためモールド表面の損傷が激しく
なってしまうという問題点がある。さらに、破壊された
ガラスピーズの破片がリードフレームに突きささり、後
工程のメッキ、半田付けにおいて外観不良を招いたりリ
ードフレームの腐食の発生原因となるという問題点もあ
る。
When deburring mold materials such as ICs, if the surface of the molded product is damaged, it not only spoils the aesthetics but also causes serious problems such as moisture seeping through the damaged area and negatively affecting the reliability of the semiconductor element. However, when glass beads are used as an abrasive, there is a problem in that the glass beads become irregular in shape as well as being destroyed, resulting in severe damage to the mold surface. Furthermore, there is another problem in that fragments of the broken glass beads stick to the lead frame, causing poor appearance during plating and soldering in subsequent steps, and causing corrosion of the lead frame.

上記の様に、ガラスピーズを用いてIC等のモールド成
型品のパリ取りを行なうと、初期の性能は良好であるが
、破壊された後はガラスピーズは不定形となるため、ガ
ラスピーズの特徴が失われてしまう。゛ この欠点を解決するため、ガラスピーズと同等の性能を
持ち長期間使用可能である研磨材の開発が望まれていた
As mentioned above, when glass beads are used to remove burrs from molded products such as ICs, the initial performance is good, but after being broken, the glass beads become irregularly shaped, so the characteristics of glass beads are will be lost. ``In order to solve this drawback, it has been desired to develop an abrasive that has the same performance as glass beads and can be used for a long period of time.

く問題点を解決するための手段〉 本発明者らは上記した問題点を解決するために鋭意研究
を重ねた結果、構成成分として実質的にシリカとアルミ
ナから成る中空セラミックビーズが有用である事を見℃
・出し本発明に到達した。
Means for Solving the Problems> As a result of extensive research by the present inventors to solve the above problems, we have found that hollow ceramic beads consisting essentially of silica and alumina are useful. See ℃
・Achieved the present invention.

本発明でいう中空セラミックスビーズとは、実質的に°
シリカとアルミナとからなる球状物質で内部に外部直径
の1/4〜1/2の直径の空洞部を持つ物を言い、一般
的には外径は0.5〜20μであって、例えば丸和バイ
オケミカル■のZEEO8PHE−RESの様な物であ
る。シリカとアルミナの割合は通常重量比で99:1〜
1:99、好ましくは95:/〜5:95である。
The hollow ceramic beads referred to in the present invention are essentially
A spherical substance made of silica and alumina that has a cavity with a diameter of 1/4 to 1/2 of the outer diameter. Generally, the outer diameter is 0.5 to 20μ, such as Maruwa It is something like ZEEO8PHE-RES from Biochemical ■. The ratio of silica and alumina is usually 99:1 to 99:1 by weight.
The ratio is 1:99, preferably 95:/-5:95.

この中空セラミックビーズは非常に大きな圧縮強さを持
つ事が特徴である。その圧縮強度は粒径が2μの物で約
4000 kg/ctlであり、同一粒径のガラスピー
ズの約20倍の強度を持っている。従って使用中に破砕
される量が非常に少ない。前述したガラスピーズの問題
点は、プラスト中にガラスピーズが破砕されるために引
き起こされることであるから、中空セラミックビーズの
使用によりこの問題は解決される。又、この中空セラミ
ックビーズの硬度はモース硬度で約7であり、ガラスピ
ーズと同じである。従って研磨力はガラスピーズと同程
度の物が得られる。
These hollow ceramic beads are characterized by extremely high compressive strength. Its compressive strength is about 4000 kg/ctl for particles with a particle size of 2μ, which is about 20 times stronger than glass beads of the same particle size. Therefore, the amount crushed during use is very small. Since the aforementioned problem with glass beads is caused by the glass beads being crushed during plastination, the use of hollow ceramic beads solves this problem. Further, the hardness of these hollow ceramic beads is approximately 7 on the Mohs scale, which is the same as that of glass beads. Therefore, a polishing force comparable to that of glass beads can be obtained.

