JPS63149865U - - Google Patents

Info

Publication number
JPS63149865U
JPS63149865U JP4369687U JP4369687U JPS63149865U JP S63149865 U JPS63149865 U JP S63149865U JP 4369687 U JP4369687 U JP 4369687U JP 4369687 U JP4369687 U JP 4369687U JP S63149865 U JPS63149865 U JP S63149865U
Authority
JP
Japan
Prior art keywords
series
surface mount
adhesive
mount components
depressions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4369687U
Other languages
English (en)
Other versions
JPH037317Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4369687U priority Critical patent/JPH037317Y2/ja
Priority to GB8803125A priority patent/GB2203676B/en
Priority to CA000558726A priority patent/CA1322271C/en
Priority to DE3805572A priority patent/DE3805572C2/de
Priority to FR8802304A priority patent/FR2611189A1/fr
Publication of JPS63149865U publication Critical patent/JPS63149865U/ja
Priority to US07/481,756 priority patent/US5089314A/en
Application granted granted Critical
Publication of JPH037317Y2 publication Critical patent/JPH037317Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る表面実装部品連の一例を
示す側断面図、第２図ａ〜ｃは同部品連の製造工
程を示す説明図、第３及び４図は同部品連で保持
可能な表面実装部品の別例を示す底面図、第５図
は本考案に係る表面実装部品連の変形例を示す側
断面図、第６図ａ〜ｄは第１図で示す部品連の電
子部品摘出工程を示す説明図である。 １，１：電子部品、２，２１，２２：キヤリア
テープ、２ａ，２ａ：窪み部、３，３：粘着剤。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) キヤリアテープのテープ面個所に比較的小
    さ窪み部を所定間隔毎に設け、その窪み部に基板
    仮止め用の粘着剤を収容すると共に、この粘着剤
    に付着させて電子部品をキヤリアテープに保持し
    てなることを特徴とする表面実装部品連。 (2) 上記窪み部が、軟質樹脂で形成したキヤリ
    アテープを半球形状に窪ませて付形されていると
    ころの実用新案登録請求の範囲第１項記載の表面
    実装部品連。 (3) 上記窪み部が、電子部品に付着する粘着剤
    の数に応じて一個または複数個設けられていると
    ころの実用新案登録請求の範囲第１項記載の表面
    実装部品連。 (4) 上記粘着剤が、加熱で粘着力を発生するシ
    リコン、アクリル系等の高分子材料でなるところ
    の実用新案登録請求の範囲第１項記載の表面実装
    部品連。
JP4369687U 1987-02-25 1987-03-25 Expired JPH037317Y2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP4369687U JPH037317Y2 (ja) 1987-03-25 1987-03-25
GB8803125A GB2203676B (en) 1987-02-25 1988-02-11 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
CA000558726A CA1322271C (en) 1987-02-25 1988-02-11 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
DE3805572A DE3805572C2 (de) 1987-02-25 1988-02-23 Trägerband für elektronische Bauelemente sowie Verfahren zum Herstellen einer Folge von elektronischen Bauelementen
FR8802304A FR2611189A1 (fr) 1987-02-25 1988-02-25 Bande de support pour elements de circuit electronique et procede de fabrication d'une serie d'elements de circuit electronique
US07/481,756 US5089314A (en) 1987-02-25 1990-02-15 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4369687U JPH037317Y2 (ja) 1987-03-25 1987-03-25

Publications (2)

Publication Number Publication Date
JPS63149865U true JPS63149865U (ja) 1988-10-03
JPH037317Y2 JPH037317Y2 (ja) 1991-02-22

Family

ID=30860798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4369687U Expired JPH037317Y2 (ja) 1987-02-25 1987-03-25

Country Status (1)

Country Link
JP (1) JPH037317Y2 (ja)

Also Published As

Publication number Publication date
JPH037317Y2 (ja) 1991-02-22

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