JPS6310564U - - Google Patents

Info

Publication number
JPS6310564U
JPS6310564U JP10508886U JP10508886U JPS6310564U JP S6310564 U JPS6310564 U JP S6310564U JP 10508886 U JP10508886 U JP 10508886U JP 10508886 U JP10508886 U JP 10508886U JP S6310564 U JPS6310564 U JP S6310564U
Authority
JP
Japan
Prior art keywords
semiconductor
substrate
metal carrier
heat pipe
application device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10508886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10508886U priority Critical patent/JPS6310564U/ja
Publication of JPS6310564U publication Critical patent/JPS6310564U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bはこの考案の一実施例による半導
体応用装置を示す平面図、その断面図、第2図は
ヒートパイプを示す拡大断面図、第3図a,bは
従来の半導体応用装置を示す平面図、断面図であ
る。 1……半導体、2……基板、3……金属キヤリ
ア、4……ヒートパイプ、5……放熱フイン、6
……容器、40……容器、41……多孔質部材、
42……液体。
Figures 1a and b are a plan view and a sectional view of a semiconductor application device according to an embodiment of this invention, Figure 2 is an enlarged sectional view showing a heat pipe, and Figures 3a and b are conventional semiconductor application equipment. FIG. 1...Semiconductor, 2...Substrate, 3...Metal carrier, 4...Heat pipe, 5...Radiation fin, 6
... Container, 40 ... Container, 41 ... Porous member,
42...Liquid.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体と、前記半導体へ電源および入出力信号
を供給する基板と、前記半導体および基板を保持
する金属キヤリアと、前記金属キヤリアに取付け
られたヒートパイプとを備えたことを特徴とする
半導体応用装置。
A semiconductor application device comprising: a semiconductor; a substrate for supplying power and input/output signals to the semiconductor; a metal carrier for holding the semiconductor and the substrate; and a heat pipe attached to the metal carrier.
JP10508886U 1986-07-09 1986-07-09 Pending JPS6310564U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10508886U JPS6310564U (en) 1986-07-09 1986-07-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10508886U JPS6310564U (en) 1986-07-09 1986-07-09

Publications (1)

Publication Number Publication Date
JPS6310564U true JPS6310564U (en) 1988-01-23

Family

ID=30979186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10508886U Pending JPS6310564U (en) 1986-07-09 1986-07-09

Country Status (1)

Country Link
JP (1) JPS6310564U (en)

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