JPS63150158A - 端面研削盤切込み装置 - Google Patents

端面研削盤切込み装置

Info

Publication number
JPS63150158A
JPS63150158A JP61294351A JP29435186A JPS63150158A JP S63150158 A JPS63150158 A JP S63150158A JP 61294351 A JP61294351 A JP 61294351A JP 29435186 A JP29435186 A JP 29435186A JP S63150158 A JPS63150158 A JP S63150158A
Authority
JP
Japan
Prior art keywords
grinding
wafer
speed
motor
grindstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61294351A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329548B2 (2
Inventor
Katsunori Nishiguchi
勝規 西口
Takeshi Sekiguchi
剛 関口
Kazushige Miyoshi
見義　一兄
Kiyoshi Nishio
西尾　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Diamond Industrial Co Ltd
Sumitomo Electric Industries Ltd
Astemo Ltd
Original Assignee
Asahi Diamond Industrial Co Ltd
Nissin Kogyo Co Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Diamond Industrial Co Ltd, Nissin Kogyo Co Ltd, Sumitomo Electric Industries Ltd filed Critical Asahi Diamond Industrial Co Ltd
Priority to JP61294351A priority Critical patent/JPS63150158A/ja
Priority to DE8787118077T priority patent/DE3771857D1/de
Priority to EP87118077A priority patent/EP0272531B1/en
Priority to US07/129,487 priority patent/US5035087A/en
Priority to KR1019870013953A priority patent/KR960015957B1/ko
Priority to CA000553778A priority patent/CA1307116C/en
Publication of JPS63150158A publication Critical patent/JPS63150158A/ja
Publication of JPH0329548B2 publication Critical patent/JPH0329548B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP61294351A 1986-12-08 1986-12-10 端面研削盤切込み装置 Granted JPS63150158A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP61294351A JPS63150158A (ja) 1986-12-10 1986-12-10 端面研削盤切込み装置
DE8787118077T DE3771857D1 (de) 1986-12-08 1987-12-07 Flaechenschleifmaschine.
EP87118077A EP0272531B1 (en) 1986-12-08 1987-12-07 Surface grinding machine
US07/129,487 US5035087A (en) 1986-12-08 1987-12-07 Surface grinding machine
KR1019870013953A KR960015957B1 (ko) 1986-12-08 1987-12-08 표면 연삭기
CA000553778A CA1307116C (en) 1986-12-08 1987-12-08 Surface grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61294351A JPS63150158A (ja) 1986-12-10 1986-12-10 端面研削盤切込み装置

Publications (2)

Publication Number Publication Date
JPS63150158A true JPS63150158A (ja) 1988-06-22
JPH0329548B2 JPH0329548B2 (2) 1991-04-24

Family

ID=17806584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61294351A Granted JPS63150158A (ja) 1986-12-08 1986-12-10 端面研削盤切込み装置

Country Status (1)

Country Link
JP (1) JPS63150158A (2)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475858A (ja) * 1990-07-17 1992-03-10 Sano Fuji Koki Kk 光学ガラスの研摩装置
JP2001138219A (ja) * 1999-11-19 2001-05-22 Disco Abrasive Syst Ltd 研磨装置
WO2009107567A1 (ja) * 2008-02-27 2009-09-03 住友電気工業株式会社 窒化物半導体ウエハーの加工方法と窒化物半導体ウエハー及び窒化物半導体デバイスの製造方法並びに窒化物半導体デバイス
JP2009231833A (ja) * 2008-02-27 2009-10-08 Sumitomo Electric Ind Ltd 窒化物半導体ウエハ−
JP2010046743A (ja) * 2008-08-21 2010-03-04 Disco Abrasive Syst Ltd ウエーハの研削方法
JP2013126699A (ja) * 2011-12-19 2013-06-27 Disco Corp 研削方法
WO2014002624A1 (ja) * 2012-06-27 2014-01-03 コマツＮｔｃ株式会社 研削加工装置およびその制御方法
JP2017056516A (ja) * 2015-09-16 2017-03-23 光洋機械工業株式会社 ワークの平面研削方法及び平面研削盤

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54132893A (en) * 1978-04-04 1979-10-16 Inoue Japax Res Inc Polishing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54132893A (en) * 1978-04-04 1979-10-16 Inoue Japax Res Inc Polishing device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475858A (ja) * 1990-07-17 1992-03-10 Sano Fuji Koki Kk 光学ガラスの研摩装置
JP2001138219A (ja) * 1999-11-19 2001-05-22 Disco Abrasive Syst Ltd 研磨装置
US8101523B2 (en) 2008-02-27 2012-01-24 Sumitomo Electric Industries, Ltd. Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device
US8183669B2 (en) 2008-02-27 2012-05-22 Sumitomo Electric Industries, Ltd. Nitride semiconductor wafer having a chamfered edge
JP2009231814A (ja) * 2008-02-27 2009-10-08 Sumitomo Electric Ind Ltd 窒化物半導体ウエハ−加工方法
JP2010010705A (ja) * 2008-02-27 2010-01-14 Sumitomo Electric Ind Ltd 窒化物半導体ウエハー及び窒化物半導体デバイスの製造方法並びに窒化物半導体デバイス
JP2009231833A (ja) * 2008-02-27 2009-10-08 Sumitomo Electric Ind Ltd 窒化物半導体ウエハ−
US7872331B2 (en) 2008-02-27 2011-01-18 Sumitomo Electric Industries, Ltd. Nitride semiconductor wafer
WO2009107567A1 (ja) * 2008-02-27 2009-09-03 住友電気工業株式会社 窒化物半導体ウエハーの加工方法と窒化物半導体ウエハー及び窒化物半導体デバイスの製造方法並びに窒化物半導体デバイス
JP2010046743A (ja) * 2008-08-21 2010-03-04 Disco Abrasive Syst Ltd ウエーハの研削方法
JP2013126699A (ja) * 2011-12-19 2013-06-27 Disco Corp 研削方法
WO2014002624A1 (ja) * 2012-06-27 2014-01-03 コマツＮｔｃ株式会社 研削加工装置およびその制御方法
JP2014004672A (ja) * 2012-06-27 2014-01-16 Komatsu Ntc Ltd 研削加工装置およびその制御方法
JP2017056516A (ja) * 2015-09-16 2017-03-23 光洋機械工業株式会社 ワークの平面研削方法及び平面研削盤
KR20170033233A (ko) * 2015-09-16 2017-03-24 고요 기카이 고교 가부시키가이샤 워크의 평면 연삭 방법 및 평면 연삭반
CN106881639A (zh) * 2015-09-16 2017-06-23 光洋机械工业株式会社 工件的平面磨削方法和平面磨床

Also Published As

Publication number Publication date
JPH0329548B2 (2) 1991-04-24

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