JPS6316444U - - Google Patents

Info

Publication number: JPS6316444U
Authority: JP; Japan
Prior art keywords: conductive layer; resin plate; electronic circuit; circuit device; thicker
Prior art date: 1986-07-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1986110962U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-07-18

Filing date

1986-07-18

Publication date

1988-02-03

1986-07-18 Application filed filed Critical

1986-07-18 Priority to JP1986110962U priority Critical patent/JPS6316444U/ja

1988-02-03 Publication of JPS6316444U publication Critical patent/JPS6316444U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP1986110962U 1986-07-18 1986-07-18 Pending JPS6316444U (mo)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1986110962U JPS6316444U (mo)	1986-07-18	1986-07-18

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1986110962U JPS6316444U (mo)	1986-07-18	1986-07-18

Publications (1)

Publication Number	Publication Date
JPS6316444U true JPS6316444U (mo)	1988-02-03

Family

ID=30990446

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1986110962U Pending JPS6316444U (mo)	1986-07-18	1986-07-18

Country Status (1)

Country	Link
JP (1)	JPS6316444U (mo)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS498760A (mo) *	1972-05-24	1974-01-25

1986
- 1986-07-18 JP JP1986110962U patent/JPS6316444U/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS498760A (mo) *	1972-05-24	1974-01-25

Publication	Publication Date	Title
JPS6310552U (mo)	1988-01-23
JPS63121444U (mo)	1988-08-05
JPH0328742U (mo)	1991-03-22
JPS6316443U (mo)	1988-02-03
JPS635647U (mo)	1988-01-14
JPS63112354U (mo)	1988-07-19
JPS63188961U (mo)	1988-12-05
JPH0226261U (mo)	1990-02-21
JPH0270459U (mo)	1990-05-29
JPS59112953U (ja)	1984-07-30	外部リ−ドの取付構造
JPS635648U (mo)	1988-01-14
JPH0456374U (mo)	1992-05-14
JPS62145337U (mo)	1987-09-12
JPS62114772U (mo)	1987-07-21
JPS62188144U (mo)	1987-11-30
JPS63185250U (mo)	1988-11-29
JPS61102074U (mo)	1986-06-28
JPH03101529U (mo)	1991-10-23
JPH0446552U (mo)	1992-04-21
JPH0444706U (mo)	1992-04-16
JPS6172896U (mo)	1986-05-17
JPS6278751U (mo)	1987-05-20
JPS6285100U (mo)	1987-05-30
JPH0238743U (mo)	1990-03-15
JPS6387860U (mo)	1988-06-08