JPS63146486A - Coating material compound for plating - Google Patents
Coating material compound for platingInfo
- Publication number
- JPS63146486A JPS63146486A JP61292537A JP29253786A JPS63146486A JP S63146486 A JPS63146486 A JP S63146486A JP 61292537 A JP61292537 A JP 61292537A JP 29253786 A JP29253786 A JP 29253786A JP S63146486 A JPS63146486 A JP S63146486A
- Authority
- JP
- Japan
- Prior art keywords
- coating material
- plating
- material composition
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title claims description 17
- 238000000576 coating method Methods 0.000 title claims description 16
- 239000000463 material Substances 0.000 title claims description 15
- 238000007747 plating Methods 0.000 title claims description 14
- 150000001875 compounds Chemical class 0.000 title description 2
- 239000000203 mixture Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 9
- 239000002738 chelating agent Substances 0.000 claims description 9
- 230000000996 additive effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000013508 migration Methods 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 229920000459 Nitrile rubber Polymers 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- -1 alkyl cresol Chemical compound 0.000 description 2
- 235000013405 beer Nutrition 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Landscapes
- Paints Or Removers (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、アディティブ法によってプリント回路板を製
造するに際して絶縁基板を被覆するのに用いるメッキ用
コーティング材組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a coating material composition for plating used to coat an insulating substrate when manufacturing a printed circuit board by an additive method.
アディティブ法（メッキによって回路を成形する方法）
によって回路パターンを作るときに、メッキの核となる
触媒の付着を良くし、析出したメッキの密着力を向上さ
せるためにコーティング材組成物を基板の上にコートし
ている。この組成物は、一般的には、ゴム／フェノール
樹脂／エポキシ樹脂より成り立っている。Additive method (method of forming circuits by plating)
When creating a circuit pattern using this method, a coating material composition is coated on the substrate in order to improve the adhesion of the catalyst that forms the core of the plating and to improve the adhesion of the deposited plating. This composition generally consists of rubber/phenolic resin/epoxy resin.
従来、アディティブ法によって得られるプリント回路板
は、電気製品等の部品として種々利用されている。この
プリント回路板の製造方法は、例えば、エポキシ樹脂、
イミド樹脂、セラミック等からなる絶縁基板にニトリル
ゴム（ＮＢＲ）／フェノール樹脂／エポキシ樹脂などか
らなるコーティング材組成物を塗布し、これを硬化又は
半硬化させた後、この表面をクロム酸（Ｃｒｙ、 ＋
ｌ冒ｚｓＯｓ）で表面親水化（粗化）し、ついでこの表
面に塩化パラジウム等の触媒を付与して表面活性化を行
い、この表面の非回路形成部分を写真的手法により感光
性ラッカー（フォトレジスト）でマスキングするか、又
はスクリーン印刷で該表面にレジスト皮膜を形成し、つ
ぎに回路形成部分に無電解メッキを行い、製品とするも
のである。Conventionally, printed circuit boards obtained by additive methods have been used in various ways as parts of electrical products and the like. This printed circuit board manufacturing method includes, for example, epoxy resin,
A coating material composition made of nitrile rubber (NBR)/phenol resin/epoxy resin, etc. is applied to an insulating substrate made of imide resin, ceramic, etc., and after curing or semi-curing, the surface is coated with chromic acid (Cry, +
The surface is made hydrophilic (roughened) by applying a catalyst such as palladium chloride to the surface, and the surface is activated by applying a catalyst such as palladium chloride. A resist film is formed on the surface by masking with a resist (resist) or by screen printing, and then electroless plating is performed on the circuit forming portion to produce a product.
しかしながら、アディティブ法用コーティング材組成物
はゴムを主成分とするので、一般にガラス・エポキシの
基板よりも電気特性が劣る。However, since coating material compositions for additive methods have rubber as a main component, their electrical properties are generally inferior to those of glass-epoxy substrates.
