JPS63142836U - - Google Patents
Info
- Publication number
- JPS63142836U JPS63142836U JP1987035325U JP3532587U JPS63142836U JP S63142836 U JPS63142836 U JP S63142836U JP 1987035325 U JP1987035325 U JP 1987035325U JP 3532587 U JP3532587 U JP 3532587U JP S63142836 U JPS63142836 U JP S63142836U
- Authority
- JP
- Japan
- Prior art keywords
- spring
- horn
- cam
- chip
- support shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987035325U JPS63142836U (mo) | 1987-03-10 | 1987-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987035325U JPS63142836U (mo) | 1987-03-10 | 1987-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63142836U true JPS63142836U (mo) | 1988-09-20 |
Family
ID=30844714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987035325U Pending JPS63142836U (mo) | 1987-03-10 | 1987-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63142836U (mo) |
-
1987
- 1987-03-10 JP JP1987035325U patent/JPS63142836U/ja active Pending