JPS63177045U - - Google Patents

Info

Publication number
JPS63177045U
JPS63177045U JP1987066674U JP6667487U JPS63177045U JP S63177045 U JPS63177045 U JP S63177045U JP 1987066674 U JP1987066674 U JP 1987066674U JP 6667487 U JP6667487 U JP 6667487U JP S63177045 U JPS63177045 U JP S63177045U
Authority
JP
Japan
Prior art keywords
flexible insulating
insulating film
bonding portion
lead bonding
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987066674U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987066674U priority Critical patent/JPS63177045U/ja
Priority to DE3852563T priority patent/DE3852563T2/de
Priority to EP88106849A priority patent/EP0289026B1/en
Publication of JPS63177045U publication Critical patent/JPS63177045U/ja
Priority to US07/463,486 priority patent/US5042919A/en
Priority to US07/483,312 priority patent/US5019201A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1987066674U 1987-05-01 1987-05-01 Pending JPS63177045U (2)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1987066674U JPS63177045U (2) 1987-05-01 1987-05-01
DE3852563T DE3852563T2 (de) 1987-05-01 1988-04-28 Verfahren zum Anschliessen eines externen Schaltkreises und Verpackungsstruktur.
EP88106849A EP0289026B1 (en) 1987-05-01 1988-04-28 External circuit connecting method and packaging structure
US07/463,486 US5042919A (en) 1987-05-01 1990-01-11 External-circuit connecting and packaging structure
US07/483,312 US5019201A (en) 1987-05-01 1990-02-21 External-circuit connecting method and packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987066674U JPS63177045U (2) 1987-05-01 1987-05-01

Publications (1)

Publication Number Publication Date
JPS63177045U true JPS63177045U (2) 1988-11-16

Family

ID=30904901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987066674U Pending JPS63177045U (2) 1987-05-01 1987-05-01

Country Status (1)

Country Link
JP (1) JPS63177045U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414233A (ja) * 1990-05-07 1992-01-20 Kaijo Corp ボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414233A (ja) * 1990-05-07 1992-01-20 Kaijo Corp ボンディング装置

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