JPS6314723U - - Google Patents
Info
- Publication number
- JPS6314723U JPS6314723U JP10820586U JP10820586U JPS6314723U JP S6314723 U JPS6314723 U JP S6314723U JP 10820586 U JP10820586 U JP 10820586U JP 10820586 U JP10820586 U JP 10820586U JP S6314723 U JPS6314723 U JP S6314723U
- Authority
- JP
- Japan
- Prior art keywords
- split ring
- locking
- ring body
- locking hole
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supports For Pipes And Cables (AREA)
- Mutual Connection Of Rods And Tubes (AREA)
Description
第１図は本考案の一実施例を示す立て樋取付金
具の斜視図、第２図はダブルロツクされた係止部
の断面図、第３図及び第４図は枢支部の２つの例
を示す分解斜視図、第５図は仮止め式取付金具の
使用例を示す平面図である。 １…割環体本体、２…割環体蓋体、３…係止鍔
、４…係止孔、５…小突片、６…小係止孔、１０
…枢支部、２０…立て樋。
具の斜視図、第２図はダブルロツクされた係止部
の断面図、第３図及び第４図は枢支部の２つの例
を示す分解斜視図、第５図は仮止め式取付金具の
使用例を示す平面図である。 １…割環体本体、２…割環体蓋体、３…係止鍔
、４…係止孔、５…小突片、６…小係止孔、１０
…枢支部、２０…立て樋。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 前後に相対応する２つの本体、蓋体からな
る割環体を、端部の枢支部を支点に開閉自在に結
合し、割環体本体の外面部中央に取付用支杆を設
けたものにおいて、割環体本体と割環体蓋体の係
止側となる端部に、一方には段状の係止鍔を、他
方にはこれに嵌入係止する係止孔を設けると共に
、係止孔の孔縁に小突片を内向きに突設し、対応
する係止鍔側に係止鍔と係止孔が嵌入係止した際
に前記小突片と係合する小係止孔を設けてダブル
ロツクするようにしてなることを特徴とする立て
樋、管等の取付金具。 (2) 前記割環体本体は半円部より大きい過半円
状に、又割環体蓋体は半円部より小さい円弧状に
夫々形成されている前記実用新案登録請求の範囲
第１項記載の立て樋、管等の取付金具。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10820586U JPH0431391Y2 (ja) | 1986-07-15 | 1986-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10820586U JPH0431391Y2 (ja) | 1986-07-15 | 1986-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6314723U true JPS6314723U (ja) | 1988-01-30 |
| JPH0431391Y2 JPH0431391Y2 (ja) | 1992-07-28 |
Family
ID=30985184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10820586U Expired JPH0431391Y2 (ja) | 1986-07-15 | 1986-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0431391Y2 (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
| US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
| US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
| US6998579B2 (en) | 2000-12-29 | 2006-02-14 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
| US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
| US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
| US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
| US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
| US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
| US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
| US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
| US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
| US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
| US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
| US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
| KR20060079144A (ko) | 2003-06-18 | 2006-07-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 배리어 물질의 원자층 증착 |
-
1986
- 1986-07-15 JP JP10820586U patent/JPH0431391Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0431391Y2 (ja) | 1992-07-28 |