JPS6312844U - - Google Patents
Info
- Publication number
- JPS6312844U JPS6312844U JP1986106421U JP10642186U JPS6312844U JP S6312844 U JPS6312844 U JP S6312844U JP 1986106421 U JP1986106421 U JP 1986106421U JP 10642186 U JP10642186 U JP 10642186U JP S6312844 U JPS6312844 U JP S6312844U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor chip
- lead frame
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図および第２図はそれぞれ本考案の樹脂封
止半導体集積回路の断面図、第３図は従来の樹脂
封止半導体集積回路の断面図である。
１……銅板、２……半導体チツプ、３……アイ
ランド部、４……リードフレーム、５……ペース
ト、６……ハンダ、７……ボンデイングワイヤ、
８……樹脂。
1 and 2 are sectional views of a resin-sealed semiconductor integrated circuit according to the present invention, and FIG. 3 is a sectional view of a conventional resin-sealed semiconductor integrated circuit. DESCRIPTION OF SYMBOLS 1...Copper plate, 2...Semiconductor chip, 3...Island part, 4...Lead frame, 5...Paste, 6...Solder, 7...Bonding wire,
8...Resin.
Claims (1)
固定するリードフレームとの間に金属板を設けた
ことを特徴とする樹脂封止半導体装置。 A resin-sealed semiconductor device characterized in that a metal plate is provided between a semiconductor chip to be resin-sealed and a lead frame for fixing the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986106421U JPS6312844U (en) | 1986-07-11 | 1986-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986106421U JPS6312844U (en) | 1986-07-11 | 1986-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6312844U true JPS6312844U (en) | 1988-01-27 |
Family
ID=30981763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986106421U Pending JPS6312844U (en) | 1986-07-11 | 1986-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312844U (en) |
-
1986
- 1986-07-11 JP JP1986106421U patent/JPS6312844U/ja active Pending