JPS6316676A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To accurately determine a sensor position with a simple work by providing a projection extended external rightward on a lead frame for fixedly supporting an optical semiconductor element, and disposing a hole for positioning at the projection. CONSTITUTION:Metal projections 4 are formed on the same metal plate as leads 3 on a lead frame 2 connected with the leads 3, and a hole for a supporting unit is opened substantially at the center of each projection 4. The position of the hole 1 is so determined as to fall the positional relationship between the hole 1 and a sensor 5' within a predetermined error range. In this case, an optical sensor 5 is fixedly supported to the lead frame, the sensor and the lead frame are wired with fine wirings, the sensor is then sealed with light transmission resin in a package structure, and a positioning hole is formed on the projection 4 of the frame to position the sensor within a predetermined error range with respect to the supporting unit merely by determining the position of the hole 1 by considering the positional relationship between the disposing position of the hole 1 and the sensor.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an optical semiconductor device, and particularly to an optical semiconductor device having a positioning member.

[Prior art]

Conventionally, when installing an optical sensor or the like on a supporting part such as a substrate, the placement position with respect to the supporting part is determined based on the end face a or b of the sensor package as shown in Fig. 1, and this method improves the positioning accuracy. There were drawbacks that made it worse.

There is also a known method of gluing glass or the like upward on the optical sensor package as shown in Figure 2, and positioning it using one side AB or BC of the glass, but this method is expensive. In addition, the glass must be adhered to the package with high precision, which increases the number of work steps and requires technical skill such as adhesion.

On the other hand, an optical sensor, etc. is used as a distance measurement sensor in the autofocus mechanism of a camera, and the function of the distance measurement sensor is to irradiate a subject image onto two groups of sensor pixels each consisting of a plurality of sensor pixels of the optical sensor. Since the sensor output of each sensor pixel in the group is detected and the imaging state is detected by comparing the outputs of the corresponding sensor pixels in each group, the light receiving position of the first sensor relative to the subject image, that is, the sensor installation position, is automatically determined. This is a factor that largely determines the accuracy of focus detection, and it is necessary to improve the accuracy of sensor installation.

〔the purpose〕

An object of the present invention is to provide a lead frame that fixedly supports an optical semiconductor element with a protrusion extending outwardly to the right, and to provide a positioning hole in the protrusion, thereby achieving an extremely simple structure and easily It is an object of the present invention to provide an optical semiconductor device that enables accurate positioning.

〔Example〕

FIG. 3 is a configuration diagram showing an embodiment of the present invention.

In the figure, 5 is an optical sensor (
(optical semiconductor device), 2 is a lead frame to which leads 3 are connected, and the lead frame 2 is provided with metal protrusions 4 on the same metal plate as the leads 3. A hole for a support device is provided approximately in the center of the metal protrusion 4 . The position of the hole 1 is determined so that the positional relationship between the hole 1 and the sensor 5 is within a certain error range.

In the above configuration, the optical sensor 5 is fixedly supported on the lead frame, and after wiring the optical sensor and the lead frame with a thin wire, the optical sensor is sealed with a light-transmitting resin, and the package configuration is completed. Since the positioning hole is provided on the metal protrusion 4 of the lead frame,
By simply determining the placement position of the hole 1 in consideration of the positional relationship with the sensor, the sensor can be placed with respect to the support device within a certain error range.

FIG. 4 is a configuration diagram showing an example in which a notch is provided in place of the positioning hole in one of the projections 4 in the embodiment of FIG. 3. With this configuration, after the package is attached to the support device through the hole 1, the lead frame 2 can be made to be rotatable about the hole 1 as the center of rotation, making it possible to make fine adjustments to the direction of rotation. The accuracy can be further improved compared to the embodiment shown in FIG.

In this case, use an eccentric screw for the notch 6.
The Rukoto.

5 and 6 are configuration diagrams showing an example in which a horizontally elongated or vertically elongated hole is used in place of the notch shown in FIG. 4.

〔effect〕

As explained in detail above, in the present invention, positioning is performed by providing the protrusions on the same metal as the lead frame, so there is no need to use a positioning structure that requires complicated processes as in the past, and costs can be reduced. It also becomes possible.

Furthermore, when adjusting the position using the positioning hole, it is a simple task of simply placing the positioning hole on a designated protrusion.
Another effect is that the sensor position can be determined with high precision.

Furthermore, when greater precision is required, it is possible to devise a positioning hole to determine the sensor position.

[Brief explanation of the drawing]

1 and 2 are configuration diagrams of an optical sensor for explaining the positioning operation of a conventional optical sensor, FIG. 3 is a configuration diagram showing a positioning configuration of an optical sensor according to the present invention, and FIG.
FIGS. 5 and 6 are configuration diagrams showing other embodiments of the present invention, respectively. 1-111 hole, 2-111 lead frame,
4-111 protrusion, 5-111 light sensor.

Claims (1)

[Claims] In an optical semiconductor device having a package structure in which an optical semiconductor element is fixedly supported on a lead frame, and the element and the lead frame are wire-bonded with an ultrafine metal wire, the optical semiconductor element is sealed using a light-transmitting resin. An optical semiconductor device characterized in that a protrusion extending outward from a package structure is provided, and a positioning hole is provided in the protrusion.