このため、回路が微細化してくると、高湿度下で直流電
流を流しておくと電極間で銅がイオン化して動く、いわ
ゆる銅マイグレーシタンという現象が起り、最終的には
回路が短絡してしまう。このことが、大きな問題となり
つつある。For this reason, as circuits become finer, a phenomenon called copper migration occurs, in which copper ionizes and moves between electrodes when a DC current is passed under high humidity, and eventually the circuit becomes short-circuited. Put it away. This is becoming a major problem.
本発明は、このような事情にかんがみなされたものであ
って、銅マイグレーションの発生を抑制したメッキ用コ
ーティング材組成物を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a coating material composition for plating that suppresses the occurrence of copper migration.
このため、本発明は、アディティブ法によってプリント
回路板を製造するに際して絶縁基板を被覆するのに用い
るコーティング材組成物であって、キレート化剤を０．
１〜ＩＯ重量部含有することを特徴とするメッキ用コー
ティング材組成物を要旨とするものである。Therefore, the present invention provides a coating material composition used for coating an insulating substrate when manufacturing a printed circuit board by an additive method, which contains a chelating agent at 0.0%.
The gist of the present invention is a plating coating material composition characterized by containing 1 to IO parts by weight.
以下、本発明の構成について詳しく説明する。Hereinafter, the configuration of the present invention will be explained in detail.
本発明のメッキ用コーティング材組成物は、キレート化
剤を含有することを除いて、一般のメッキ用コーティン
グ材組成物と同様にゴムやフェノール樹脂等からなるも
のである。The coating material composition for plating of the present invention is made of rubber, phenol resin, etc. in the same manner as general coating material compositions for plating, except that it contains a chelating agent.
ゴムとしては、天然ゴム、スチレン−ブタジェン共重合
体ゴム（ＳＢＲ） 、アクリロニトリル−ブタジェン共
重合体ゴム（ＮＢＲ）等いずれでもよい。The rubber may be natural rubber, styrene-butadiene copolymer rubber (SBR), acrylonitrile-butadiene copolymer rubber (NBR), or the like.
この場合、ＮＢＲとしては、低ニトリルのものにトリル
コンテント２５％未満）から極高ニトリルのものにトリ
ルコンテント４３％以上）、又はカルボキシル化ＮＢＲ
などが用いられる。In this case, the NBR may be from low nitrile with tolyle content of less than 25%) to very high nitrile with tolyle content of 43% or more), or carboxylated NBR.
etc. are used.
また、フェノール樹脂としては、ノボラック型、レゾー
ル型いずれでもよく、アルキルクレゾール、カシュー等
の変性品でもよい。さらに、必要に応じてエポキシ樹脂
を配合してもよい。エポキシ樹脂としては、ビスフェノ
ールＡ型、ノボラック型が主に用いられるが、これ以外
のエポキシ樹脂でもよい。Further, the phenol resin may be either a novolac type or a resol type, and may also be a modified product such as an alkyl cresol or cashew. Furthermore, an epoxy resin may be added if necessary. As the epoxy resin, bisphenol A type and novolak type are mainly used, but epoxy resins other than these may also be used.
用いるキレート化剤は、銅と安定なキレートを作る化合
物である。例えば、ベンゾトリアゾール、ＥＤＴＡ（エ
チレンジアミンテトラ酢酸）、ジメチルグリオキシム、
２−（３，５−ジーｔｅｒ −ブチル−２−ヒドロキシ
フェニル）ベンゾトリアゾール、０−フェナントロリン
、グリシン、ヒドロキサム酸等である。The chelating agent used is a compound that forms a stable chelate with copper. For example, benzotriazole, EDTA (ethylenediaminetetraacetic acid), dimethylglyoxime,
These include 2-(3,5-di-ter-butyl-2-hydroxyphenyl)benzotriazole, 0-phenanthroline, glycine, hydroxamic acid, and the like.
