JPS6310537U - - Google Patents
Info
- Publication number
- JPS6310537U JPS6310537U JP10371786U JP10371786U JPS6310537U JP S6310537 U JPS6310537 U JP S6310537U JP 10371786 U JP10371786 U JP 10371786U JP 10371786 U JP10371786 U JP 10371786U JP S6310537 U JPS6310537 U JP S6310537U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component body
- tip
- lead wire
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
第１図及び第２図はそれぞれ本考案の実施例の
斜視図、第３図は従来の電子部品の斜視図、第４
図は従来の電子部品の製造の過程を示す側面図で
ある。
１……積層コンデンサ本体、２１，２２……外
部電極、３１，３２……リード線、６……デイツ
プ半田付け。
Figures 1 and 2 are perspective views of an embodiment of the present invention, Figure 3 is a perspective view of a conventional electronic component, and Figure 4 is a perspective view of a conventional electronic component.
The figure is a side view showing the process of manufacturing a conventional electronic component. DESCRIPTION OF SYMBOLS 1...Multilayer capacitor body, 21 , 22 ...External electrodes, 31 , 32 ...Lead wires, 6...Dip soldering.
Claims (1)
体の該両電極にリード線をデイツプ半田付けし、
該リード線を電子部品本体の軸と直角方向に延出
してなる電子部品において、リード線の先端部を
Ｕ字形に折曲形成し、該先端部を電子部品本体の
端面及び周面に接触させて嵌合させたことを特徴
とするリード線を有する電子部品。 Lead wires are dip-soldered to both electrodes of a rectangular parallelepiped electronic component body with electrodes formed on both end faces,
In an electronic component in which the lead wire extends in a direction perpendicular to the axis of the electronic component body, the tip of the lead wire is bent into a U-shape, and the tip is brought into contact with an end surface and a circumferential surface of the electronic component body. An electronic component having lead wires that are fitted together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10371786U JPH0353478Y2 (en) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10371786U JPH0353478Y2 (en) | 1986-07-08 | 1986-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6310537U true JPS6310537U (en) | 1988-01-23 |
| JPH0353478Y2 JPH0353478Y2 (en) | 1991-11-22 |
Family
ID=30976539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10371786U Expired JPH0353478Y2 (en) | 1986-07-08 | 1986-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353478Y2 (en) |
-
1986
- 1986-07-08 JP JP10371786U patent/JPH0353478Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353478Y2 (en) | 1991-11-22 |
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