中空セラミックビーズな研磨材として用いる場合、その
粒径が小さいと研磨材がホッパー内でバッキングを起こ
し、作業上都合が悪い場合がある。
When used as an abrasive material in the form of hollow ceramic beads, if the particle size is small, the abrasive material may back up in the hopper, which may be inconvenient for work.

この問題を解決するためには中空セラミックビーズな樹
脂中に分散させその後粉砕し、分級によって希望の粒度
分布の研磨材を得れば良い。この際に用いられる合成樹
脂は例えばポリスチレン、ポリ塩化ビニル、ポリアセタ
ール、ポリカーボネート、ポリエチレンテレフタレート
、ナイロン等の熱可塑性樹脂でも良いし、不飽和ポリエ
ステル、メラミン樹脂、フェノール樹脂、エポキシ樹脂
、尿素樹脂等の熱硬化樹脂でも良(、更に必要に応、じ
てこれらの樹脂を混合使用しても良い。中でもポリアセ
タール樹脂と不飽和ポリエステル樹脂が、製造の容易さ
、物性、コストの点で好ましい。また必要に応じて界面
活性剤、分散剤、沈降防止剤、静電防止剤、各種カップ
リング剤を加えても差しつかえない。
In order to solve this problem, it is possible to obtain an abrasive material with a desired particle size distribution by dispersing it in a resin in the form of hollow ceramic beads, then crushing it, and then classifying it. The synthetic resin used in this case may be a thermoplastic resin such as polystyrene, polyvinyl chloride, polyacetal, polycarbonate, polyethylene terephthalate, or nylon, or a thermoplastic resin such as unsaturated polyester, melamine resin, phenolic resin, epoxy resin, or urea resin. A cured resin may be used (and if necessary, these resins may be mixed and used.Among them, polyacetal resin and unsaturated polyester resin are preferable in terms of ease of manufacture, physical properties, and cost. Depending on the situation, surfactants, dispersants, antisettling agents, antistatic agents, and various coupling agents may be added.

合成樹脂に中空セラミンクビーズを分散させて研磨材を
作る場合、その混合量が少ないと研磨力が小さくなり好
ましくない。又、混合量が多過ぎると樹脂のバインダー
効果が少な(なり、合成樹脂部の破壊が起こりやすくな
り研磨材の微粉化が速く起こり、また研磨材がホッパー
内でバッキングを起こし易(なり好ましくない。
When making an abrasive material by dispersing hollow ceramic beads in a synthetic resin, if the amount of the abrasive material mixed is small, the abrasive power becomes low, which is not preferable. In addition, if the mixing amount is too large, the binder effect of the resin will be low (this will cause the synthetic resin part to easily break down, the abrasive will quickly become pulverized, and the abrasive will tend to back up in the hopper (which is undesirable). .

不飽和ポリエステル樹脂又はポリアセタール樹脂を用い
た場合、中空セラミックピーズの混合量は研磨材100
重量部中5〜50重量部、好ましくは10〜30重量部
である。
When using unsaturated polyester resin or polyacetal resin, the amount of hollow ceramic beads mixed is 100% of the abrasive material.
It is 5 to 50 parts by weight, preferably 10 to 30 parts by weight.

中空セラミックビーズを合成樹脂中に混合させた研磨材
を製造するためには以下の様にすれば良い0 合成樹脂が熱硬化性樹脂である場合は、例えばディスバ
ー、三本ロール、サンドミル、ボールミル、熱ロール等
の分散装置を用いて中空セラミックビーズを合成樹脂に
分散混合した後、通常の方法により樹脂を硬化させ、得
られた硬化物をクラッシャー、ハンマー等により粗粉砕
した後、各種の粉砕機例えばハンマーミル、円盤粉砕機
、節動破砕機等を用いて微粉砕すれば良い。
In order to manufacture an abrasive material in which hollow ceramic beads are mixed into a synthetic resin, the following procedure may be used.0 If the synthetic resin is a thermosetting resin, for example, a disburr, three-roll mill, sand mill, ball mill, After dispersing and mixing the hollow ceramic beads into synthetic resin using a dispersion device such as a hot roll, the resin is cured by a normal method, and the resulting cured product is coarsely crushed using a crusher, hammer, etc., and then crushed using various types of crushers. For example, it may be finely pulverized using a hammer mill, a disc pulverizer, an articulated pulverizer, or the like.

