JPS63149547U - - Google Patents
Info
- Publication number
- JPS63149547U JPS63149547U JP1987043097U JP4309787U JPS63149547U JP S63149547 U JPS63149547 U JP S63149547U JP 1987043097 U JP1987043097 U JP 1987043097U JP 4309787 U JP4309787 U JP 4309787U JP S63149547 U JPS63149547 U JP S63149547U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- heat dissipation
- electronic component
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043097U JPS63149547U (2) | 1987-03-24 | 1987-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043097U JPS63149547U (2) | 1987-03-24 | 1987-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149547U true JPS63149547U (2) | 1988-10-03 |
Family
ID=30859633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987043097U Pending JPS63149547U (2) | 1987-03-24 | 1987-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149547U (2) |
-
1987
- 1987-03-24 JP JP1987043097U patent/JPS63149547U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63149547U (2) | ||
| JPH0326105U (2) | ||
| JPH0252393U (2) | ||
| JPH0217854U (2) | ||
| JPH0227759U (2) | ||
| JPS6338368U (2) | ||
| JPS5993170U (ja) | フラツトパツケ−ジ型ｉｃの取付構造 | |
| JPS63124786U (2) | ||
| JPS62131449U (2) | ||
| JPS61186297U (2) | ||
| JPS62192693U (2) | ||
| JPH0180948U (2) | ||
| JPS61166543U (2) | ||
| JPS62157158U (2) | ||
| JPS6355469U (2) | ||
| JPS6439698U (2) | ||
| JPS625648U (2) | ||
| JPS6052629U (ja) | 混成集積回路装置 | |
| JPH02131395U (2) | ||
| JPS6439651U (2) | ||
| JPS6219797U (2) | ||
| JPS63197334U (2) | ||
| JPS5937742U (ja) | 放熱構造 | |
| JPS6196597U (2) | ||
| JPS60124094U (ja) | 印刷配線基板 |