JPS631202A - Flat antenna and its production - Google Patents
Flat antenna and its productionInfo
- Publication number
- JPS631202A JPS631202A JP14409686A JP14409686A JPS631202A JP S631202 A JPS631202 A JP S631202A JP 14409686 A JP14409686 A JP 14409686A JP 14409686 A JP14409686 A JP 14409686A JP S631202 A JPS631202 A JP S631202A
- Authority
- JP
- Japan
- Prior art keywords
- circuit film
- ground conductor
- film
- power supply
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000005855 radiation Effects 0.000 claims abstract description 16
- 125000006850 spacer group Chemical group 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Abstract
Description
【発明の詳細な説明】
(技術分野)
本発明は、衛星放送受信やマイクロ波通信などに用いる
フラットアンテナ及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a flat antenna used for satellite broadcast reception, microwave communication, etc., and a method for manufacturing the same.
(背景技術)
従来、いわゆるトリプレート構造のフラットアンテナは
、誘電体を介在して接地導体基板。(Background Art) Conventionally, a flat antenna with a so-called triplate structure connects a grounded conductor substrate with a dielectric interposed therebetween.
給電回路、放射回路が複合されていた。しかしながら、
この工うな構成では誘電体損失、導体損失が大きく、ア
ンテナの利得の低下を訪発しt−O
でらにこれらの間に、低誘電率の材料がら成るハニカム
構遺材を介在きせて空気層を形成するいわゆるサスペン
ド構造も試みられたが、低誘電率のハニカム材は高価で
あり、また製造が困難であるなどのことから、限られた
用途にのみ使用されているのが現状である。The feeding circuit and radiation circuit were combined. however,
In this unconventional configuration, dielectric loss and conductor loss are large, resulting in a decrease in the antenna gain.In addition, a honeycomb structure made of a material with a low dielectric constant is interposed between them to create an air layer. A so-called suspended structure has been attempted, but low dielectric constant honeycomb materials are expensive and difficult to manufacture, so they are currently only used for limited purposes.
(発明の目的り
本発明は上記の欠点を改善する丸めに提案され之もので
、高利得で製造性に優れたフラットアンテナを提供する
ことを目的とする。(Object of the Invention The present invention was proposed to improve the above-mentioned drawbacks, and an object of the present invention is to provide a flat antenna with high gain and excellent manufacturability.
(発明の開示〕
不発明は金属平板りりなる接地4体基板と1、前記接地
導体基板上に空気層を介在させて、展張された給電用ス
トリップ線路が形成されたフレキシブルな給電回路フィ
ルムと、前記の給電回路フィルムの上に、空気層を介在
させて、スロットが配列形成されたフレキシブルな放射
回路フィルムとを具備したことを特徴とするフラットア
ンテナを発明の女旨とするものである。(Disclosure of the Invention) The present invention provides a four-piece grounding board made of a metal flat plate; 1; a flexible power feeding circuit film in which a stretched power feeding strip line is formed with an air layer interposed on the grounding conductor substrate; The gist of the invention is a flat antenna characterized in that a flexible radiation circuit film in which slots are arranged and formed with an air layer interposed on the above-mentioned feeder circuit film is provided.
さらに本発明は金属平板工すなる接地導体基板上に、ス
トリップ線路が形成されたフレキシブルな給電回路フィ
ルムの少くとも両側を接着固定する工程と、ついでスロ
ットが形成されたフレキシブルな放射回路フィルムの少
くとも両側を、前記の接地導体基板上に、前記の給電回
路フィルム妙5接層固定された箇所の外側に、接着固定
する工程と、前記給電回路フィルムと接地導体基板との
間及び放射回路フィルムと接地導体基板との間に夫々ス
ペーサを挿入し、前記の両フィルムを展張し、接地導体
基板との間に空気層を形成する工程と全具備することを
特徴とするフラットアンテナの製造方法を発明の要旨と
するものである。Furthermore, the present invention includes a step of adhesively fixing at least both sides of a flexible power supply circuit film having a strip line formed thereon on a ground conductor substrate such as a metal flat plate, and then a step of fixing at least both sides of a flexible power supply circuit film having a strip line formed thereon. a step of adhesively fixing both sides to the ground conductor board on the outside of the part where the power supply circuit film contact layer is fixed; and a step of adhesively fixing the power supply circuit film and the ground conductor board and the radiation circuit film. A method for manufacturing a flat antenna, comprising the steps of: inserting a spacer between the film and the ground conductor board, stretching both films, and forming an air layer between the film and the ground conductor board. This is the gist of the invention.
以下、図面を参照して本発明の詳細な説明するO
第1図は本発明の一実施例に係るフラットアンテナの斜
視図、第2図及び第3図は製造工程上*すための断面図
である。The present invention will be described in detail below with reference to the drawings. Figure 1 is a perspective view of a flat antenna according to an embodiment of the present invention, and Figures 2 and 3 are cross-sectional views for manufacturing process*. It is.