合成樹脂が熱可塑性樹脂の場合、分散は熱ロールで行な
うのが良い。粉砕を行なう場合、必要によっては冷凍粉
砕を行なっても良い。
When the synthetic resin is a thermoplastic resin, dispersion is preferably carried out using heated rolls. When pulverizing, freezing pulverization may be carried out if necessary.

この様にして得られた研磨材は必要により適当な粒度分
布になる様分級等の操作を行ない使用される。粒子の大
きさは通常0.05〜1.0mの範囲である。
The abrasive thus obtained is subjected to operations such as classification, if necessary, to obtain a suitable particle size distribution before use. The particle size usually ranges from 0.05 to 1.0 m.

く作用〉 本発明にかかる研磨材は圧縮強度の非常に大きい中空セ
ラミックビーズを使用しているため、従来のガラスピー
ズを使用した研磨材に比して破砕が起こりにくく、従っ
て長期間安定した性能を有する。
Effect> Since the abrasive material of the present invention uses hollow ceramic beads with extremely high compressive strength, it is less likely to fracture compared to abrasive materials that use conventional glass beads, and therefore has stable performance over a long period of time. has.

〈実施例〉 次に実施例、比較例により本発明の詳細な説明する。<Example> Next, the present invention will be explained in detail with reference to Examples and Comparative Examples.

なお、実施例及び比較例は湿式プラストにより評価を行
なっているが本発明は当然の事ながら乾式ブラスト、イ
ンペラ一式、バレル式等の通常の研磨方法においても有
用な研磨材を提供するものである。実施例中の部、%は
特記する以外は全て重量基準である。
Although the Examples and Comparative Examples were evaluated using wet blasting, the present invention naturally provides an abrasive material that is useful in conventional polishing methods such as dry blasting, impeller set, and barrel polishing. . All parts and percentages in the examples are based on weight unless otherwise specified.

比較例1 イソフタル酸1.5モル、マレイン酸無水物3.0モル
、フロピレンゲリコール3.5モル、エチレングリコー
ル1.45モルを加え、180〜210℃に保ち酸価が
35になる迄反応させた。得られたポリエステルを等重
量のスチレンに溶解し不飽和ポリエステル1を得た。
Comparative Example 1 1.5 mol of isophthalic acid, 3.0 mol of maleic anhydride, 3.5 mol of propylene gellicol, and 1.45 mol of ethylene glycol were added and kept at 180 to 210°C until the acid value reached 35. Made it react. The obtained polyester was dissolved in an equal weight of styrene to obtain unsaturated polyester 1.

不飽和ポリエステル1100部忙、6%ナフテン酸コバ
ルト0.5部、メチルエチルケトンパーオキサイドの5
5%品を1部加え良く混合した後常温にて20時間放置
し、その後100℃にて3時間加熱した。
1100 parts of unsaturated polyester, 0.5 parts of 6% cobalt naphthenate, 5 parts of methyl ethyl ketone peroxide
After adding 1 part of the 5% product and mixing well, the mixture was left at room temperature for 20 hours, and then heated at 100° C. for 3 hours.

得られた硬化物をクラッシャーにより粗粉砕した後、衝
撃粉砕機により更に微粉砕した。分級により60メツシ
ユパス、80メツシユオンのものを分収し研磨材1を得
た。
The obtained cured product was coarsely crushed using a crusher, and then further finely crushed using an impact crusher. By classification, 60 mesh passes and 80 mesh passes were separated to obtain abrasive material 1.

比較例2 ポリアセタール樹脂をエキスツルーダーにより押し出し
これを切断してベレットを作製した。これを液体窒素で
冷凍し粉砕を行なった後、分級により60メツシユパス
、80メツシユオンのものを分収し研磨材2を得た。
Comparative Example 2 A pellet was produced by extruding a polyacetal resin using an extruder and cutting it. This was frozen in liquid nitrogen and pulverized, and then classified to obtain abrasive material 2 with 60 mesh passes and 80 mesh passes.

