JPS63136329U - - Google Patents

Info

Publication number
JPS63136329U
JPS63136329U JP1987029336U JP2933687U JPS63136329U JP S63136329 U JPS63136329 U JP S63136329U JP 1987029336 U JP1987029336 U JP 1987029336U JP 2933687 U JP2933687 U JP 2933687U JP S63136329 U JPS63136329 U JP S63136329U
Authority
JP
Japan
Prior art keywords
substrate
transferred
station
stage
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987029336U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987029336U priority Critical patent/JPS63136329U/ja
Publication of JPS63136329U publication Critical patent/JPS63136329U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1987029336U 1987-02-27 1987-02-27 Pending JPS63136329U (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987029336U JPS63136329U (da) 1987-02-27 1987-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987029336U JPS63136329U (da) 1987-02-27 1987-02-27

Publications (1)

Publication Number Publication Date
JPS63136329U true JPS63136329U (da) 1988-09-07

Family

ID=30833127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987029336U Pending JPS63136329U (da) 1987-02-27 1987-02-27

Country Status (1)

Country Link
JP (1) JPS63136329U (da)

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