本発明のメッキ用コーティング材組成物は、このキレー
ト化剤を０．１〜１０重量部含有している。０．１重量
部未満では銅マイグレーションの抑制効果が充分でなく
、一方、１０重量部を越えるとハンダ耐熱、ビール強度
等の他のメッキ特性に悪影響を与える。このようにキレ
ート化剤を含有、することにより、イオン化した銅をキ
レートとして安定化させ、銅マイグレーションを抑制す
ることができる。The plating coating material composition of the present invention contains 0.1 to 10 parts by weight of this chelating agent. If the amount is less than 0.1 part by weight, the effect of suppressing copper migration will not be sufficient, while if it exceeds 10 parts by weight, other plating properties such as solder heat resistance and beer strength will be adversely affected. By containing a chelating agent in this way, ionized copper can be stabilized as a chelate and copper migration can be suppressed.
さらに、本発明のメッキ用コーティング材組成物には、
必要に応じて、ゴム架橋剤、樹脂硬化剤、表面調整剤、
溶剤等を添加することができる。Furthermore, the plating coating material composition of the present invention includes:
Rubber crosslinking agent, resin curing agent, surface conditioner,
A solvent or the like can be added.
以下に実施例および比較例を示す。Examples and comparative examples are shown below.
実施例１〜７、比較例１
Ｎ Ｂ Ｒ（Ｎｉｐｏｌ−１０３１９日本ゼオン）６０
重量部フェノール樹脂 ３５重量部（Ｐ
Ｒ−１７５，住友デュレズ）
エポキシ樹脂 ５重量部（Ｅｐｉｋ
ｏｔｅ １００１．油化シェルエポキシ）フィラー
１５重量部パーオキサイド
６重量部表面調整剤 ０
．５重量部消泡剤 ０．１重量
部キレート化剤 表１参照上記配合
の２５％メチルエチルケトン（ＭＥＫ）溶液を作り、こ
れをガラス・エポキシ基板（ＦＲ−４）上に乾燥膜厚４
０μになるようにコートし、１５０℃、２時間硬化させ
た。これをクロム酸混液（ＣｒＯａ １００ｇ／ １
、ｃｏｎｃ Ｈ＊ＳＯｎ ３００ｍ ／ １ ）で５０
℃、１０分間エツチングし、奥野製薬のｏＰＣカッパー
Ｈのセミアディティブプロセスで無電解メッキ後、電気
メンキし、１２０℃、２時間乾燥した。Examples 1 to 7, Comparative Example 1 NBR (Nipol-10319 Nippon Zeon) 60
Part by weight Phenol resin 35 parts by weight (P
R-175, Sumitomo Durez) Epoxy resin 5 parts by weight (Epik
ote 1001. oil shell epoxy) filler
15 parts by weight peroxide
6 parts by weight Surface conditioner 0
．． 5 parts by weight antifoaming agent 0.1 parts by weight chelating agent See Table 1 Prepare a 25% methyl ethyl ketone (MEK) solution with the above formulation and apply it on a glass epoxy substrate (FR-4) to a dry film thickness of 4.
It was coated to a thickness of 0μ and cured at 150°C for 2 hours. This was mixed with chromic acid (CrOa 100g/1
, conc H*SOn 300m/1) at 50
It was etched at 120°C for 10 minutes, electroless plated using Okuno Pharmaceutical's oPC Copper H semi-additive process, electroplated, and dried at 120°C for 2 hours.
このサンプルをエツチングによりラインアンドスペース
０．５Ｍのクシ形電極にし、プレッシャークツカーテス
ター中で１０５℃、１００ＲＨ％で電極間にＤＣｌｏｏ
Ｖを印加して８時間後にその電極間を顕微鏡で観察し、
マイグレーションによる回路の短絡の有無を確認した。This sample was etched into a comb-shaped electrode with a line and space of 0.5M, and a DCloo was placed between the electrodes at 105°C and 100RH% in a pressure shoe tester.
8 hours after applying V, the area between the electrodes was observed with a microscope,
We checked for short circuits caused by migration.
