JPS6289719U - - Google Patents
Info
- Publication number
- JPS6289719U JPS6289719U JP18137485U JP18137485U JPS6289719U JP S6289719 U JPS6289719 U JP S6289719U JP 18137485 U JP18137485 U JP 18137485U JP 18137485 U JP18137485 U JP 18137485U JP S6289719 U JPS6289719 U JP S6289719U
- Authority
- JP
- Japan
- Prior art keywords
- central conductor
- outer periphery
- synthetic resin
- mold layer
- composite body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Insulators (AREA)
Description
第１図及び第２図は本考案の一実施例を示すも
ので、第１図は全体の断面図、第２図は結合体の
拡大断面図であり、第３図は従来例を示す第１図
相当図、第４図は同要部の拡大断面図、第５図は
他の従来例の第４図相当図、第６図及び第７図は
夫々異なる従来例を示す第１図相当図である。
図中、１１は中心導体、１２は接着層、１３は
結合体、１４はモールド層を示す。
1 and 2 show an embodiment of the present invention, FIG. 1 is a cross-sectional view of the whole, FIG. 2 is an enlarged cross-sectional view of the combined body, and FIG. 3 is a conventional example. Figure 1 is a diagram equivalent to Figure 1, Figure 4 is an enlarged sectional view of the same essential parts, Figure 5 is a diagram equivalent to Figure 4 of another conventional example, and Figures 6 and 7 are equivalent to Figure 1 showing different conventional examples. It is a diagram. In the figure, 11 is a center conductor, 12 is an adhesive layer, 13 is a bonded body, and 14 is a mold layer.
Claims (1)
などの接着剤による緩衝作用を有する接着層によ
つて一体に結合された合成樹脂製のパイプ状の結
合体と、この結合体及び前記中心導体の外周部に
合成樹脂により成形されたモールド層とを具備し
、前記結合体をモールド層と同じ若しくは近似し
た材料で形成してなるモールドブツシツシング。 A central conductor, a synthetic resin pipe-shaped composite body that is integrally bonded to the outer periphery of the central conductor by an adhesive layer having a buffering effect using an adhesive such as rubber glue, and this composite body and the central conductor. and a mold layer molded from a synthetic resin on the outer periphery thereof, and the combined body is formed from a material that is the same as or similar to the mold layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18137485U JPS6289719U (en) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18137485U JPS6289719U (en) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289719U true JPS6289719U (en) | 1987-06-09 |
Family
ID=31126185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18137485U Pending JPS6289719U (en) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289719U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003272729A (en) * | 2002-03-12 | 2003-09-26 | Auto Network Gijutsu Kenkyusho:Kk | connector |
-
1985
- 1985-11-25 JP JP18137485U patent/JPS6289719U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003272729A (en) * | 2002-03-12 | 2003-09-26 | Auto Network Gijutsu Kenkyusho:Kk | connector |