JPS6315743B2 - - Google Patents
Info
- Publication number
- JPS6315743B2 JPS6315743B2 JP54148967A JP14896779A JPS6315743B2 JP S6315743 B2 JPS6315743 B2 JP S6315743B2 JP 54148967 A JP54148967 A JP 54148967A JP 14896779 A JP14896779 A JP 14896779A JP S6315743 B2 JPS6315743 B2 JP S6315743B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- frames
- lead frame
- foil
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14896779A JPS5671947A (en) | 1979-11-19 | 1979-11-19 | Foiling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14896779A JPS5671947A (en) | 1979-11-19 | 1979-11-19 | Foiling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5671947A JPS5671947A (en) | 1981-06-15 |
| JPS6315743B2 true JPS6315743B2 (2) | 1988-04-06 |
Family
ID=15464662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14896779A Granted JPS5671947A (en) | 1979-11-19 | 1979-11-19 | Foiling |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5671947A (2) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868943A (ja) * | 1981-10-20 | 1983-04-25 | Mitsubishi Electric Corp | ダイボンデイング用ろう材供給装置 |
| JPS5965532U (ja) * | 1982-10-23 | 1984-05-01 | 日本電気株式会社 | ソルダ−供給ユニツト |
| JPS6052028A (ja) * | 1983-09-01 | 1985-03-23 | Hitachi Chem Co Ltd | 半導体装置の製造法 |
| JP4954314B2 (ja) * | 2010-05-14 | 2012-06-13 | 本田技研工業株式会社 | フランジの締結構造 |
-
1979
- 1979-11-19 JP JP14896779A patent/JPS5671947A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5671947A (en) | 1981-06-15 |
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