JPS63102237U - - Google Patents
Info
- Publication number
- JPS63102237U JPS63102237U JP1986202692U JP20269286U JPS63102237U JP S63102237 U JPS63102237 U JP S63102237U JP 1986202692 U JP1986202692 U JP 1986202692U JP 20269286 U JP20269286 U JP 20269286U JP S63102237 U JPS63102237 U JP S63102237U
- Authority
- JP
- Japan
- Prior art keywords
- die
- tape
- semiconductor manufacturing
- bonder
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986202692U JPS63102237U (2) | 1986-12-23 | 1986-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986202692U JPS63102237U (2) | 1986-12-23 | 1986-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63102237U true JPS63102237U (2) | 1988-07-02 |
Family
ID=31167313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986202692U Pending JPS63102237U (2) | 1986-12-23 | 1986-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102237U (2) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60110135A (ja) * | 1983-11-18 | 1985-06-15 | Shinkawa Ltd | ペレットピックアップ装置 |
-
1986
- 1986-12-23 JP JP1986202692U patent/JPS63102237U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60110135A (ja) * | 1983-11-18 | 1985-06-15 | Shinkawa Ltd | ペレットピックアップ装置 |