JPS6310058U - - Google Patents
Info
- Publication number
- JPS6310058U JPS6310058U JP1986103928U JP10392886U JPS6310058U JP S6310058 U JPS6310058 U JP S6310058U JP 1986103928 U JP1986103928 U JP 1986103928U JP 10392886 U JP10392886 U JP 10392886U JP S6310058 U JPS6310058 U JP S6310058U
- Authority
- JP
- Japan
- Prior art keywords
- friction
- coefficient
- replacement pad
- workpiece
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Description
第１図は本考案の一実施例に係る半導体ウエハ
の研磨治具の分解斜視図、第２図はその縦断面図
、第３図ないし第５図はそれぞれ交換パツドの異
なる変形例の拡大縦断面図である。
１……治具本体、３……底板、４……テンプレ
ート、５……位置決め穴、６……交換パツド、７
……ワーク（半導体ウエハ）。
FIG. 1 is an exploded perspective view of a polishing jig for semiconductor wafers according to an embodiment of the present invention, FIG. 2 is a longitudinal sectional view thereof, and FIGS. 3 to 5 are enlarged longitudinal sections of different modifications of the replacement pad. It is a front view. 1...Jig body, 3...Bottom plate, 4...Template, 5...Positioning hole, 6...Replacement pad, 7
...Work (semiconductor wafer).
Claims (1)
穴を有する治具本体と、上記位置決め穴に着脱自
在に挿入される交換パツドとを備え、該交換パツ
ドが、これとワークとの間の摩擦係数が０．１〜
０．５に、これと治具本体との摩擦係数が０．０
８〜０．４５になるように形成されていることを
特徴とする、半導体ウエハ等の研磨治具。 (2) 上記交換パツドが、これとワークとの摩擦
係数が、０．２〜０．５に、交換パツドと底板と
の摩擦係数が０．１〜０．３になるように形成さ
れている実用新案登録請求の範囲第１項に記載の
半導体ウエハ等の研磨治具。[Claims for Utility Model Registration] (1) A jig main body having a positioning hole for determining the position on the horizontal plane of a workpiece, and a replacement pad that is detachably inserted into the positioning hole, the replacement pad being The friction coefficient between and the workpiece is 0.1~
0.5, and the friction coefficient between this and the jig body is 0.0.
A polishing jig for semiconductor wafers, etc., characterized in that it is formed to have a diameter of 8 to 0.45. (2) The replacement pad is formed so that the coefficient of friction between it and the workpiece is 0.2 to 0.5, and the coefficient of friction between the replacement pad and the bottom plate is 0.1 to 0.3. A polishing jig for semiconductor wafers, etc., as set forth in claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986103928U JPS6310058U (en) | 1986-07-07 | 1986-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986103928U JPS6310058U (en) | 1986-07-07 | 1986-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310058U true JPS6310058U (en) | 1988-01-22 |
Family
ID=30976942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986103928U Pending JPS6310058U (en) | 1986-07-07 | 1986-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310058U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5959347A (en) * | 1982-09-23 | 1984-04-05 | ウイリアム・デイ−・ブデインガ− | Work holder for operation of grinding |
-
1986
- 1986-07-07 JP JP1986103928U patent/JPS6310058U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5959347A (en) * | 1982-09-23 | 1984-04-05 | ウイリアム・デイ−・ブデインガ− | Work holder for operation of grinding |
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