第1図において、1は接地導体基板で、例えばアルミニ
ウム板2〜4m厚のものである。2は給電回路フィルム
であり、例えばポリエチレンテレフタレート(50〜1
00μm厚)?ベースフィルムとしてストリップ線路3
(銅箔20〜40μm厚)が形成されている。5は放射
回路フィルムであり、例えばポリエチレンテレフタレー
ト(50〜100μmW)’tベースフィルムとして、
スロット4(銅箔2o〜40μm厚〕が形成されている
。In FIG. 1, reference numeral 1 denotes a ground conductor board, which is, for example, an aluminum plate with a thickness of 2 to 4 m. 2 is a power supply circuit film, for example, polyethylene terephthalate (50 to 1
00μm thickness)? Strip line 3 as base film
(copper foil 20 to 40 μm thick) is formed. 5 is a radiation circuit film, for example, polyethylene terephthalate (50 to 100 μmW) as a base film,
A slot 4 (copper foil 2o to 40 μm thick) is formed.
しかして前記の両フィルムは夫々その両側において、接
地導体基板上に接着固定されている。Both of the above-mentioned films are adhesively fixed on the ground conductor substrate on both sides.
6と7はスペーサであり、給電回路フィルム2と接地導
体基板1の間及び放射回路フィルム5と接地導体基板1
0間に所定の空気層を形成するためのものである。6 and 7 are spacers, which are provided between the power supply circuit film 2 and the ground conductor board 1 and between the radiation circuit film 5 and the ground conductor board 1.
This is to form a predetermined air layer between the two.
8はストリップ線路3とフラットアンテナ基板の外部の
伝送回路(1略)を接続するための同軸コネクターで、
ス) IJツブ線路の給電点Aの部分に取りつけられる
。9は接着剤である。8 is a coaxial connector for connecting the strip line 3 and the external transmission circuit (1 omitted) of the flat antenna board,
S) It is attached to the feed point A part of the IJ tube line. 9 is an adhesive.
次に製造方法について説明する。Next, the manufacturing method will be explained.
まず第2図に示す工うに、接地導体基板1゜給電回路フ
ィルム2.放射回路フィルム5ヶ重ね合わせ、給電回路
フィルム2と放射回路フィルム5の外周部を接着剤9
a + 9 b + 9 c + ” dで接地導体基
板1に接着する。この場合に、放射回路フィルム5を、
給電回路フィルム2の接地導体基板1に対する接着箇所
の外側で接地導体基板1に接着する。接着は常温硬化型
でも加熱接着型でも工いが、給電回路フィルム2と放射
回路フィルム5をシワなしに接地導体基板1に密層させ
る丸めには加圧することが望ましい。First, the construction shown in FIG. Stack the 5 radiation circuit films and glue the outer peripheries of the power supply circuit film 2 and the radiation circuit film 5 with adhesive 9.
a + 9 b + 9 c + ” d to adhere to the ground conductor board 1. In this case, the radiation circuit film 5 is
The feeder circuit film 2 is bonded to the ground conductor substrate 1 outside the bonding location to the ground conductor substrate 1. Adhesion can be done by either a room temperature curing type or a heating adhesive type, but it is desirable to pressurize the power supply circuit film 2 and the radiation circuit film 5 in order to tightly layer them on the ground conductor substrate 1 without wrinkles.
接着が完了し友時点で、第3図に示す工うにスペーサ6
a、6b’に給電回路フィルム2と接地導体基板1の間
に挿入し、フレキシブルなフィルムから成る給電回路フ
ィルム2を展張させ空気層を形成する。After the adhesion is completed, attach the spacer 6 shown in Figure 3.
a, 6b' are inserted between the power supply circuit film 2 and the ground conductor substrate 1, and the power supply circuit film 2 made of a flexible film is expanded to form an air layer.
同様にスペーサ7a、7bを放射回路フィルム5と接地
導体基板1の間に挿入し、放射回路フィルム5を展張て
せて空気層を形成する。従ってスペーサの厚きは空気層
の厚ざに合わせて設定する。Similarly, spacers 7a and 7b are inserted between the radiation circuit film 5 and the ground conductor substrate 1, and the radiation circuit film 5 is expanded to form an air layer. Therefore, the thickness of the spacer is set according to the thickness of the air layer.
以上の方法によって、フラットアンテナ基板を形成し、
最後に同軸コネクター8を給電点Aに接続してフラット
アンテナは完成する。By the above method, a flat antenna substrate is formed,
Finally, connect the coaxial connector 8 to the feed point A to complete the flat antenna.
上記の製造方法において、二三問題となることが考えら
れるので合わせて説明する。In the above manufacturing method, there may be a few problems, so they will also be explained.
