JPS63101860U - - Google Patents
Info
- Publication number
- JPS63101860U JPS63101860U JP19582186U JP19582186U JPS63101860U JP S63101860 U JPS63101860 U JP S63101860U JP 19582186 U JP19582186 U JP 19582186U JP 19582186 U JP19582186 U JP 19582186U JP S63101860 U JPS63101860 U JP S63101860U
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- pin
- heater
- support structure
- stem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000007784 solid electrolyte Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000002775 capsule Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
第１図は、本考案の支持構造の実施例を示し、
イは斜視図、ロはキヤツプを除いた上面図である
。第２図はセンサ素子の構造例を示す断面図、第
３図は従来の支持構造の一例を示す斜視図である
。
１：センサ本体部、２：イオン導電板、３Ａ，
３Ｂ：電極層、４：カプセル、５：拡散孔、６：
気体拡散制御体、７：円板状ステム、８ａ，８ｂ
：センサ用ピン、８ｃ，８ｄ：ヒータ用ピン、８
ｅ：補助ピン、９：ヒータ、１０ａ，１０ｂ：セ
ンサ用リードワイヤ、１０ｃ，１０ｄ：ヒータ用
リードワイヤ、１０ｅ：補助リードワイヤ、１１
：キヤツプ。
FIG. 1 shows an embodiment of the support structure of the present invention,
A is a perspective view, and B is a top view with the cap removed. FIG. 2 is a sectional view showing an example of the structure of a sensor element, and FIG. 3 is a perspective view showing an example of a conventional support structure. 1: Sensor body, 2: Ion conductive plate, 3A,
3B: Electrode layer, 4: Capsule, 5: Diffusion hole, 6:
Gas diffusion control body, 7: disc-shaped stem, 8a, 8b
: Sensor pin, 8c, 8d: Heater pin, 8
e: Auxiliary pin, 9: Heater, 10a, 10b: Sensor lead wire, 10c, 10d: Heater lead wire, 10e: Auxiliary lead wire, 11
: Cap.
Claims (1)
のイオン導電板と、その上面に設けられた気体拡
散制御体と、更にその上面に設けられたヒータと
からなるセンサ本体部が、円板状ステムを貫通し
て挿設されたセンサ用ピン及びヒータ用ピンの各
上部とを連結してステム板より浮かせて支持され
てなるセンサの支持構造において、センサ本体部
がヒータ用ピンと同様にステム板に挿設された補
助ピンの上部に連結され補助ピンとヒータ用ピン
とにより３方向から支持されていることを特徴と
するセンサの支持構造。 The sensor main body consists of a thin ion conductive plate with electrode layers on both sides of a solid electrolyte, a gas diffusion control body provided on the top surface of the thin ion conductive plate, and a heater further provided on the top surface. In a sensor support structure in which the upper parts of a sensor pin and a heater pin inserted through the stem are connected and supported so as to float above the stem plate, the sensor body is attached to the stem plate in the same way as the heater pin. A support structure for a sensor, characterized in that the sensor support structure is connected to the upper part of an auxiliary pin inserted in the sensor and is supported from three directions by the auxiliary pin and a heater pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19582186U JPS63101860U (en) | 1986-12-22 | 1986-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19582186U JPS63101860U (en) | 1986-12-22 | 1986-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63101860U true JPS63101860U (en) | 1988-07-02 |
Family
ID=31154064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19582186U Pending JPS63101860U (en) | 1986-12-22 | 1986-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63101860U (en) |
-
1986
- 1986-12-22 JP JP19582186U patent/JPS63101860U/ja active Pending