JPS63180966U - - Google Patents
Info
- Publication number
- JPS63180966U JPS63180966U JP7212187U JP7212187U JPS63180966U JP S63180966 U JPS63180966 U JP S63180966U JP 7212187 U JP7212187 U JP 7212187U JP 7212187 U JP7212187 U JP 7212187U JP S63180966 U JPS63180966 U JP S63180966U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- substrate
- diameter
- utility
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に於ける平面図、第
２図は本考案の端子一例の斜視図、第３図は同じ
く端子装着に於ける部分拡大断面図、第４図は従
来例の平面図、第５図は同じく組立・構成の断面
図である。 １……基板、２……上面電極、４……端子、４
ａ……頭部。
２図は本考案の端子一例の斜視図、第３図は同じ
く端子装着に於ける部分拡大断面図、第４図は従
来例の平面図、第５図は同じく組立・構成の断面
図である。 １……基板、２……上面電極、４……端子、４
ａ……頭部。
Claims (1)
- 基板の両面電極同志を接続するスルーホールの
孔に、前記孔の直径より大きい頭部ランドを持つ
金属端子を挿入し固着して成る電子回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7212187U JPS63180966U (ja) | 1987-05-14 | 1987-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7212187U JPS63180966U (ja) | 1987-05-14 | 1987-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63180966U true JPS63180966U (ja) | 1988-11-22 |
Family
ID=30915295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7212187U Pending JPS63180966U (ja) | 1987-05-14 | 1987-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63180966U (ja) |
-
1987
- 1987-05-14 JP JP7212187U patent/JPS63180966U/ja active Pending