実施例８
実施例１と同様にエツチングまでしたサンプルを奥野製
薬の無電解メッキ前処理システムにより活性化まで行い
、乾燥後、吉川化工製アディティブ法用メツキレシスト
Ｐ Ｐ Ｒ−１０２Ａをスクリーン印刷した後、親水化
して硫酸銅／水酸化ナトリウム／ホルマリン／ＥＤＴＡ
／ジピリジルよりなるｐＨ１３，７０℃の無電解メッキ
液にて３５μ銅を析出させラインアンドスペース０．５
鶴の櫛形電極を作りプレッシャークツカーテスター中で
同様のテストをしたがマイグレーションによる回路の短
絡は見られ無かった。Example 8 A sample that had been etched in the same manner as in Example 1 was activated using Okuno Pharmaceutical's electroless plating pretreatment system, dried, and screen printed with Metsuki Resyst P PR-102A manufactured by Yoshikawa Kako for additive methods. Hydrophilized with copper sulfate/sodium hydroxide/formalin/EDTA
/ dipyridyl pH 13, 70℃ electroless plating solution to deposit 35μ copper and line and space 0.5
I made a Tsuru comb-shaped electrode and conducted a similar test in a pressure comb tester, but no short circuits due to migration were observed.
比較例２
実施例８と同様のテストをコーティング剤中のキレート
剤を除いて行った。この結果、マイグレーションにより
回路の短絡が発生した。Comparative Example 2 A test similar to Example 8 was conducted except that the chelating agent in the coating agent was omitted. As a result, a short circuit occurred due to migration.
また、上記のようにメッキしたサンプルのビール強度、
ハンダ耐熱を測定した。この結果を下記表１に示す。In addition, the beer strength of the sample plated as above,
Solder heat resistance was measured. The results are shown in Table 1 below.
（本頁以下余白）
〔発明の効果〕
以上説明したように本発明によれば、アディティブ法メ
ッキ用コーティング材組成物にキレート剤を少量添加す
るだけで、基本特性に大きな影響を与えずに銅マイグレ
ーションだけを抑制することができる。(Margins below this page) [Effects of the Invention] As explained above, according to the present invention, by simply adding a small amount of a chelating agent to a coating material composition for additive plating, copper can be improved without significantly affecting the basic properties. Only migration can be suppressed.
Claims (1)
際して絶縁基板を被覆するのに用いるコーティング材組
成物であって、キレート化剤を０．１〜１０重量部含有
することを特徴とするメッキ用コーティング材組成物。A coating material composition for plating used to coat an insulating substrate when manufacturing a printed circuit board by an additive method, the coating material composition containing 0.1 to 10 parts by weight of a chelating agent. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61292537A JPS63146486A (en) | 1986-12-10 | 1986-12-10 | Coating material compound for plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61292537A JPS63146486A (en) | 1986-12-10 | 1986-12-10 | Coating material compound for plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63146486A true JPS63146486A (en) | 1988-06-18 |
Family
ID=17783071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61292537A Pending JPS63146486A (en) | 1986-12-10 | 1986-12-10 | Coating material compound for plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003098985A1 (en) * | 2002-05-17 | 2003-11-27 | Japan Science And Technology Corporation | Method for forming multilayer circuit structure and base having multilayer circuit structure |
| WO2003014236A3 (en) * | 2001-08-03 | 2003-11-27 | Henkel Kgaa | Binding agent component for surface coating agents with improved adhesive properties |
-
1986
- 1986-12-10 JP JP61292537A patent/JPS63146486A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003014236A3 (en) * | 2001-08-03 | 2003-11-27 | Henkel Kgaa | Binding agent component for surface coating agents with improved adhesive properties |
| WO2003098985A1 (en) * | 2002-05-17 | 2003-11-27 | Japan Science And Technology Corporation | Method for forming multilayer circuit structure and base having multilayer circuit structure |
| CN100435603C (en) * | 2002-05-17 | 2008-11-19 | 独立行政法人科学技术振兴机构 | Method for forming multilayer circuit structure and substrate having multilayer circuit structure |
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