JPS63112340U - - Google Patents
Info
- Publication number
- JPS63112340U JPS63112340U JP1987004082U JP408287U JPS63112340U JP S63112340 U JPS63112340 U JP S63112340U JP 1987004082 U JP1987004082 U JP 1987004082U JP 408287 U JP408287 U JP 408287U JP S63112340 U JPS63112340 U JP S63112340U
- Authority
- JP
- Japan
- Prior art keywords
- heater chip
- semiconductor manufacturing
- thermocompression
- mounting surface
- tab lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987004082U JPS63112340U (2) | 1987-01-13 | 1987-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987004082U JPS63112340U (2) | 1987-01-13 | 1987-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63112340U true JPS63112340U (2) | 1988-07-19 |
Family
ID=30784429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987004082U Pending JPS63112340U (2) | 1987-01-13 | 1987-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63112340U (2) |
-
1987
- 1987-01-13 JP JP1987004082U patent/JPS63112340U/ja active Pending
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