比較例3 不飽和ポリエステル1と平均粒径10μのガラスピーズ
を混合し、以下比較例1と同様にして研磨材を得た。研
磨材中のガラスピーズの量を20.40.60部と変え
研磨材3〜5を得た。
Comparative Example 3 An abrasive material was obtained in the same manner as in Comparative Example 1 by mixing unsaturated polyester 1 and glass beads having an average particle size of 10 μm. Abrasives 3 to 5 were obtained by changing the amount of glass beads in the abrasive to 20.40.60 parts.

比較例4 ポリアセタール樹脂と平均粒径10μのガラスピーズな
熱ロールにて混合し、以下比較例2と同様にして研磨材
を得た。研磨材中のガラスピーズの量を20,40.6
0部と変え研磨材6〜8を得た。
Comparative Example 4 An abrasive was obtained in the same manner as in Comparative Example 2 by mixing with polyacetal resin using a heated roll made of glass beads having an average particle size of 10 μm. The amount of glass beads in the abrasive is 20,40.6
Abrasive materials 6 to 8 were obtained by changing the amount to 0 part.

実施例1 不飽和ポリエステル1と平均粒径10μ、中空の平均内
径が約3.3μのシリカアルミナ中空セラミックスビー
ズを混合し、以下比較例1と同様にして研磨材を得た。
Example 1 An abrasive material was obtained in the same manner as in Comparative Example 1 by mixing unsaturated polyester 1 and silica-alumina hollow ceramic beads having an average particle size of 10 μm and a hollow average inner diameter of about 3.3 μm.

研磨材中の中空セラミックスビーズの量を5.10,2
0,40160部と変え研磨材9〜13を得た。
The amount of hollow ceramic beads in the abrasive material is 5.10.2
Abrasive materials 9 to 13 were obtained by changing the amount to 0.40160 parts.

実施例2 ポリアセタール樹脂と実施例1で使用した中空セラミッ
クスビーズな熱ロールにて混合し、以下比較例2と同様
にして研磨材を得た。研磨材中の中空セラミックスビー
ズの量を5.10.20.40.60部と変え研磨材1
4〜18を得た。
Example 2 A polyacetal resin and the hollow ceramic beads used in Example 1 were mixed using a heated roll, and the same procedure as in Comparative Example 2 was carried out to obtain an abrasive material. Abrasive material 1 by changing the amount of hollow ceramic beads in the abrasive material to 5.10.20.40.60 parts
4 to 18 were obtained.

評価例 研磨材1〜18についてプラストテストを行なった。Evaluation example Plast tests were conducted on abrasives 1 to 18.

プラストテストは株式会社不二精機製造所製の液体ホー
ニング機LH−5を用いて行なった。スラリー濃度40
%、投射圧力4kg/cd、投射距離5crILにてI
Cのワンチップ当たり1秒間プラストし、パリ取り性能
、モールドの荒れについて評価した。評価は10段階評
価で行ない、最も良いものを10、実用上許容しうる程
度のものを5、最゛ も悪いものを1とした。
The plast test was conducted using a liquid honing machine LH-5 manufactured by Fuji Seiki Seisakusho Co., Ltd. Slurry concentration 40
%, projection pressure 4kg/cd, projection distance 5crIL
Each chip of C was blasted for 1 second, and the deburring performance and mold roughness were evaluated. Evaluation was performed on a 10-point scale, with 10 being the best, 5 being practically acceptable, and 1 being the worst.

結果を表−1に示す。The results are shown in Table-1.

又、同条件でアクリル板を一定時間プラストして重量減
少を測定し、その値が初期値の1/2になる迄の時間を
求めた。これは研磨材の使用可能時間の目安となる。こ
れをライフとし−て同じく表−1に示す。
Furthermore, under the same conditions, the acrylic plate was plated for a certain period of time, the weight loss was measured, and the time required for the value to become 1/2 of the initial value was determined. This is a guideline for the usable time of the abrasive. This is also shown in Table 1 as life.

なお、研磨材2では重量減少がみられず、従ってライフ
の測定は行なっていない。
It should be noted that no weight loss was observed in Abrasive Material 2, so the life was not measured.

