JPS6292660U - - Google Patents

Info

Publication number
JPS6292660U
JPS6292660U JP1985184227U JP18422785U JPS6292660U JP S6292660 U JPS6292660 U JP S6292660U JP 1985184227 U JP1985184227 U JP 1985184227U JP 18422785 U JP18422785 U JP 18422785U JP S6292660 U JPS6292660 U JP S6292660U
Authority
JP
Japan
Prior art keywords
solid
state imaging
imaging device
storage recess
device storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985184227U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985184227U priority Critical patent/JPS6292660U/ja
Publication of JPS6292660U publication Critical patent/JPS6292660U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP1985184227U 1985-11-29 1985-11-29 Pending JPS6292660U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985184227U JPS6292660U (2) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985184227U JPS6292660U (2) 1985-11-29 1985-11-29

Publications (1)

Publication Number Publication Date
JPS6292660U true JPS6292660U (2) 1987-06-13

Family

ID=31131701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985184227U Pending JPS6292660U (2) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPS6292660U (2)

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