JPS63115217U - - Google Patents

Info

Publication number: JPS63115217U
Authority: JP; Japan
Prior art keywords: semiconductor element; fixed; insulating plate; lead frame; back surface
Prior art date: 1987-01-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1987007667U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-01-21

Filing date

1987-01-21

Publication date

1988-07-25

1987-01-21 Application filed filed Critical

1987-01-21 Priority to JP1987007667U priority Critical patent/JPS63115217U/ja

1988-07-25 Publication of JPS63115217U publication Critical patent/JPS63115217U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Die Bonding (AREA)

JP1987007667U 1987-01-21 1987-01-21 Pending JPS63115217U (2)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1987007667U JPS63115217U (2)	1987-01-21	1987-01-21

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1987007667U JPS63115217U (2)	1987-01-21	1987-01-21

Publications (1)

Publication Number	Publication Date
JPS63115217U true JPS63115217U (2)	1988-07-25

Family

ID=30791334

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1987007667U Pending JPS63115217U (2)	1987-01-21	1987-01-21

Country Status (1)

Country	Link
JP (1)	JPS63115217U (2)

1987
- 1987-01-21 JP JP1987007667U patent/JPS63115217U/ja active Pending

Publication	Publication Date	Title
JPS61203564U (2)	1986-12-22
JPS6351461U (2)	1988-04-07
JPH02114943U (2)	1990-09-14
JPS62204327U (2)	1987-12-26
JPS63174459U (2)	1988-11-11
JPS63187330U (2)	1988-11-30
JPH01174946U (2)	1989-12-13
JPS6217149U (2)	1987-02-02
JPH0245651U (2)	1990-03-29
JPS6371549U (2)	1988-05-13
JPS6382949U (2)	1988-05-31
JPS6310569U (2)	1988-01-23
JPS6377355U (2)	1988-05-23
JPS62145337U (2)	1987-09-12
JPS63180929U (2)	1988-11-22
JPH0176040U (2)	1989-05-23
JPH03101524U (2)	1991-10-23
JPH0221751U (2)	1990-02-14
JPS63201331U (2)	1988-12-26
JPS63137955U (2)	1988-09-12
JPS6312844U (2)	1988-01-27
JPH0258343U (2)	1990-04-26
JPS6242247U (2)	1987-03-13
JPH0456347U (2)	1992-05-14
JPS61149347U (2)	1986-09-16