参考評価例 先と同じブラスト条件にて、研磨材として平均粒径10
μのガラスピーズの325メツシユオンのものを用い鉄
板をプラストした。開始後25.50.75.100時
間ててサンプリングし、325メツシーオンの重量割合
をみる事により粒子の破砕度を評価した。
Reference evaluation example Under the same blasting conditions as the previous example, the average particle size was 10 as an abrasive.
An iron plate was plastered using 325 μm glass beads. Samples were taken 25,50,75,100 hours after the start, and the degree of crushing of the particles was evaluated by checking the weight percentage of 325 methion.

ガラスピーズの代わりに実施例1で使用した中空セラミ
ックスビーズの325メツシユオンのものを用い同様の
実験を行なった。
A similar experiment was conducted using the 325 mesh hollow ceramic beads used in Example 1 instead of the glass beads.

結果を表−2に示す。The results are shown in Table-2.

表−2 〈発明の効果〉 実施列かられかるように、本発明にかかる研磨材は中空
セラミックスビーズな用いているため、ガラスピーズを
用いた研磨材に比して同程度の研磨力を持ちながらも非
常に長い期間使用できる。
Table 2 <Effects of the Invention> As can be seen from the implementation column, since the abrasive material of the present invention uses hollow ceramic beads, it has the same level of polishing power as the abrasive material using glass beads. However, it can be used for a very long time.

Claims (5)

【特許請求の範囲】[Claims] (1)実質的にシリカとアルミナから成る中空セラミッ
クスビーズを構成成分のひとつとして成る研磨材。
(1) An abrasive material whose constituent components are hollow ceramic beads consisting essentially of silica and alumina.
(2)他の構成成分のひとつとして合成樹脂を含む特許
請求の範囲第1項記載の研磨材。
(2) The abrasive material according to claim 1, which contains a synthetic resin as one of the other components.
(3)中空セラミックスビーズ含有量が研磨材100重
量部中5〜50重量部である特許請求の範囲第2項記載
の研磨材。
(3) The abrasive material according to claim 2, wherein the content of hollow ceramic beads is 5 to 50 parts by weight based on 100 parts by weight of the abrasive material.
(4)合成樹脂が不飽和ポリエステル樹脂である事を特
徴とする特許請求の範囲第2項又は第3項記載の研磨材
(4) The abrasive material according to claim 2 or 3, wherein the synthetic resin is an unsaturated polyester resin.
(5)合成樹脂がポリアセタール樹脂である事を特徴と
する特許請求の範囲第2項又は第3項記載の研磨材。
(5) The abrasive material according to claim 2 or 3, wherein the synthetic resin is a polyacetal resin.
JP22884285A 1985-10-16 1985-10-16 Abrasive Pending JPS6288568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22884285A JPS6288568A (en) 1985-10-16 1985-10-16 Abrasive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22884285A JPS6288568A (en) 1985-10-16 1985-10-16 Abrasive

Publications (1)

Publication Number Publication Date
JPS6288568A true JPS6288568A (en) 1987-04-23

Family

ID=16882716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22884285A Pending JPS6288568A (en) 1985-10-16 1985-10-16 Abrasive

Country Status (1)

Country Link
JP (1) JPS6288568A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012113024A (en) * 2010-11-22 2012-06-14 Konica Minolta Business Technologies Inc Surface processing method for developer carrier and developing device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228271A (en) * 1975-08-29 1977-03-03 Hitachi Ltd Collet for pellet bonding
JPS5969265A (en) * 1982-10-15 1984-04-19 Fuji Seiki Seizosho:Kk Precision wet-type blasting projection material and its production method
JPS59227970A (en) * 1983-06-10 1984-12-21 Toshiba Corp Abrasive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228271A (en) * 1975-08-29 1977-03-03 Hitachi Ltd Collet for pellet bonding
JPS5969265A (en) * 1982-10-15 1984-04-19 Fuji Seiki Seizosho:Kk Precision wet-type blasting projection material and its production method
JPS59227970A (en) * 1983-06-10 1984-12-21 Toshiba Corp Abrasive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012113024A (en) * 2010-11-22 2012-06-14 Konica Minolta Business Technologies Inc Surface processing method for developer carrier and developing device

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