JPS6291435U - - Google Patents
Info
- Publication number
- JPS6291435U JPS6291435U JP1985183820U JP18382085U JPS6291435U JP S6291435 U JPS6291435 U JP S6291435U JP 1985183820 U JP1985183820 U JP 1985183820U JP 18382085 U JP18382085 U JP 18382085U JP S6291435 U JPS6291435 U JP S6291435U
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- insulating substrate
- pellets
- holes
- mounting agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の混成集積回路装置の一実施例
で同図ａは表面図、同図ｂはａのＡ―Ａ線断面図
である。第２図は従来の混成集積回路装置の一実
施例で同図ａの表面図、同図ｂはａのＡ―Ａ線断
面図である。 １……絶縁基板、２……スルーホール、３……
絶縁ペースト、４……マウント剤、５……ペレツ
ト。
で同図ａは表面図、同図ｂはａのＡ―Ａ線断面図
である。第２図は従来の混成集積回路装置の一実
施例で同図ａの表面図、同図ｂはａのＡ―Ａ線断
面図である。 １……絶縁基板、２……スルーホール、３……
絶縁ペースト、４……マウント剤、５……ペレツ
ト。
Claims (1)
- スルーホールをあけた絶縁基板と、絶縁ベース
トと、マウント剤と、ペレツトとを備え、前記絶
縁基板のスルーホールをカバーする絶縁ペースト
を有し、絶縁ペースト上にマウント剤でペレツト
をマウントすることを特徴とする混成集積回路装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985183820U JPS6291435U (ja) | 1985-11-28 | 1985-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985183820U JPS6291435U (ja) | 1985-11-28 | 1985-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291435U true JPS6291435U (ja) | 1987-06-11 |
Family
ID=31130904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985183820U Pending JPS6291435U (ja) | 1985-11-28 | 1985-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291435U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842940B2 (ja) * | 1979-01-24 | 1983-09-22 | 株式会社日立メデイコ | 電離箱型ｘ線検出器及びその製造方法 |
-
1985
- 1985-11-28 JP JP1985183820U patent/JPS6291435U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842940B2 (ja) * | 1979-01-24 | 1983-09-22 | 株式会社日立メデイコ | 電離箱型ｘ線検出器及びその製造方法 |