(I) 空気層の厚さが厚丁ぎてフィルムの展張に力
がかかジ丁き゛ると回路の変形1寸法変化、接地導体基
板の変形(ソリ)が生じるおそれがある。(I) If the thickness of the air layer is too thick and force is applied to stretch the film, there is a possibility that circuit deformation, dimensional change, and deformation (warping) of the ground conductor board may occur.
その場合には、第4図(a)に示す接着時に、例えばフ
ィルム2と接地導体基板1の間に離形紙10などの厚さ
調整用のか筐しものt入れ、 (b)図に示す:うに、
次にとり去れは展張時にかかる力の調整全行なう。In that case, when adhering as shown in FIG. 4(a), for example, insert a release paper 10 or other casing for thickness adjustment between the film 2 and the ground conductor substrate 1, as shown in FIG. 4(b). : sea urchin,
The next step is to adjust the force applied during expansion.
Q[) アンテナ回路の接着部に左右の2ケ所でもよ
いが、前後左右の4ケ所としてもよい。ただし、4ケ所
の場合にスベー°すを挿入するために接着しない部分を
設ける必要がある。Q[) The antenna circuit may be attached at two locations on the left and right, but it may also be attached at four locations on the front, back, left and right. However, in the case of four locations, it is necessary to provide a non-adhesive portion in order to insert the base.
(2)接着力が弱いと展張による力で外れることが考え
られる。この場合は接着部を第5図に示ア工うにネジ1
1などで補強することも可能である。(2) If the adhesive strength is weak, it may come off due to the force of stretching. In this case, attach the adhesive part as shown in Figure 5.
It is also possible to reinforce it with 1 etc.
(発明の効果)
以上説明し72:、!うに、本発明に工ればトリプレー
ト構造に2いて、誘電体やノ・ニカム材を用いずに形成
されるので、誘電体損失や環体損失がなく高いアンテナ
利得が得られる。ま之製造が容易である等の効果を有す
るものである。(Effect of the invention) As explained above, 72:,! According to the present invention, the antenna is formed in a triplate structure without using a dielectric material or a dielectric material, so that a high antenna gain can be obtained without dielectric loss or ring loss. This has the advantage of being easy to manufacture.
第1図は本発明のフラットアンテナの実施例を示す斜視
図、第2図及び第3図は本発明のフラットアンテナの製
造方法、第4図及び第5図は他の実施例を示す。FIG. 1 is a perspective view showing an embodiment of the flat antenna of the present invention, FIGS. 2 and 3 show a method of manufacturing the flat antenna of the present invention, and FIGS. 4 and 5 show other embodiments.
Claims (2)
基板上に空気層を介在させて、展張された給電用ストリ
ップ線路が形成されたフレキシブルな給電回路フィルム
と、前記の給電回路フィルムの上に、空気層を介在させ
て、スロットが配列形成されたフレキシブルな放射回路
フィルムとを具備したことを特徴とするフラットアンテ
ナ。(1) A ground conductor board made of a flat metal plate, a flexible power supply circuit film in which a stretched power supply strip line is formed with an air layer interposed on the ground conductor board, and a flexible power supply circuit film formed on the power supply circuit film. and a flexible radiation circuit film in which slots are arranged in an array with an air layer interposed therebetween.
線路が形成されたフレキシブルな給電回路フィルムの少
くとも両側を接着固定する工程と、ついでスロットが形
成されたフレキシブルな放射回路フィルムの少くとも両
側を、前記の接地導体基板上に、前記の給電回路フィル
ムが接着固定された箇所の外側に、接着固定する工程と
、前記給電回路フィルムと接地導体基板との間及び放射
回路フィルムと接地導体基板との間に夫夫スペーサを挿
入し、前記の両フィルムを展張し、接地導体基板との間
に空気層を形成する工程とを具備することを特徴とする
フラットアンテナの製造方法。(2) A step of adhesively fixing at least both sides of a flexible power supply circuit film with a strip line formed thereon on a ground conductor substrate made of a flat metal plate, and then at least both sides of a flexible radiation circuit film with a slot formed therein. on the ground conductor board, on the outside of the place where the power feeder circuit film is adhesively fixed, and between the power feeder circuit film and the ground conductor board and between the radiation circuit film and the ground conductor board. A method for manufacturing a flat antenna, comprising the steps of: inserting a spacer between the two films, and stretching both films to form an air layer between the two films and the ground conductor substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14409686A JPS631202A (en) | 1986-06-20 | 1986-06-20 | Flat antenna and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14409686A JPS631202A (en) | 1986-06-20 | 1986-06-20 | Flat antenna and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631202A true JPS631202A (en) | 1988-01-06 |
Family
ID=15354109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14409686A Pending JPS631202A (en) | 1986-06-20 | 1986-06-20 | Flat antenna and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631202A (en) |
-
1986
- 1986-06-20 JP JP14409686A patent/JPS631202A/en active Pending
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