JPS6317280Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chuck device suitable for collectively chucking a plurality of rod-shaped members having lead wires led in both directions from a component body.

For electronic components such as diodes and resistors, as shown in Figure 1, lead wires 2 are connected in both directions from the component body 1.
There is one that derived a and 2b. This electronic component (rod-shaped member) 3 is solder-plated onto, for example, lead wires 2a and 2b to improve solderability.
It is desirable that the solder plating of the lead wires 2a and 2b can be performed on a plurality of electronic components at once.

However, the component body 1 has lead wires 2a, 2
The diameter is larger than that of the lead wire 2b, and the exterior material is often made of glass or resin.If you try to check multiple electronic components 3 at once, the position of the lead wire 2b will be affected by the component body 1, as shown in FIG. This caused problems such as lead wires 2b being bent, cracks occurring in the component body 1, and electronic components in the center falling off due to weakened chuck force.

This invention was proposed in view of the above problems.
To provide a chuck device that prevents a plurality of electronic components from bending leads, damaging component bodies, and preventing them from falling out.

The present invention will be explained below with reference to FIGS. 3 to 6. FIG. 3 shows an example of a plating device for lead wires of electronic components, where 4 is an endless conveyor, 5 is a cup that accommodates electronic components mounted at regular intervals on the conveyor 4, and 6 is a cup 5. The magnet 7 placed on the inner bottom is the first one attached to the cup 5 in the fixed position.
A supply device for supplying a predetermined quantity of electronic components 3 shown in the figure, 8 a solder tank that moves up and down below the conveyor 4;
9 is placed above the conveyor 4, moves forward a predetermined distance in the transport direction of the conveyor 4 in an erect state with its open end facing upward from a predetermined position, rotates, and directs its open end downward; retreat to the position of
This is an inverted cup that repeats this process, and its opening end 9a is formed into a substantially rectangular shape corresponding to the pressing body of the chuck device, which will be described later, as shown in FIG. 4, and its front wall 9b extends outward from the bottom toward the opening end 9a. Tapered portion 9c protruding to
is formed. Reference numeral 10 denotes a chuck device to which the present invention is applied, which is arranged so as to move up and down on the conveyor 4 from above the reversing cup 9 at a predetermined position. When this is shown in Figures 5 and 6, 11,1
Reference numeral 2 represents bases that face each other and move toward and away from each other; 13 and 14 represent rods that are supported on the bases 11 and 12 so that they can freely vibrate in the longitudinal direction; and 15 and 16 represent air cylinders, for example, that apply vibration to the rods 13 and 14. , 17 and 18 indicate a pair of pressing bodies which are fixed to the rods 13 and 14 and which press and hold the leads 2 of the electronic component 3 on opposing surfaces.

This operation will be explained below. First, when a predetermined number of parts 3 are supplied from the supply device 7 to the cup 5, the conveyor rotates in the direction of the arrow shown in the figure, and when the cup 5 comes above the solder bath 8, the solder bath 8 is raised and the cut 5 is
Solder one of the lead wires of the electronic component 3 exposed from the top. Then, when it reaches the initial position after soldering, the electronic component 3 is not supplied, but passes through and stops at the position a in front. At this time, the reversing cup 9 is located in an erect state above position b further in front of it. In position a the chuck device 10 is lowered.
At this time, the bases 11 and 12 are separated, and the pressing body 17,
18 is positioned on the side of the lead 2 of the component 3 protruding from the cup 5, the bases 11 and 12 are brought close to each other, and the pressing bodies 17 and 18 are pressed against the lead 2. At this time, the air cylinders 15 and 16 are operated to vibrate the rods 13 and 14 and the press bodies 17 and 18 to vibrate. In this way, the component 3 is transferred to the chuck device 10.
Click to raise it and remove it from cup 5. Then, the reversing cup 9 at position b is retreated to below the chuck device 10 at position a, and the bases 11, 1
2 are separated and the electronic component 3 is dropped into the inverted cup 9. Then, at the same time, the empty cup 5 of the conveyor 4 is sent from position a to position b, and at the same time, the reversing cup 9 is sent to position b, and the reversing cup 9 is reversed at position b, and the tapered portion 9c of the opening 9a
The electronic component 3 is housed in the cup 5. Then, this is sent to the upper part of the solder tank 8, and the other lead wire is soldered. Then, the electronic component 3 whose both lead wires have been soldered is taken out. These operations are performed continuously by intermittent feeding.

Here, when the chuck device 10 presses the lead 2 of the electronic component 3 with the pressing bodies 17, 17, it vibrates in the circumferential direction of the lead 2, so as shown in FIGS. 7 and 8, the component 3 Even if the pressure bodies 17 and 18 are densely packed,
The leads of the electronic components 3a, 3b, and 3c that come in contact with the press bodies 17, 18 rotate due to the vibration of the press body.
move in the direction of vibration. Here, the pressing bodies 17, 18
moves in the direction of the solid line arrow shown in FIG. The electronic component 3c that has come into contact with 17 is blocked from advancing by the electronic component in front. However, when the pressing bodies 17 and 18 move in the direction of the arrow shown in the figure, the electronic component 3c moves along the pressing bodies without any obstacles in front of it. During this time, the pressing body 1
Since the electronic components 7 and 18 are close to each other, the electronic components 3 can be aligned and checked as shown in FIG.

Therefore, the lead can be strongly pressed without bending the lead of the electronic component or cracking the component body, increasing the holding force and making it possible to check the electronic component reliably.

It should be noted that the present invention is not limited to the above-mentioned embodiment, and for example, instead of only vibrating both of the pressing bodies 17 and 18, one of them may be fixed and only the other vibrated. In addition, the period and amplitude of vibration may be determined as appropriate depending on the amount of the rod-shaped member and the shape of the component body, and it is not only possible to set the period and amplitude to a constant value, but also to change it depending on the proximity distance of the pressing body. good.

[Brief explanation of the drawing]

Figure 1 is a side view of a rod-shaped electronic component, Figure 2 is a drawing explaining a conventional chuck of a rod-shaped electronic component, and Figure 3 is a side view of a rod-shaped electronic component.
Figures to Figure 6 show an embodiment of the present invention.
Fig. 3 is a side view of the lead soldering device, Fig. 4 is a plan view of the inverted cup, Fig. 5 is a plan view of the chuck device, Fig. 6 is a front view of Fig. 5, and Figs. 7 to 9. shows a drawing explaining the chuck operation. 3... Rod-shaped member, 17, 18... Pressing body.

Claims (1)

[Scope of utility model registration request] A chuck device characterized in that a pair of pressing bodies are arranged substantially perpendicular to the axis of a rod-shaped member to be chucked so as to be able to approach and separate from each other, and at least one of the pressing bodies is vibrated in the circumferential direction of the rod-shaped member when approaching.