JPS63149571U - - Google Patents
Info
- Publication number
- JPS63149571U JPS63149571U JP4174487U JP4174487U JPS63149571U JP S63149571 U JPS63149571 U JP S63149571U JP 4174487 U JP4174487 U JP 4174487U JP 4174487 U JP4174487 U JP 4174487U JP S63149571 U JPS63149571 U JP S63149571U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- effective shape
- land pattern
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のプリント配線板の
部分平面図、第２図はそのプリント配線板にフラ
ツトパツケージＩＣを半田付けした状態の平面図
、第３図は同側面図、第４図は別の例の窓を有す
るプリント配線板の平面図、第５図は従来のプリ
ント配線板の平面図、第６図はそのプリント配線
板のフラツトパツケージＩＣを半田付けした状態
の平面図、第７図は同側面図である。
FIG. 1 is a partial plan view of a printed wiring board according to an embodiment of the present invention, FIG. 2 is a plan view of a flat package IC soldered to the printed wiring board, FIG. 3 is a side view of the same, and FIG. Fig. 4 is a plan view of another example of a printed wiring board with a window, Fig. 5 is a plan view of a conventional printed wiring board, and Fig. 6 is a plan view of the printed wiring board with a flat package IC soldered to it. 7 are side views of the same.
Claims (1)
ンドパターンの実効形状を、上記ピンの立下り部
背面に対応する部分の面積を他よりも小さくした
形状としたことを特徴とするプリント配線板。 (2) 上記実効形状が、上記ランドパターンの一
部をレジストインクで塗布して残された窓により
形成されることを特徴とする実用新案登録請求の
範囲第１項記載のプリント配線板。 (3) 上記実効形状が、上記ランドパターンその
ものにより形成される形状であることを特徴とす
る実用新案登録請求の範囲第１項記載のプリント
配線板。 (4) 上記実効形状が、上記ピンの立下り部の背
面に対応する部分が三角又は半円形状であること
を特徴とする実用新案登録請求の範囲第１項乃至
第３項記載のプリント配線板。[Scope of Claim for Utility Model Registration] (1) The effective shape of the land pattern for pin connection of the flat package IC is such that the area of the portion corresponding to the back surface of the falling portion of the pin is smaller than that of the other portions. A printed wiring board featuring: (2) The printed wiring board according to claim 1, wherein the effective shape is formed by a window left after coating a part of the land pattern with resist ink. (3) The printed wiring board according to claim 1, wherein the effective shape is a shape formed by the land pattern itself. (4) The printed wiring according to claims 1 to 3 of the utility model registration claim, wherein the effective shape is such that a portion corresponding to the back surface of the falling portion of the pin is triangular or semicircular. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4174487U JPS63149571U (en) | 1987-03-20 | 1987-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4174487U JPS63149571U (en) | 1987-03-20 | 1987-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149571U true JPS63149571U (en) | 1988-10-03 |
Family
ID=30857020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4174487U Pending JPS63149571U (en) | 1987-03-20 | 1987-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149571U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284498A (en) * | 1989-04-26 | 1990-11-21 | Mitsubishi Electric Corp | Fixing method of electronic parts |
-
1987
- 1987-03-20 JP JP4174487U patent/JPS63149571U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284498A (en) * | 1989-04-26 | 1990-11-21 | Mitsubishi Electric Corp | Fixing method of electronic parts |